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STMicroelectronics TSV6392IST
- Part No.:
- TSV6392IST
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TSV6392IST.pdf
- Description:
- IC CMOS 2 CIRCUIT 8MINISO
- Quantity:
- Payment:
- Shipping:
Inventory:4,127
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Product details
Overview
TSV6392IST from STMicroelectronics is a dual rail-to-rail input/output micropower operational amplifier in SOT23-8 package, designed for ultra-low-power signal conditioning in battery-constrained systems. It delivers 2.4 MHz gain bandwidth at only 60 µA supply current (5 V), supports 1.5–5.5 V operation, and features 800 µV max offset voltage (A version), 1 pA typical input bias current, and 4 kV HBM ESD rating.
For engineers reviewing the TSV6392IST datasheet, TSV6392IST pinout, TSV6392IST application, or TSV6392IST equivalent, key selection considerations include its shutdown-capable dual-channel architecture, stability at gain ≥4 (non-inverting) or ≥11 (inverting), EMI-hardened performance up to 2.4 GHz, and guaranteed operation from –40 °C to 125 °C in portable medical and sensor interface designs.
Technical Context
The TSV6392IST employs complementary PMOS/NMOS input stages enabling true rail-to-rail input (VICM = VCC– – 0.1 V to VCC+ + 0.1 V) and rail-to-rail output (≤35 mV from rails into 10 kΩ). Its internal current-source compensation yields stable 2.4 MHz GBP with phase margin ≥60° at gain ≥4 (non-inverting) or ≥11 (inverting) under 100 pF load.
It integrates an active shutdown function (SHDN pin) that reduces supply current to 5 nA typ (5 V), places outputs in high-Z state, and achieves 200 ns turn-on/20 ns turn-off times. The device uses ST's micropower CMOS process with EMI rejection ratio (EMIRR) of 92 dB at 1.8 GHz and THD+N of 0.015% at 1 kHz (5 V, 1 VRMS).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.5 V to 5.5 V - enables direct use with single-cell Li-ion (3.0–3.7 V), alkaline (1.5 V), or regulated 3.3 V/5 V rails without level-shifting. |
| Quiescent Current per Channel | 60 µA typ at 5 V - allows >1-year battery life in coin-cell-powered devices drawing <10 µA average system current. |
| Gain Bandwidth Product | 2.4 MHz typ - supports 100 kHz closed-loop bandwidth at gain = 24, suitable for anti-aliasing and sensor signal amplification. |
| Input Offset Voltage (A version) | 800 µV max - ensures ≤0.8 mV error in 1 V full-scale sensor outputs, critical for precision medical front-ends. |
| Input Bias Current | 1 pA typ - minimizes voltage error across high-impedance pH or photodiode sensors (>1 GΩ source impedance). |
| EMI Rejection Ratio | 92 dB at 1.8 GHz - suppresses cellular band interference in wearable ECG/PPG modules without external filtering. |
| Operating Temperature | –40 °C to 125 °C - qualified for under-hood automotive cabin sensors and industrial IoT edge nodes. |
Pinout & Package
SOT23-8 package: 3 mm × 1.75 mm × 1.3 mm body, 0.65 mm lead pitch, surface-mount, RoHS-compliant ECOPACK2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting Input (Channel A) | Differential input node for Channel A; accepts common-mode voltage from VCC– – 0.1 V to VCC+ + 0.1 V. |
| 2 | Non-inverting Input (Channel A) | Differential input node for Channel A; same rail-to-rail common-mode range as Pin 1. |
| 3 | Output (Channel A) | Push-pull output capable of sourcing/sinking 40 mA (5 V), swings within 35 mV of rails into 10 kΩ. |
| 4 | VCC– (Ground) | Negative supply terminal; must be connected to system ground or negative rail; SHDN logic low reference. |
| 5 | Shutdown (SHDN) | Active-low enable control; pulls high (≥2 V at 5 V) to activate, pulls low (≤0.8 V) to enter 5 nA shutdown mode. |
| 6 | Non-inverting Input (Channel B) | Differential input node for Channel B; identical electrical characteristics and CMR to Pins 1–2. |
| 7 | Inverting Input (Channel B) | Differential input node for Channel B; electrically matched to Pin 6 for dual-channel common-mode rejection. |
| 8 | Output (Channel B) | Independent push-pull output for Channel B; shares same drive strength and rail-swing capability as Pin 3. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O | Enables full dynamic range utilization in single-supply 1.5–5.5 V systems, eliminating need for level-shifting or split supplies. |
| 60 µA per channel quiescent current | Reduces total system power by >50% vs. comparable 100+ µA op-amps, extending battery life in portable diagnostics. |
| 2.4 MHz GBP with gain ≥4 stability | Permits high-speed sensor signal amplification (e.g., piezoelectric vibration sensing) without external compensation networks. |
| EMI-hardened architecture | Integrates on-die filtering to reject RF interference from Bluetooth/Wi-Fi/4G bands, reducing PCB-level shielding requirements. |
| 4 kV HBM ESD rating | Eliminates need for external TVS diodes in handheld medical probes and field-deployable environmental sensors. |
Applications
| Portable ECG Monitor | Smart Smoke Detector |
|---|---|
|
Use Scenario: Amplifying microvolt-level biopotential signals from dry electrodes in a wrist-worn cardiac monitor powered by CR2032 coin cell. IC Role / Device Role / Timing Role: Dual-channel signal conditioner: Channel A buffers electrode input (high-Z), Channel B configures as 100× instrumentation amplifier stage with matched resistors. Use Value: 1 pA input bias current prevents electrode polarization drift; 60 µA/channel current enables >18-month battery life; rail-to-rail output drives ADC directly at 1.8 V. |
Use Scenario: Conditioning photoelectric chamber current in a battery-operated residential smoke alarm with 10-year lithium primary cell. IC Role / Device Role / Timing Role: Transimpedance amplifier converting photocurrent (100 pA–10 nA) to voltage, followed by low-pass filtering before MCU ADC sampling. Use Value: 800 µV max offset ensures <1% full-scale error over temperature; shutdown mode cuts standby current to <10 nA during sleep cycles. |
