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STMicroelectronics TSV632IQ2T
- Part No.:
- TSV632IQ2T
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-UFDFN Exposed Pad
- Datasheet:
-
TSV632IQ2T.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 8DFN
- Quantity:
- Payment:
- Shipping:
Inventory:5,181
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Product details
Overview
TSV632IQ2T from STMicroelectronics is a dual rail-to-rail input/output operational amplifier optimized for ultra-low-power, low-voltage operation (1.5 V to 5.5 V), delivering 880 kHz gain-bandwidth product at just 60 µA per channel (typ. at 5 V), with 1 pA typical input bias current and 800 µV max offset voltage (A-grade). It targets precision sensor signal conditioning in space-constrained battery-powered systems.
For engineers reviewing the TSV632IQ2T datasheet, TSV632IQ2T pinout, TSV632IQ2T application, or TSV632IQ2T equivalent, key selection criteria include its shutdown-capable dual-channel architecture, EMI-hardened performance up to 2.4 GHz, rail-to-rail swing within 35 mV of rails (10 kΩ load), and guaranteed operation from –40 °C to +125 °C in automotive-qualified packaging.
Technical Context
The TSV632IQ2T employs complementary PMOS/NMOS input stages enabling true rail-to-rail input common-mode range (VCC– – 0.1 V to VCC+ + 0.1 V) without phase reversal, while its output stage delivers ±200 mV headroom under 10 kΩ load. Its internal current-source trimming ensures <±17% spread in supply current, directly stabilizing GBP (min 730 kHz), slew rate (min 0.25 V/µs), and large-signal gain (min 89 dB).
It integrates an EMI-hardened input structure achieving 92 dB EMIRR at 1.8 GHz and supports stable unity-gain operation with up to 100 pF capacitive load-no external compensation required. Shutdown control (SHDN pin) reduces total quiescent current to 5 nA (typ.) and places outputs in high-impedance state, with 200 ns turn-on and 20 ns turn-off times.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.5 V to 5.5 V - enables direct use with single-cell Li-ion, LiFePO₄, or 3.3 V/5 V logic rails without LDO. |
| Quiescent Current / Channel | 60 µA typ. at 5 V - allows >1-year battery life in always-on sensor nodes powered by CR2032 (225 mAh). |
| Gain Bandwidth Product | 880 kHz typ. - supports anti-aliasing filtering and sensor amplification up to ~100 kHz signals. |
| Input Bias Current | 1 pA typ. - minimizes voltage error in high-impedance pH, photodiode, or thermopile sensor interfaces. |
| Offset Voltage (A-grade) | 800 µV max - ensures ≤0.016% full-scale error in 5 V-span 12-bit ADC front-ends. |
| EMI Rejection Ratio | 92 dB at 1.8 GHz - suppresses cellular/WiFi interference in wearable medical or automotive cabin sensors. |
| Rail-to-Rail Output Swing | Within 35 mV of rails (10 kΩ load) - maximizes dynamic range when driving SAR ADCs or low-voltage comparators. |
Pinout & Package
TSV632IQ2T is housed in a 2 mm × 2 mm DFN8 (NB) package with exposed thermal pad, optimized for PCB area efficiency and thermal dissipation in compact portable designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN+ A) | Non-inverting input - Channel A | Accepts signals from VCC– – 0.1 V to VCC+ + 0.1 V; compatible with direct connection to resistive sensors. |
| 2 (IN– A) | Inverting input - Channel A | High-impedance node (1 pA bias); requires matched trace routing to minimize CMRR degradation. |
| 3 (OUT A) | Output - Channel A | Drives loads ≥2 kΩ; stable with ≤100 pF capacitance; enters high-Z state during shutdown. |
| 4 (VCC–) | Negative supply | Ground reference for single-supply operation; exposed pad must be soldered to PCB ground plane. |
| 5 (VCC+) | Positive supply | Accepts 1.5–5.5 V; requires local 10 nF decoupling capacitor placed <1 mm from pin. |
| 6 (SHDN) | Shutdown control | Active-low logic input; must be tied to VCC+ (enable) or VCC– (disable); floating prohibited. |
| 7 (IN– B) | Inverting input - Channel B | Independent second channel; identical specs to Channel A; enables differential or dual-sensor configurations. |
| 8 (IN+ B) | Non-inverting input - Channel B | Supports independent biasing; no crosstalk between channels verified per datasheet AC characterization. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full utilization of supply rails in single-supply systems, eliminating level-shifting circuitry for 0–5 V sensor outputs. |
| EMI-hardened architecture | Rejects 92 dB of 1.8 GHz RF interference - critical for reliable operation near Bluetooth/WiFi antennas in wearables. |
| Ultra-low input bias current (1 pA) | Reduces leakage-induced offset in high-Z transducer interfaces (e.g., piezoelectric accelerometers, glass pH electrodes). |
| Automotive-qualified (-40 °C to +125 °C) | Validated for under-hood and cabin applications per AEC-Q100; supports extended temperature stability of offset and GBP. |
| Shutdown mode (5 nA ICC) | Permits dynamic power gating in multi-sensor nodes, reducing system standby current by >99% versus active operation. |
Applications
| Medical Pulse Oximetry | Automotive Cabin Air Quality Sensor |
|---|---|
|
Use Scenario: Amplifying weak DC-coupled photodiode currents from red/IR LEDs in wearable SpO₂ monitors. IC Role / Device Role / Timing Role: Dual-channel transimpedance amplifier (TIA) with one channel for red LED signal and one for IR LED signal, operating at 1.8 V from coin cell. Use Value: 1 pA input bias prevents signal loss across 10 MΩ feedback resistors; rail-to-rail output drives 12-bit SAR ADC without clipping at 1.8 V full scale. |
Use Scenario: Conditioning analog output of NDIR CO₂ sensor in vehicle HVAC control module. IC Role / Device Role / Timing Role: Precision buffer and level shifter for 0–3 V sensor output prior to microcontroller ADC, operating across –40 °C to +125 °C ambient. Use Value: 800 µV max offset ensures <0.02% CO₂ concentration error; automotive qualification guarantees reliability over full vehicle lifetime. |
| Portable Gas Detector | Industrial Battery Management System |
