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STMicroelectronics TSV711ICT
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- Part No.:
- TSV711ICT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 5-TSSOP, SC-70-5, SOT-353
- Datasheet:
-
TSV711ICT.pdf
- Description:
- IC OPAMP GP 1 CIRCUIT SC70-5
- Quantity:
- Payment:
- Shipping:
Inventory:11,940
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Product details
Overview
TSV711ICT from STMicroelectronics is a single-channel, rail-to-rail input/output CMOS operational amplifier optimized for ultra-low-power, high-accuracy signal conditioning in battery-powered systems. It delivers 200 µV max input offset voltage, 14 µA supply current at 5 V, 150 kHz gain bandwidth, 1.5–5.5 V supply range, and –40 to +125 °C operation - enabling precision sensor front-ends in portable medical devices.
For engineers reviewing the TSV711ICT datasheet, TSV711ICT pinout, TSV711ICT application, or TSV711ICT equivalent, key selection criteria include micropower consumption under 14 µA, guaranteed rail-to-rail I/O performance at 1.5 V, EMI-hardened architecture (EMIRR up to 63 dB at 2.4 GHz), and SC70-5 package compatibility with space-constrained PCB layouts.
Technical Context
The TSV711ICT employs ST's proprietary 5 V CMOS process with on-chip trimming to achieve <200 µV offset without external calibration. Its rail-to-rail input stage extends common-mode range to VCC±0.1 V, while the output drives within 40 mV of VCC and 75 mV of ground under 10 kΩ load.
It features EMI hardening verified per IEC 61000-4-3 (up to 2.4 GHz), 4 kV HBM ESD rating, and initialization logic that guarantees stable Vio and ICC within 5 ms at 25 °C - critical for power-gated sensor nodes requiring deterministic wake-up behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Offset Voltage | 200 µV max at 25 °C - enables <0.1% error in 2 mV full-scale sensor outputs without trimming |
| Supply Current | 14 µA typ. at 5 V - supports >10-year battery life in coin-cell-powered IoT endpoints |
| Gain Bandwidth Product | 150 kHz typ. - sufficient for DC–10 kHz biomedical signal amplification (ECG, pulse oximetry) |
| Supply Voltage Range | 1.5 V to 5.5 V - operates directly from single alkaline, Li-ion, or regulated 1.8/3.3 V rails |
| Input Bias Current | 1 pA typ. - preserves signal integrity in high-impedance pH or photodiode sensor interfaces |
| EMI Rejection Ratio | 63 dB at 2.4 GHz - suppresses Wi-Fi/Bluetooth interference in wireless wearable designs |
| Operating Temperature | –40 °C to +125 °C - qualified for automotive cabin and industrial sensor environments |
Pinout & Package
The TSV711ICT is housed in a 5-pin SC70 package (2.0 × 1.25 mm, 0.65 mm pitch), optimized for high-density portable PCBs. Pin 1 is marked by a dot; the package includes an exposed pad electrically unconnected and thermally non-critical.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting Input (–IN) | High-impedance node accepting differential signals; supports unity-gain stable configurations |
| 2 | Non-inverting Input (+IN) | Rail-to-rail common-mode range (VCC–0.1 V to VCC+0.1 V) enables direct connection to resistive sensor bridges |
| 3 | VCC– (Ground) | Reference return path; requires local 10 nF decoupling to minimize PSRR degradation |
| 4 | Output (OUT) | Rail-to-rail swing (within 40 mV of VCC, 75 mV of GND) drives ADC reference buffers or low-power comparators |
| 5 | VCC+ | Positive supply input; supports 1.5–5.5 V operation with <16 µA max ICC across full temperature range |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low input offset drift | 10 µV/°C max - limits thermal-induced error to <1.2 mV over –40 to +125 °C range |
| EMI-hardened architecture | 63 dB rejection at 2.4 GHz - eliminates RF rectification artifacts in Bluetooth LE sensor hubs |
| On-chip power-up initialization | 5 ms max delay at 25 °C - ensures predictable settling for time-triggered microcontroller wake-up sequences |
| Rail-to-rail I/O with low VOL/VOH | 40 mV low-level / 75 mV high-level output swing - maximizes dynamic range into 12-bit SAR ADCs |
| Extended temperature qualification | –40 to +125 °C operation with full spec compliance - suitable for under-hood automotive pressure sensors |
Applications
| Wearable ECG Monitor | Industrial Pressure Transmitter |
|---|---|
Use Scenario: Amplifying microvolt-level cardiac signals from dry electrodes in a wrist-worn device powered by CR2032 battery. IC Role / Device Role / Timing Role: First-stage instrumentation amplifier with DC-coupled rail-to-rail input, driving anti-aliasing filter before 12-bit ADC sampling at 250 Hz. Use Value: 200 µV offset and 1 pA bias current prevent baseline wander and electrode polarization errors; 14 µA ICC extends battery life beyond 18 months. | Use Scenario: Conditioning bridge output from MEMS pressure sensor in HVAC duct monitoring system operating at –25 to +85 °C ambient. IC Role / Device Role / Timing Role: Precision buffer and gain stage in 4–20 mA transmitter loop, interfacing to 3.3 V microcontroller ADC with 100 kHz GBP supporting fast step response. Use Value: 150 kHz GBP and rail-to-rail output ensure accurate 0–5 V scaling across full pressure range; 125 °C junction rating supports extended reliability at elevated temperatures. |
| Portable Glucose Meter | Automotive Cabin CO₂ Sensor |
Use Scenario: Amplifying amperometric current from electrochemical glucose test strip, powered by single AAA cell (1.5 V min). IC Role / Device Role / Timing Role: Transimpedance amplifier with programmable gain, operating down to 1.5 V supply with rail-to-rail input to capture full current range. Use Value: 1.5 V operation enables direct battery coupling without LDO; 200 µV offset ensures ±0.1 mM glucose accuracy without factory calibration. | Use Scenario: Signal conditioning for NDIR CO₂ detector mounted near vehicle dashboard, subject to EMI from infotainment RF emissions. IC Role / Device Role / Timing Role: Low-noise preamplifier for photodiode output, rejecting 2.4 GHz Wi-Fi noise before synchronous detection. Use Value: 63 dB EMIRR at 2.4 GHz prevents false CO₂ readings during Bluetooth streaming; 4 kV HBM rating withstands assembly ESD events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar micropower, rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV8511IDBVR | Lower 10 µA ICC but 900 µV Vio max; no EMI hardening; SC70-5 package | Acceptable for cost-sensitive consumer wearables where <0.5% accuracy suffices | Choose when ultra-low power dominates over offset accuracy and EMI immunity |
