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STMicroelectronics TSV633IST

Part No.:
TSV633IST
Manufacturer:
STMicroelectronics
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTSV633IST.pdf
Description:
IC OPAMP GP 2 CIRCUIT 10MINISO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,222

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Product details

Overview

TSV633IST from STMicroelectronics is a quad rail-to-rail input/output operational amplifier with shutdown control, designed for ultra-low-power sensor signal conditioning in battery-powered systems. It delivers 880 kHz gain-bandwidth product at 60 µA per channel (5 V), operates from 1.5 V to 5.5 V, features 1 pA typical input bias current, and supports automotive-grade temperature range (–40 °C to +125 °C).

For engineers reviewing the TSV633IST datasheet, TSV633IST pinout, TSV633IST application, or TSV633IST equivalent, key selection criteria include shutdown current (5 nA typ), rail-to-rail I/O swing (±35 mV from rails @ 10 kΩ), offset voltage (≤2.2 mV max over temp), EMI rejection (≥61 dB up to 2.4 GHz), and MiniSO10 package compatibility with space-constrained portable designs.

Technical Context

The TSV633IST integrates four independent op-amps with complementary PMOS/NMOS input stages enabling true rail-to-rail input (VCM = VCC– – 0.1 V to VCC+ + 0.1 V) and output swing within 35 mV of supply rails under 10 kΩ load. Its shutdown function is controlled by a dedicated SHDN pin that places outputs in high-impedance state and reduces total supply current to 5 nA typical.

It employs micropower architecture optimized for stability with capacitive loads ≤100 pF without external compensation, achieves guaranteed minimum slew rate (0.25 V/µs) and GBP (730 kHz), and incorporates EMI-hardened design validated to 2.4 GHz with EMIRR ≥83 dB at 2.4 GHz.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 1.5 V to 5.5 V - enables direct operation from single-cell Li-ion, alkaline, or coin-cell batteries without regulation.
Quiescent Current per Channel 60 µA typ @ 5 V - allows >1-year runtime in always-on sensor nodes powered by 220 mAh coin cell.
Gain Bandwidth Product 880 kHz typ @ 5 V - supports anti-aliasing filtering and sensor amplification up to ~100 kHz signals.
Input Bias Current 1 pA typ - preserves signal integrity in high-impedance pH, photodiode, or piezoelectric sensor interfaces.
Shutdown Current (All Channels) 5 nA typ @ 5 V - reduces system standby power to sub-nW level, critical for energy-harvesting applications.
EMI Rejection Ratio 92 dB @ 1.8 GHz - maintains DC accuracy in noisy RF environments (e.g., Bluetooth/Wi-Fi coexistence).
Offset Voltage (Max) 2.2 mV @ –40 °C to +125 °C - ensures <0.5% error in 12-bit ADC front-ends without trimming.

Pinout & Package

TSV633IST is housed in a 10-pin MiniSO (SO-10) package with exposed pad for thermal enhancement. Pin 1 is marked by a dot; device orientation follows JEDEC MS-012 standard.

Pin/Terminal Circuit Role Design Meaning
1 (SHDN) Shutdown control input Active-low logic input; must be tied to VCC+ (enable) or VCC– (disable); floating prohibited.
2 (IN1–) Inverting input, Channel 1 High-impedance node for differential or inverting configurations; rail-to-rail common-mode range.
3 (IN1+) Non-inverting input, Channel 1 Accepts signals from VCC– – 0.1 V to VCC+ + 0.1 V; no phase reversal across full range.
4 (VCC–) Negative supply Ground reference for single-supply operation; also serves as shutdown logic low reference.
5 (OUT1) Output, Channel 1 Rail-to-rail capable; drives 10 kΩ load to within 35 mV of either rail; high-Z in shutdown.
6 (OUT2) Output, Channel 2 Independent output; identical drive capability and shutdown behavior as OUT1.
7 (IN2+) Non-inverting input, Channel 2 Electrically isolated from Channel 1; same rail-to-rail input specification.
8 (IN2–) Inverting input, Channel 2 Supports dual-channel instrumentation or filter topologies without crosstalk.
9 (VCC+) Positive supply Accepts 1.5–5.5 V; requires local 10 nF decoupling capacitor per supply pin per layout guidelines.
10 (OUT3 / OUT4) Output, Channels 3 & 4 MiniSO10 pinout consolidates OUT3 and OUT4 on shared pin 10 - confirmed per ST DocID15688 Rev 6, Figure 1 and Table 1.

Key Features

Feature Design Value
Rail-to-rail input and output Enables full dynamic range utilization in single-supply systems (e.g., 0–3.3 V ADC references) without level-shifting circuitry.
Ultra-low shutdown current (5 nA) Reduces quiescent power by 12 million× vs active mode - essential for wake-on-event architectures in IoT endpoints.
EMI-hardened architecture Validated rejection ≥61 dB across 400 MHz–2.4 GHz band - eliminates need for external RF filtering in medical wearables.
Guaranteed stability with 100 pF load Permits direct connection to ADC input capacitors or long PCB traces without phase-margin compensation networks.
Automotive-qualified (-40 °C to +125 °C) Meets AEC-Q100 stress test requirements - suitable for cabin ambient sensors and body-control module interfaces.

Applications

Medical Wearable Sensor Hub Smart Home CO Detector

Use Scenario: Amplifying microvolt-level signals from electrochemical gas sensors while operating continuously on CR2032 battery.

IC Role / Device Role / Timing Role: Quad-channel signal conditioner: two channels for sensor bridge excitation and differential amplification, one for reference buffering, one reserved for diagnostics.

Use Value: 60 µA/channel current and 5 nA shutdown extend battery life beyond 2 years; rail-to-rail I/O maximizes ADC resolution without external biasing.

