STMicroelectronics TSV732IQ2T

Overview

TSV732IQ2T from STMicroelectronics is a dual-channel, rail-to-rail input/output CMOS operational amplifier optimized for ultra-low-power, high-accuracy signal conditioning in battery-powered systems. It delivers 200 µV max input offset voltage, 60 µA supply current per channel at 5 V, and 900 kHz gain bandwidth product, operating from 1.5 V to 5.5 V supply - enabling precision sensing in portable medical devices and IoT sensor nodes.

For engineers reviewing the TSV732IQ2T datasheet, TSV732IQ2T pinout, TSV732IQ2T application, or TSV732IQ2T equivalent, key selection criteria include its guaranteed 200 µV offset at 25 °C, 1 pA typical input bias current, -40 °C to +125 °C extended temperature operation, EMI-hardened architecture, and dual-channel DFN8 2×2 mm package with exposed thermal pad.

Technical Context

The TSV732IQ2T employs ST's proprietary 5 V CMOS process to achieve micropower operation without sacrificing DC accuracy or AC performance. Its rail-to-rail input stage supports common-mode voltages from V_CC– – 0.1 V to V_CC+ + 0.1 V, while the output swings within 40 mV of V_CC+ and 75 mV of V_CC– under 10 kΩ load - critical for low-voltage single-supply designs.

It integrates EMI hardening and 4 kV HBM ESD protection, with input offset voltage drift limited to 4.5 µV/°C over –40 °C to +125 °C. The device features 76–94 dB supply voltage rejection ratio (SVR) and 72–100 dB common-mode rejection ratio (CMRR), ensuring robust performance in noisy industrial or portable environments.

Key Specifications

Pinout & Package

TSV732IQ2T is housed in an 8-pin DFN package (2 mm × 2 mm, 0.5 mm pitch) with exposed thermal pad (EP) for enhanced power dissipation. The package supports automated optical inspection and offers low thermal resistance (R_thJA = 120 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual micropower op-amp applications.

Compared with TLV9002IDR and OPA2313IDR, the TSV732IQ2T uniquely balances 200 µV offset, 60 µA consumption, and EMI resilience - making it optimal for uncalibrated, battery-constrained, RF-dense applications like portable diagnostics and environmental monitors.

Availability

TSV732IQ2T is available at Aetrix Electronics and suitable for portable medical devices, industrial sensor transmitters, and wearable health monitors requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for TSV732IQ2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

The TSV73x series was developed specifically for ultra-low-power, high-accuracy signal conditioning in space- and energy-constrained systems - targeting battery-operated instrumentation, portable diagnostics, and IoT edge nodes.

FAQ

What is the maximum capacitive load the TSV732IQ2T can drive stably?

The TSV732IQ2T remains unity-gain stable with up to 100 pF capacitive load when configured with 10 kΩ feedback and load resistors, as verified in Figure 13 of the datasheet. For loads exceeding 100 pF, a series resistor (≥100 Ω) between output and capacitance is recommended to maintain phase margin above 45° and prevent peaking or oscillation.

Does the exposed thermal pad (EP) require electrical connection?

Yes - the exposed pad must be soldered to a PCB copper pour tied to V_CC– (ground) to ensure thermal performance and EMI immunity. Leaving it floating degrades R_thJA by >30% and reduces ESD robustness. ST recommends a 2×2 mm thermal pad with ≥4 thermal vias to inner ground planes.

Can the TSV732IQ2T operate reliably at 1.5 V supply?

Yes - the device is fully characterized and guaranteed from 1.5 V to 5.5 V. At 1.5 V, supply current drops to ~50 µA/channel, GBP reduces to ~700 kHz, and output swing remains rail-to-rail within 60 mV of each rail under 10 kΩ load - validated in Tables 3–5 and Figures 2, 8, and 11 of the datasheet.

How does the TSV732IQ2T handle input overvoltage conditions?

The TSV732IQ2T includes internal differential voltage clamping that limits input-to-input voltage to ±0.5 V, protecting against transient overvoltage events. However, absolute input voltage must remain within V_CC– – 0.2 V to V_CC+ + 0.2 V (per Table 1). Exceeding these limits risks latch-up or permanent damage, so external clamping diodes are advised in high-risk industrial interfaces.