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STMicroelectronics TSV632AIDT
- Part No.:
- TSV632AIDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV632AIDT.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,022
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Product details
Overview
TSV632AIDT from STMicroelectronics is a dual rail-to-rail input/output operational amplifier optimized for ultra-low-power, low-voltage operation in battery-powered systems. It delivers 880 kHz gain-bandwidth product at 60 µA supply current per channel, 800 µV max input offset voltage (A-grade), 1 pA typical input bias current, and operates from 1.5 V to 5.5 V - enabling precision signal conditioning in portable medical sensors and handheld instrumentation.
For engineers reviewing the TSV632AIDT datasheet, TSV632AIDT pinout, TSV632AIDT application, or TSV632AIDT equivalent, key selection criteria include its rail-to-rail I/O swing at sub-2 V supply, shutdown current of 5 nA typ, EMI hardening up to 2.4 GHz, automotive qualification (AEC-Q100 Grade 1), and guaranteed stability with 100 pF capacitive loads.
Technical Context
The TSV632AIDT employs complementary PMOS/NMOS input stages to achieve rail-to-rail input common-mode range from (VCC–) – 0.1 V to (VCC+) + 0.1 V and rail-to-rail output swing within 35 mV of both rails under 10 kΩ load. Its internal current-starved architecture tightly controls quiescent current dispersion (±17 %), ensuring consistent GBP (min 730 kHz) and slew rate (min 0.25 V/µs) across process and temperature.
It integrates an active shutdown function controlled by a dedicated SHDN pin (VIH = 2 V min at VCC = 5 V), reducing total supply current to 5 nA typ while placing outputs in high-impedance state. Turn-on/turn-off times are specified at 200 ns and 20 ns respectively, supporting fast power-gating in duty-cycled sensor front-ends.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.5 V to 5.5 V - enables direct interface with Li-ion, coin-cell, and 3.3 V logic without LDO. |
| Quiescent Current / Channel | 60 µA typ at 5 V - supports >1-year battery life in always-on wearable sensors. |
| Gain Bandwidth Product | 880 kHz typ - sufficient for anti-aliasing filters and sensor amplification up to ~100 kHz. |
| Input Offset Voltage (A-grade) | 800 µV max - ensures <0.1% error in 12-bit ADC front-ends with 2.5 V reference. |
| Input Bias Current | 1 pA typ - preserves signal integrity in high-impedance pH/electrochemical sensor nodes. |
| EMI Rejection Ratio | 92 dB at 1.8 GHz - suppresses cellular/WiFi interference in compact PCB layouts. |
| Shutdown Current | 5 nA typ - reduces standby power by 12,000× vs active mode, critical for intermittent sensing. |
Pinout & Package
TSV632AIDT is housed in an SO8 (Small Outline 8-pin) package with exposed pad (ECOPACK® compliant). The package supports standard reflow profiles and provides thermal resistance RthJA = 125 °C/W.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting Input (Ch1) | High-impedance node accepting differential signals; rail-to-rail CM range supports single-supply biasing. |
| 2 | Non-inverting Input (Ch1) | Accepts reference or sensor signal; 1 pA bias current minimizes loading on high-Z sources. |
| 3 | Output (Ch1) | Rail-to-rail swing (≤35 mV from rails) drives ADC inputs or low-power analog switches directly. |
| 4 | VCC– (GND) | Power return path; decoupling capacitor (10 nF) must be placed adjacent to this pin. |
| 5 | Shutdown (SHDN) | Active-high control: ≥2 V enables op-amp; ≤0.8 V disables with 5 nA quiescent draw. |
| 6 | Non-inverting Input (Ch2) | Independent second channel input; identical specs enable dual-sensor or signal+reference paths. |
| 7 | Inverting Input (Ch2) | Matches Ch1 performance; allows matched differential pair implementation without external matching. |
| 8 | VCC+ | Positive supply rail; accepts 1.5–5.5 V; internal regulation ensures stable bias over voltage sag. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full dynamic range utilization in single-supply systems down to 1.5 V, eliminating level-shifting circuitry. |
| EMI-hardened architecture | Rejects RF interference up to 2.4 GHz (92 dB at 1.8 GHz), preventing corruption in wireless-adjacent medical devices. |
| Automotive-qualified (AEC-Q100 Grade 1) | Guaranteed operation from –40 °C to +125 °C ambient, suitable for engine bay or ADAS sensor modules. |
| Unity-gain stable with 100 pF load | Eliminates need for external compensation in buffer configurations, reducing BOM count and layout area. |
| Tight parameter distribution (±17 % ICC) | Ensures predictable system-level power budgeting and consistent AC performance across production lots. |
Applications
| Wearable Vital Sign Monitor | Portable Blood Glucose Meter |
|---|---|
|
Use Scenario: Amplifying weak, high-impedance signals from photodiode-based PPG or electrochemical glucose sensors powered by CR2032 coin cell. IC Role / Device Role / Timing Role: Dual-channel signal conditioner: Ch1 buffers reference electrode, Ch2 amplifies working electrode current with rail-to-rail output feeding 12-bit SAR ADC. Use Value: 1 pA input bias prevents sensor polarization drift; 60 µA/channel extends battery life beyond 18 months in continuous monitoring mode. |
Use Scenario: Low-power, single-supply front-end for amperometric glucose strip measurement in handheld diagnostic devices. IC Role / Device Role / Timing Role: Transimpedance amplifier (TIA) with shutdown control synchronized to strip insertion detection, minimizing idle current. Use Value: 5 nA shutdown current reduces average system power by >99.9% during standby; 800 µV max Vos ensures <±2 mg/dL accuracy at 100 mg/dL glucose. |
| Industrial Wireless Sensor Node | Automotive Cabin Air Quality Sensor |