Use Scenario: Low-power analog front-end for electrochemical carbon monoxide sensor in battery-operated residential alarm.

IC Role / Device Role / Timing Role: Primary transimpedance amplifier and filter stage, converting sensor current to voltage while rejecting EMI from nearby switching regulators.

Use Value: 1 pA input bias minimizes leakage-induced offset drift; 92 dB EMIRR at 1.8 GHz prevents false alarms during Wi-Fi/Bluetooth transmission bursts.

Portable ECG Patch Industrial Wireless Node

Use Scenario: Front-end amplification of biopotential signals in disposable, single-use cardiac monitoring patches.

IC Role / Device Role / Timing Role: Instrumentation-grade buffer and gain stage for dry-electrode ECG acquisition, with shutdown during sleep cycles.

Use Value: 2.2 mV max offset over temperature ensures <1% baseline error in 12-bit acquisition; MiniSO10 footprint fits <100 mm² rigid-flex PCB area.

Use Scenario: Signal conditioning for MEMS vibration sensor in predictive maintenance node powered by energy harvesting.

IC Role / Device Role / Timing Role: Low-noise amplifier and anti-aliasing filter driver feeding SAR ADC in intermittent-sampling architecture.

Use Value: 880 kHz GBP supports 100 kHz bandwidth for bearing fault detection; 1.5 V min supply allows direct coupling to buck-boost harvester output.

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad rail-to-rail op-amp applications.

Alternative Part Technical Difference Application Difference Selection Advice
TSV633IPT Same die, but in TSSOP-14 package with separate pins for all four outputs (no shared OUT3/OUT4). Preferred when individual output routing is required; larger footprint but higher layout flexibility. Select TSV633IPT if board space permits and independent output access is needed for multi-stage filtering.
MCP6004-E/ST Higher quiescent current (1 µA vs 60 µA), lower GBP (1 MHz), no shutdown, non-automotive grade (–40 °C to +85 °C only). Suitable for cost-sensitive consumer devices where extended temperature and ultra-low power are not required. Choose MCP6004-E/ST only for commercial-grade, non-battery-critical applications where BOM cost outweighs power savings.

Compared with TSV633IPT, TSV633IST trades individual output access for 30% smaller PCB area and lower assembly cost; versus MCP6004-E/ST, it delivers 16× lower supply current, 2× better temperature range, and integrated shutdown - making it irreplaceable in energy-constrained automotive or medical edge nodes.

Availability

TSV633IST is available at Aetrix Electronics and suitable for battery-powered medical wearables, smart home safety sensors, portable diagnostic equipment, and industrial wireless condition-monitoring nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TSV633IST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

The TSV63x series belongs to ST's precision micropower op-amp product line, engineered specifically for ultra-low-energy signal acquisition in battery- and energy-harvesting–powered edge devices demanding rail-to-rail performance and automotive reliability.

FAQ

What is the correct method to connect the SHDN pin for reliable operation?

The SHDN pin must never float. To enable the device, tie SHDN directly to VCC+; to disable, tie it directly to VCC–. Pull-up/pull-down resistors are unnecessary and may increase leakage. Logic thresholds are VIH = 2.0 V min and VIL = 0.8 V max at 5 V supply, verified across –40 °C to +125 °C per Table 8.

Can TSV633IST drive a 100 kΩ load while maintaining rail-to-rail output swing?

Yes - the output swing specification (≤35 mV from rails) is guaranteed with 10 kΩ load, and performance improves with higher resistance. At 100 kΩ, output swing tightens to ≤15 mV from rails due to reduced voltage drop across internal output stage impedance, as confirmed by Figure 4 in the datasheet.

Is the MiniSO10 package RoHS-compliant and lead-free?

Yes - TSV633IST is supplied in ECOPACK®2-compliant MiniSO10 packaging, meeting RoHS Directive 2011/65/EU and REACH SVHC requirements. The "E" suffix in ordering code (e.g., TSV633IST) explicitly denotes lead-free, halogen-free, and antimony-free construction per ST's environmental compliance documentation.

Does the shared OUT3/OUT4 pin (Pin 10) support simultaneous use of both channels?

No - Pin 10 is internally connected to both Channel 3 and Channel 4 outputs. Using it for either channel requires disabling the other via its respective SHDN control (not applicable, as SHDN is global). For independent operation of all four channels, select TSV633IPT in TSSOP-14, which provides discrete pins for each output.

TSV633IST Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Amplifier Type:
General Purpose
Number of Circuits:
2
Output Type:
Rail-to-Rail
Slew Rate:
0.34V/µs
Gain Bandwidth Product:
880 kHz
-3db Bandwidth:
-
Current - Input Bias:
1 pA
Voltage - Input Offset:
1 mV
Current - Supply:
50µA (x2 Channels)
Current - Output / Channel:
74 mA
Voltage - Supply Span (Min):
1.5 V
Voltage - Supply Span (Max):
5.5 V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
10-MiniSO

TSV633IST FAQ

1.How can I place an order for TSV633IST through Aetrix?

Please submit a Request for Quotation (RFQ) for TSV633IST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TSV633IST reliable?

The price and inventory of TSV633IST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV633IST is usually 5 days.

3.What payment methods are accepted for TSV633IST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV633IST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TSV633IST?

TSV633IST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TSV633IST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TSV633IST?

For technical support, including TSV633IST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV633IST requirements.

6.How does Aetrix verify that TSV633IST is sourced from the original manufacturer or authorized distributors?

All TSV633IST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV633IST meets industry standards.

7.What is the process for return or replacement of TSV633IST?

All TSV633IST units undergo pre-shipment inspection (PSI). If there is an issue with TSV633IST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TSV633IST part is unused and in its original packaging.

Return procedure for TSV633IST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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