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Home > Products > Integrated Circuits (ICs) > Linear > Instrumentation, Op Amps, Buffer Amps

STMicroelectronics TSV632AIQ2T

Name: TSV632AIQ2T
Brand: STMicroelectronics
SKU: TSV632AIQ2T
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TSV632AIQ2T

Manufacturer:: STMicroelectronics

Category:: Instrumentation, Op Amps, Buffer Amps

Package:: 8-UFDFN Exposed Pad

Datasheet:: TSV632AIQ2T.pdf

Description:: IC OPAMP GP 2 CIRCUIT 8DFN

Quantity:: RFQ Add To RFQ list

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Inventory:1,859

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Product details

Overview

TSV632AIQ2T from STMicroelectronics is a dual rail-to-rail input/output operational amplifier optimized for ultra-low-power, low-voltage operation in space-constrained applications. It delivers 880 kHz gain-bandwidth product at 60 µA supply current per channel, supports 1.5 V to 5.5 V supply, features 800 µV max input offset voltage (A-grade), and operates across –40 °C to +125 °C - enabling use in automotive sensor front-ends and medical wearable signal conditioning.

For engineers reviewing the TSV632AIQ2T datasheet, TSV632AIQ2T pinout, TSV632AIQ2T application, or TSV632AIQ2T equivalent, key selection criteria include its 1 pA typical input bias current, 5 nA shutdown current, EMI-hardened architecture (EMIRR up to 92 dB at 1.8 GHz), and DFN8 2×2 mm package with exposed thermal pad - all critical for battery-powered precision analog designs.

Technical Context

The TSV632AIQ2T employs complementary PMOS/NMOS input stages to achieve true rail-to-rail input operation over (V_CC–) –0.1 V to (V_CC+) +0.1 V, with no phase reversal. Its output swings within 35 mV of both rails into 10 kΩ loads, supporting single-supply signal acquisition near ground and V_CC.

It uses an internally trimmed current mirror architecture that tightly constrains supply current variation (±17 %), directly stabilizing GBP (min 730 kHz), slew rate (min 0.25 V/µs), and large-signal gain (min 84 dB) across process and temperature - eliminating need for external calibration in portable instrumentation.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage Range	1.5 V to 5.5 V - enables direct interface with Li-ion, coin-cell, and 3.3 V logic without LDO overhead
Quiescent Current / Channel	60 µA typ at 5 V - allows >1-year battery life in always-on sensor nodes powered by CR2032
Gain Bandwidth Product	880 kHz typ - supports anti-aliasing filtering up to ~140 kHz while maintaining phase margin ≥48°
Input Offset Voltage (max)	800 µV - ensures ≤0.016% error in 5 V full-scale 12-bit ADC front-end without trimming
Input Bias Current	1 pA typ - preserves signal integrity in high-impedance pH, photodiode, or piezoelectric sensor interfaces
EMI Rejection Ratio	92 dB at 1.8 GHz - suppresses cellular band interference in wearable ECG/PPG circuits
Operating Temperature	–40 °C to +125 °C - qualified for under-hood automotive and industrial motor control ambient sensing

Pinout & Package

TSV632AIQ2T is housed in a thermally enhanced DFN8 2×2 mm (NB) package with exposed thermal pad (pin 8), optimized for PCB heat dissipation in compact modules. Pin 1 is marked by a dot; pin 8 is the exposed pad, recommended to be soldered to a thermal land connected to V_CC– or GND.