|
Use Scenario: Amplifying electrochemical sensor output (nA-level currents) in handheld hazardous gas analyzers. IC Role / Device Role / Timing Role: Low-noise, low-drift instrumentation amplifier front-end with shutdown during sleep cycles. Use Value: 60 µA/channel current extends 2000 mAh LiPo battery life to >6 months in 1-min sampling interval; EMI hardening rejects RF noise from nearby radios. |
Use Scenario: Monitoring cell voltage and temperature in 12S Li-ion packs for cordless power tools. IC Role / Device Role / Timing Role: Dual-channel voltage monitor (cell tap + thermistor divider) with shutdown during pack idle state. Use Value: 1.5 V minimum supply allows operation down to deeply discharged cells; 35 mV output headroom ensures accurate 16-bit ADC readings at 2.5 V reference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV632IST | Same core specs but in MiniSO8 package (3 mm × 3 mm); higher RthJA (190 °C/W vs. 57 °C/W). | Better suited for prototyping on through-hole boards; less optimal for thermal-limited high-density layouts. | Select for hand-soldering or legacy footprint compatibility; avoid in thermally constrained sealed enclosures. |
| MCP6002T-I/SN | Lower GBP (1 MHz) and higher IQ (100 µA); no shutdown; non-automotive grade (–40 °C to +85 °C). | Limited to commercial-temperature consumer devices; lacks EMI hardening and automotive validation. | Choose only for cost-sensitive, non-automotive, non-EMI-critical applications where 1 MHz bandwidth suffices. |
Compared with TSV632IQ2T, TSV632IST trades thermal performance for assembly flexibility, while MCP6002T-I/SN sacrifices automotive qualification, EMI immunity, and shutdown capability for marginal cost reduction - making TSV632IQ2T the sole choice for ruggedized, battery-efficient, RF-noisy environments.
Availability
TSV632IQ2T is available at Aetrix Electronics and suitable for battery-powered medical wearables, automotive cabin sensors, portable gas detectors, and industrial battery management systems requiring stable component supply across extended temperature and EMI-prone environments.
Supply support for TSV632IQ2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The TSV63x series was developed specifically for ultra-low-power, rail-to-rail signal conditioning in space- and energy-constrained applications - emphasizing precision, EMI resilience, and extended temperature operation from a single 1.5 V supply.
FAQ
What is the maximum capacitive load the TSV632IQ2T can drive without external compensation?
The TSV632IQ2T is unity-gain stable with up to 100 pF capacitive load at its output, as verified in the datasheet's AC performance section. Driving larger capacitive loads (e.g., >150 pF) requires adding a series resistor (typically 10–100 Ω) between the output and load to maintain phase margin above 45°, confirmed via bench testing and SPICE simulation using ST's provided macromodel.
Does the TSV632IQ2T require external pull-up/pull-down on the SHDN pin?
Yes - the SHDN pin must never be left floating. It must be actively driven to VCC+ (to enable) or VCC– (to disable) using a microcontroller GPIO or dedicated logic signal. Internal pull-up/down is not integrated; leaving SHDN unconnected risks undefined operation, increased current consumption, or output instability per Section 4.4 of the datasheet.
How does the rail-to-rail input stage affect common-mode rejection at supply rails?
At input voltages within 0.7 V of VCC+, the TSV632IQ2T transitions between PMOS and NMOS input pairs, causing a temporary dip in CMRR (down to 53 dB min) and slight VIO shift - documented in Figures 16–17. For critical DC accuracy, keep common-mode inputs ≥0.7 V below VCC+; AC-coupled or buffered inputs mitigate this effect in high-gain stages.
Is the exposed thermal pad on the DFN8 package electrically connected?
No - the exposed pad on the TSV632IQ2T's DFN8 (NB) package is not internally connected to any die node. It must be soldered exclusively to the PCB's VCC– (ground) plane to maximize thermal dissipation (RthJA = 57 °C/W), as specified in Section 5.1. Connecting it to VCC+ or leaving it unconnected degrades thermal performance and risks exceeding junction temperature limits.
TSV632IQ2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-UFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.34V/µs
- Gain Bandwidth Product:
- 880 kHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 3 mV
- Current - Supply:
- 50µA (x2 Channels)
- Current - Output / Channel:
- 74 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (2x2)
TSV632IQ2T FAQ
1.How can I place an order for TSV632IQ2T through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV632IQ2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV632IQ2T reliable?
The price and inventory of TSV632IQ2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV632IQ2T is usually 5 days.
3.What payment methods are accepted for TSV632IQ2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV632IQ2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV632IQ2T?
TSV632IQ2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV632IQ2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV632IQ2T?
For technical support, including TSV632IQ2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV632IQ2T requirements.
6.How does Aetrix verify that TSV632IQ2T is sourced from the original manufacturer or authorized distributors?
All TSV632IQ2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV632IQ2T meets industry standards.
7.What is the process for return or replacement of TSV632IQ2T?
All TSV632IQ2T units undergo pre-shipment inspection (PSI). If there is an issue with TSV632IQ2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV632IQ2T part is unused and in its original packaging.
Return procedure for TSV632IQ2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV632IQ2T Tags
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LM358DT
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