| MAX44260ASA+T | Higher 1.2 µA Iib; 100 µV Vio max; 175 kHz GBP; 8-pin SOIC only | Suitable for industrial PLC analog input modules needing higher drive strength | Choose when lower offset and higher speed justify larger package and higher current |
Compared with TLV8511IDBVR, TSV711ICT trades 4 µA higher ICC for 700 µV lower Vio and robust EMI rejection - critical for medical-grade signal fidelity. Against MAX44260ASA+T, it offers 5× lower Iib and SC70 packaging for miniaturized sensor nodes, albeit with reduced bandwidth.
Availability
TSV711ICT is available at Aetrix Electronics and suitable for battery-powered medical devices, portable instrumentation, industrial sensor transmitters, and automotive cabin environmental monitors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TSV711ICT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.
The TSV71x series was developed specifically for ultra-low-power, high-accuracy analog signal chains in energy-constrained, EMI-hostile environments - targeting medical wearables, smart sensors, and battery-operated industrial IoT endpoints.
FAQ
What is the maximum capacitive load the TSV711ICT can drive while maintaining stability?
The TSV711ICT is unity-gain stable and characterized to drive up to 100 pF capacitive load with 10 kΩ series resistance, as confirmed in Figure 13 of the datasheet. Driving larger loads requires isolation resistor or feedback capacitor compensation to avoid peaking or oscillation - typical for driving ADC input capacitance or long PCB traces.
Does the TSV711ICT require external offset nulling circuitry?
No. The TSV711ICT uses on-chip trimming to achieve ≤200 µV input offset voltage at 25 °C without external components. Its 10 µV/°C max drift and 0.7 µV/month long-term stability eliminate need for manual calibration or auto-zero circuitry in most portable and industrial applications.
Can the TSV711ICT operate reliably at 1.5 V supply with full rail-to-rail input capability?
Yes. The datasheet specifies full rail-to-rail input common-mode range (VCC–0.1 V to VCC+0.1 V) down to 1.5 V supply, verified in Section 4.2 and Table 2. At 1.5 V, input offset remains ≤1200 µV and supply current stays below 16 µA across –40 to +125 °C - enabling direct use with primary alkaline cells.
How does the initialization time affect system power sequencing?
The TSV711ICT enters a 5–60 ms initialization phase after power-up, during which supply current and offset voltage settle to final values. For microcontroller-based systems, this requires delaying ADC sampling or analog measurements until after tinit - documented in Table 6 and Section 4.6 - ensuring measurement repeatability across cold/warm starts.
TSV711ICT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 5-TSSOP, SC-70-5, SOT-353
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 1
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.06V/µs
- Gain Bandwidth Product:
- 150 kHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 200 µV
- Current - Supply:
- 10µA
- Current - Output / Channel:
- 56 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-70-5
TSV711ICT FAQ
1.How can I place an order for TSV711ICT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV711ICT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV711ICT reliable?
The price and inventory of TSV711ICT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV711ICT is usually 5 days.
3.What payment methods are accepted for TSV711ICT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV711ICT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV711ICT?
TSV711ICT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV711ICT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV711ICT?
For technical support, including TSV711ICT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV711ICT requirements.
6.How does Aetrix verify that TSV711ICT is sourced from the original manufacturer or authorized distributors?
All TSV711ICT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV711ICT meets industry standards.
7.What is the process for return or replacement of TSV711ICT?
All TSV711ICT units undergo pre-shipment inspection (PSI). If there is an issue with TSV711ICT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV711ICT part is unused and in its original packaging.
Return procedure for TSV711ICT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV711ICT Tags
-
LM358DT
STMicroelectronics
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LM358DR
Texas Instruments
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LM2904DR
Texas Instruments
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LM358ADR
Texas Instruments
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LM2904DGKR
Texas Instruments
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LM324DR
Texas Instruments
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MCP6006T-E/OT
Microchip Technology
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MCP6006UT-E/OT
Microchip Technology
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LM324PWR
Texas Instruments
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LM2902PWR
Texas Instruments
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LM2902DR
Texas Instruments
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LM358P
Texas Instruments
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