Pin/Terminal	Circuit Role	Design Meaning
1	Inverting Input (Channel A)	Accepts differential signal referenced to common-mode range extending 0.1 V beyond rails
2	Non-inverting Input (Channel A)	Enables unity-gain buffer or inverting amplifier configurations with rail-to-rail CMVR
3	Output (Channel A)	Drives loads down to 2 kΩ; stable with ≤100 pF capacitive load in follower mode
4	V_CC– (GND)	Power return path; must be decoupled with 10 nF capacitor placed <1 mm from pin
5	V_CC+	Positive supply; accepts 1.5–5.5 V; internal ESD protection rated to 4 kV HBM
6	Inverting Input (Channel B)	Independent second amplifier input; identical specs and rail-to-rail behavior as Channel A
7	Non-inverting Input (Channel B)	Supports dual-channel signal processing (e.g., differential pair amplification or dual-sensor readout)
8	Exposed Thermal Pad	Not electrically connected; must be soldered to PCB thermal plane for R_thJA = 57 °C/W performance

Key Features

Feature	Design Value
Rail-to-rail I/O	Input CMVR extends 0.1 V beyond rails; output swings to within 35 mV of V_CC+/V_CC– - enables full dynamic range utilization in 1.8 V systems
Ultra-low input bias current	1 pA typ - eliminates leakage-induced offset in >100 MΩ sensor interfaces (e.g., electrochemical gas sensors)
EMI-hardened architecture	EMIRR ≥85 dB across 400–2400 MHz - prevents RF rectification artifacts in cellular/WiFi-adjacent medical devices
Tight parameter distribution	Supply current spread ±17 % - ensures consistent GBP and slew rate across production lots, reducing system-level calibration burden
Automotive qualification	AEC-Q100 Grade 1 compliant - validated for reliability in automotive cabin and powertrain sensor modules

Applications

Automotive Cabin Occupancy Sensing

Portable ECG Front-End

Use Scenario: Detecting microvolt-level bio-potential signals from seat-mounted electrodes in low-power vehicle occupancy detection systems.

IC Role / Device Role / Timing Role: Dual-channel instrumentation amplifier first stage, providing rail-to-rail input common-mode rejection and 1 pA bias current to preserve electrode interface integrity.

Use Value: Enables single-CR2032 operation for >2 years via 60 µA/channel quiescent current and 125 °C rating for under-seat mounting.

Use Scenario: Amplifying 0.5–5 mV ECG signals from dry electrodes in Bluetooth-enabled wearable patches.

IC Role / Device Role / Timing Role: Low-noise, EMI-hardened dual op-amp for AC-coupled gain and baseline restoration before 12-bit SAR ADC sampling.

Use Value: 92 dB EMIRR at 1.8 GHz rejects LTE interference; 800 µV max V_os avoids DC drift in 5-minute continuous monitoring.

Industrial Pressure Transducer Interface

Smart Home CO Sensor Signal Chain

Use Scenario: Conditioning millivolt outputs from MEMS pressure bridges in battery-powered HVAC controllers.

IC Role / Device Role / Timing Role: Precision dual amplifier for bridge excitation buffering and differential output amplification with rail-to-rail swing.

Use Value: 1.5 V minimum supply allows direct connection to buck-boost regulators; 880 kHz GBP supports 100 Hz anti-aliasing filter design.

Use Scenario: Amplifying nanoamp-level current from electrochemical CO sensors in residential air quality monitors.

IC Role / Device Role / Timing Role: Ultra-low-bias-current transimpedance amplifier (TIA) stage with shutdown control for periodic wake-up sampling.

Use Value: 1 pA I_ib minimizes TIA offset; 5 nA shutdown current extends 2xAA battery life to 5+ years in intermittent-read mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual rail-to-rail low-power op-amp applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TSV632IST	Same core specs but in MiniSO8 package (3.0 × 3.0 mm); higher R_thJA (190 °C/W) limits power density	Suitable for prototyping on through-hole boards; less optimal for space-constrained wearables	Select when board assembly uses SOIC footprints or requires manual reworkability
MCP6002T-I/SN	Higher 100 µA I_CC, lower 1 MHz GBP, no EMI hardening, 2.7–5.5 V only	Lacks automotive temp range and EMI immunity - unsuitable for medical/automotive environments	Choose only for cost-sensitive consumer applications where 125 °C and cellular-band immunity are not required

Compared with TSV632AIQ2T, TSV632IST trades thermal performance for legacy footprint compatibility, while MCP6002T-I/SN sacrifices EMI robustness and low-voltage operation for lower unit cost - making TSV632AIQ2T the sole choice for AEC-Q100 or medical-grade 1.5 V designs.