| Industrial Pressure Sensor Node | Wearable Pulse Oximeter |
|
Use Scenario: Signal conditioning for MEMS pressure sensor bridge output in a wireless IIoT node deployed in factory automation cabinets (–25 °C to 70 °C). IC Role / Device Role / Timing Role: Precision differential amplifier with 2.4 MHz GBP driving SAR ADC at 100 kSPS; operates from 3.3 V LDO. Use Value: 2 µV/°C offset drift minimizes calibration frequency; 125 °C max operating temp supports enclosure thermal margin; EMI hardening rejects motor-drive noise. |
Use Scenario: Dual-path analog front-end for red/IR LED photodiode signals in a clinical-grade fingertip SpO₂ sensor using AAA alkaline cells. IC Role / Device Role / Timing Role: Two independent transimpedance amplifiers (one per wavelength), each with programmable gain and synchronous shutdown during LED off periods. Use Value: 5 nA shutdown current extends battery runtime; rail-to-rail output interfaces directly with 12-bit ADC; 92 dB EMIRR rejects 2.4 GHz Wi-Fi interference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual micropower op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV6392AIST | Guaranteed 800 µV max VIO (vs. 3 mV for standard TSV6392); otherwise identical specs and pinout. | Better suited for precision DC-coupled sensor paths where offset error must be bounded across temperature. | Select when absolute offset budget <1 mV is required; same footprint and layout, no redesign needed. |
| MCP6022-E/SN | Higher 100 µA ICC, lower 1 MHz GBP, unity-gain stable, no shutdown pin. | Preferred for general-purpose low-speed buffering where shutdown and EMI immunity are not critical. | Choose only if design lacks SHDN control lines and can tolerate 67% higher supply current and reduced RF immunity. |
Compared with TSV6392IST, the TSV6392AIST offers tighter offset control for precision DC applications without trade-offs, while the MCP6022-E/SN sacrifices EMI resilience and micropower operation for broader gain stability-making it unsuitable for battery-powered RF-noisy environments.
Availability
TSV6392IST is available at Aetrix Electronics and suitable for portable medical devices, battery-powered smoke detectors, industrial sensor nodes, and wearable health monitors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TSV6392IST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
The TSV639x series belongs to ST's precision micropower op-amp product line, engineered specifically for ultra-low-power signal acquisition in energy-constrained, EMI-prone, and wide-temperature applications such as portable diagnostics and smart sensing.
FAQ
What is the minimum recommended gain for stable operation of TSV6392IST?
The TSV6392IST requires minimum closed-loop gain of 4 in non-inverting configuration or 11 in inverting configuration to ensure phase margin ≥60° with 100 pF capacitive load. This is due to its decompensated architecture optimized for 2.4 MHz GBP at 60 µA. Using lower gains risks oscillation unless external compensation (e.g., feedback capacitor) is added.
Can TSV6392IST operate from a 1.5 V supply?
Yes, TSV6392IST is fully specified down to 1.5 V supply voltage. Electrical characteristics-including 60 µA supply current, 2.4 MHz GBP, and rail-to-rail I/O-remain valid across 1.5–5.5 V. Performance curves in the datasheet (DS6635 Rev 4) confirm stable operation at 1.5 V, making it suitable for single alkaline or NiMH cell applications.
How does the shutdown function affect output state?
When SHDN is pulled low (≤0.8 V at 5 V), both amplifiers enter ultra-low-power mode (5 nA typ ICC), and their outputs transition to high-impedance (Hi-Z) state within 20 ns. This prevents loading of downstream circuitry and eliminates DC path errors. The SHDN pin must never float and should be tied to VCC– or VCC+ via pull-down/pull-up resistor.
Is TSV6392IST suitable for driving capacitive loads?
TSV6392IST is optimized for resistive loads ≥2 kΩ. Driving capacitive loads >100 pF directly may cause peaking or instability unless isolated with a series resistor (≥200 Ω) or compensated via feedback network. For purely capacitive loads (e.g., ADC input caps), use the recommended 10 nF decoupling on VCC and place the op-amp close to the load to minimize trace inductance.
TSV6392IST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 1.1V/µs
- Gain Bandwidth Product:
- 2.4 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 3 mV
- Current - Supply:
- 50µA
- Current - Output / Channel:
- 72 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MiniSO
TSV6392IST FAQ
1.How can I place an order for TSV6392IST through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV6392IST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV6392IST reliable?
The price and inventory of TSV6392IST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV6392IST is usually 5 days.
3.What payment methods are accepted for TSV6392IST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV6392IST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV6392IST?
TSV6392IST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV6392IST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV6392IST?
For technical support, including TSV6392IST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV6392IST requirements.
6.How does Aetrix verify that TSV6392IST is sourced from the original manufacturer or authorized distributors?
All TSV6392IST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV6392IST meets industry standards.
7.What is the process for return or replacement of TSV6392IST?
All TSV6392IST units undergo pre-shipment inspection (PSI). If there is an issue with TSV6392IST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV6392IST part is unused and in its original packaging.
Return procedure for TSV6392IST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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