|
Use Scenario: Signal conditioning for MEMS-based CO₂ or VOC sensors in battery-operated LoRaWAN nodes deployed in remote locations. IC Role / Device Role / Timing Role: Precision amplifier driving ADC during 10-second wake-up intervals; shutdown disabled between readings. Use Value: 880 kHz GBP supports fast settling for multi-sensor multiplexing; EMI hardening prevents false triggers near 2.4 GHz ISM band radios. |
Use Scenario: Analog front-end for NDIR-based CO and NO₂ detection modules mounted near HVAC ducts in automotive cabins. IC Role / Device Role / Timing Role: Dual-channel amplifier: one channel conditions thermopile output, the other buffers reference temperature sensor for compensation. Use Value: AEC-Q100 Grade 1 rating ensures reliability at 125 °C under-hood; rail-to-rail I/O accommodates wide temperature-induced baseline shifts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV632IST | Same core specs but in MiniSO10 package with extended pinout for separate VCC– and SHDN pins; no exposed pad. | Better thermal performance (RthJA = 113 °C/W) and layout flexibility for mixed-signal routing. | Select when board space permits larger footprint and independent ground/shutdown routing is preferred. |
| MCP6022-E/SN | Higher supply current (100 µA/ch), lower GBP (1 MHz), no shutdown, non-automotive qualified. | Limited to commercial-temp industrial or consumer use; lacks EMI hardening and AEC-Q100 compliance. | Choose only for cost-sensitive non-automotive designs where 5 nA shutdown and 125 °C operation are unnecessary. |
Compared with TSV632AIDT, TSV632IST offers superior thermal management and routing isolation but requires more PCB area, while MCP6022-E/SN sacrifices automotive reliability, ultra-low power, and EMI robustness for marginal cost reduction in benign environments.
Availability
TSV632AIDT is available at Aetrix Electronics and suitable for battery-powered medical wearables, portable diagnostic instruments, and automotive cabin air quality sensors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TSV632AIDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management, and automotive-grade components.
The TSV63x series belongs to ST's precision low-power op-amp product line, engineered specifically for energy-constrained, high-reliability applications in medical, portable, and automotive domains where rail-to-rail operation and EMI resilience are mandatory.
FAQ
What is the maximum capacitive load the TSV632AIDT can drive without external compensation?
The TSV632AIDT is unity-gain stable with up to 100 pF capacitive load at the output, as verified in the datasheet (Table 4, GBP test condition). Driving larger loads (e.g., >200 pF) requires an in-series resistor (typically 10–100 Ω, per Figure 22) to maintain phase margin above 45° and prevent oscillation in buffer configurations.
Does the TSV632AIDT require external passive components for basic operation?
No external passive components are required for basic operation: decoupling capacitors (10 nF ceramic) must be placed near VCC+ and VCC– pins per Section 4.7, but no compensation network, pull-up/down resistors, or biasing networks are needed for standard inverting/non-inverting configurations due to rail-to-rail I/O and internal stability optimization.
How does the shutdown function affect output state and leakage?
When SHDN is pulled low (≤0.8 V at VCC = 5 V), both amplifier outputs enter high-impedance state with ≤1 nA leakage current (Table 8, IOLeak), isolating downstream circuitry. Output voltage is undefined and must not be loaded; external pull-downs or clamps may be added if bus contention is a concern in multi-device systems.
Is the TSV632AIDT pin-compatible with other dual op-amps in SO8 packages?
No - the TSV632AIDT uses a non-standard SO8 pinout: Pin 5 is SHDN (not NC or VCC–), and VCC– is on Pin 4. It is not pin-compatible with industry-standard dual op-amps like LM358 or MCP6022. Layout redesign is required when substituting; refer to Figure 1 and Table 1 for exact pin mapping.
TSV632AIDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.34V/µs
- Gain Bandwidth Product:
- 880 kHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 800 µV
- Current - Supply:
- 50µA (x2 Channels)
- Current - Output / Channel:
- 74 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV632AIDT FAQ
1.How can I place an order for TSV632AIDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV632AIDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV632AIDT reliable?
The price and inventory of TSV632AIDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV632AIDT is usually 5 days.
3.What payment methods are accepted for TSV632AIDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV632AIDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV632AIDT?
TSV632AIDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV632AIDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV632AIDT?
For technical support, including TSV632AIDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV632AIDT requirements.
6.How does Aetrix verify that TSV632AIDT is sourced from the original manufacturer or authorized distributors?
All TSV632AIDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV632AIDT meets industry standards.
7.What is the process for return or replacement of TSV632AIDT?
All TSV632AIDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV632AIDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV632AIDT part is unused and in its original packaging.
Return procedure for TSV632AIDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV632AIDT Tags
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LM358DT
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