STMicroelectronics TSV634IQ4T

Overview

TSV634IQ4T from STMicroelectronics is a quad rail-to-rail input/output operational amplifier optimized for ultra-low-power, low-voltage operation (1.5 V to 5.5 V), delivering 880 kHz gain-bandwidth product at 60 µA per channel, 800 µV max input offset voltage (A-grade), and 1 pA typical input bias current - ideal for precision sensor signal conditioning in battery-constrained systems.

For engineers reviewing the TSV634IQ4T datasheet, TSV634IQ4T pinout, TSV634IQ4T application, or TSV634IQ4T equivalent, this device is selected for high-accuracy, low-quiescent-current analog front-ends in automotive cabin sensors, portable medical monitors, and industrial IoT node signal chains where rail-to-rail swing, EMI robustness (61–92 dB EMIRR), and shutdown capability are critical.

Technical Context

The TSV634IQ4T implements dual complementary PMOS/NMOS input stages enabling true rail-to-rail input (V_ICM = V_CC− − 0.1 V to V_CC+ + 0.1 V) and rail-to-rail output (±35 mV from rails into 10 kΩ). Its unity-gain stable architecture supports capacitive loads up to 100 pF without oscillation.

It features an integrated shutdown control (SHDN pin) that reduces total supply current to 5 nA typ while placing outputs in high-impedance state; turn-on/turn-off times are 200 ns and 20 ns respectively at 5 V. The device is qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C).

Key Specifications

Pinout & Package

TSV634IQ4T is housed in a 16-pin QFN package (3 mm × 3 mm, 0.5 mm pitch) with exposed thermal pad. Pin 1 marked by top-side dot; exposed pad soldered to PCB ground plane for thermal and EMI performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad rail-to-rail op-amp applications.

Compared with TSV634IYQT, the TSV634IQ4T offers identical performance at lower assembly verification cost; versus MCP6004-E/SL, it delivers 16× lower power, automotive qualification, and integrated shutdown - making it the sole choice for safety- or longevity-critical embedded systems.

Availability

TSV634IQ4T is available at Aetrix Electronics and suitable for automotive cabin sensing, portable medical diagnostics, and industrial wireless sensor networks requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for TSV634IQ4T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for automotive, industrial, and consumer markets.

The TSV63x series belongs to ST's precision low-power op-amp product line, engineered specifically for battery-operated, space-constrained, and EMI-hostile environments - emphasizing rail-to-rail operation, sub-100 µA quiescent current, and automotive-grade reliability.

FAQ

What is the maximum capacitive load the TSV634IQ4T can drive without external compensation?

The TSV634IQ4T is unity-gain stable and specified to drive up to 100 pF capacitive load directly at its output without oscillation or phase margin degradation. This is validated across supply voltages (1.5–5.5 V) and temperature (−40 °C to +125 °C). For loads exceeding 100 pF, a series resistor (10–100 Ω, per Figure 22 in the datasheet) must be added between the output and capacitance to maintain stability.

Does the SHDN pin require a pull-up resistor, and what happens if left floating?

Yes - the SHDN pin must never be left floating. It requires a defined logic level: pulled high (≥2.0 V at 5 V supply) to enable all four amplifiers, or pulled low (≤0.8 V) to enter shutdown. If floating, the internal state is undefined and may cause erratic output behavior or increased current draw. A 100 kΩ pull-up to V_CC+ is recommended for default-enable operation.

How does the rail-to-rail input architecture affect common-mode rejection near the supply rails?

The TSV634IQ4T uses complementary PMOS/NMOS input pairs, with transition occurring near V_CC+ − 0.7 V. Within ±100 mV of either rail, CMRR degrades from 80 dB (mid-rail) to ~55 dB due to reduced tail current in the active pair. Designers should avoid operating critical DC measurements in this 200 mV transition zone; AC-coupled or mid-rail-biased configurations preserve full CMRR performance.

Is the exposed thermal pad electrically connected, and how should it be handled on the PCB?

The exposed pad on the QFN16 package is internally connected to V_CC− (GND). It must be soldered to a solid PCB ground plane using ≥4 thermal vias (0.3 mm diameter) to ensure optimal thermal dissipation (R_thJA = 39 °C/W) and EMI suppression. Leaving it unconnected or floating compromises both junction temperature rise and RF immunity performance.