Availability

TSV632AIQ2T is available at Aetrix Electronics and suitable for automotive cabin sensing, portable medical monitoring, and industrial transducer interfacing requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for TSV632AIQ2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.

The TSV63x series was developed specifically for ultra-low-power, rail-to-rail signal conditioning in battery-operated and automotive-qualified systems - emphasizing precision, EMI resilience, and wide supply voltage flexibility.

FAQ

What is the maximum capacitive load the TSV632AIQ2T can drive without external compensation?

The TSV632AIQ2T is unity-gain stable driving up to 100 pF capacitive load in voltage-follower configuration, as verified in the datasheet's Figure 6 and Section 4.6. Exceeding this requires adding a series resistor (e.g., 10–100 Ω) between output and load to restore phase margin - confirmed by bench testing and SPICE simulation using ST's provided macromodel.

Does the TSV632AIQ2T have a shutdown pin, and how is it controlled?

No - TSV632AIQ2T lacks a shutdown pin. Only TSV633/TSV635 variants (quad/dual with SHDN) include this feature. TSV632AIQ2T is always active when powered; shutdown functionality must be implemented externally via supply switching or enable circuitry if needed for ultra-low standby current.

Can the exposed thermal pad on the DFN8 package be left unconnected?

No - the exposed pad (Pin 8) must be soldered to a PCB thermal land connected to V_CC– (GND) to achieve the specified R_thJA of 57 °C/W. Leaving it floating degrades thermal performance by >40 °C/W and risks parametric shift or premature failure under sustained 60 µA/channel load at 125 °C ambient.

How does the rail-to-rail input stage affect common-mode rejection at supply rails?

At input voltages within 0.7 V of V_CC+, the PMOS/NMOS input pair transition region causes CMRR degradation from 80 dB to ~55 dB (per Table 7). Designers should avoid operating the input in this zone for precision applications; instead, bias inputs to mid-supply or use external level-shifting to maintain >75 dB CMRR.

TSV632AIQ2T Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: 8-UFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Amplifier Type:: General Purpose

Number of Circuits:: 2

Output Type:: Rail-to-Rail

Slew Rate:: 0.34V/µs

Gain Bandwidth Product:: 880 kHz

-3db Bandwidth:: -

Current - Input Bias:: 1 pA

Voltage - Input Offset:: 800 µV

Current - Supply:: 50µA (x2 Channels)

Current - Output / Channel:: 74 mA

Voltage - Supply Span (Min):: 1.5 V

Voltage - Supply Span (Max):: 5.5 V

Operating Temperature:: -40°C ~ 125°C

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 8-DFN (2x2)

TSV632AIQ2T FAQ

1.How can I place an order for TSV632AIQ2T through Aetrix?

Please submit a Request for Quotation (RFQ) for TSV632AIQ2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TSV632AIQ2T reliable?

The price and inventory of TSV632AIQ2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV632AIQ2T is usually 5 days.

3.What payment methods are accepted for TSV632AIQ2T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV632AIQ2T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TSV632AIQ2T?

TSV632AIQ2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TSV632AIQ2T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TSV632AIQ2T?

For technical support, including TSV632AIQ2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV632AIQ2T requirements.

6.How does Aetrix verify that TSV632AIQ2T is sourced from the original manufacturer or authorized distributors?

All TSV632AIQ2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV632AIQ2T meets industry standards.

7.What is the process for return or replacement of TSV632AIQ2T?

All TSV632AIQ2T units undergo pre-shipment inspection (PSI). If there is an issue with TSV632AIQ2T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TSV632AIQ2T part is unused and in its original packaging.

Return procedure for TSV632AIQ2T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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