STMicroelectronics TSV772IQ2T

Overview

TSV772IQ2T from STMicroelectronics is a dual, rail-to-rail input/output operational amplifier optimized for high-bandwidth precision signal conditioning in automotive and industrial systems. It delivers 20 MHz gain bandwidth, 50 µV typical input offset voltage, 13 V/µs slew rate, and operates from 2.0 V to 5.5 V single supply - enabling accurate low-side current sensing and photodiode amplification in compact 3 mm × 3 mm DFN8 packages.

For engineers reviewing the TSV772IQ2T datasheet, TSV772IQ2T pinout, TSV772IQ2T application, or TSV772IQ2T equivalent, this device supports critical design tasks including A/D converter input buffering, high-frequency active filtering, and automotive-grade sensor signal conditioning where low noise (7 nV/√Hz), 4 kV HBM ESD tolerance, and –40 °C to +125 °C operation are mandatory.

Technical Context

The TSV772IQ2T employs dual complementary input transistor pairs to achieve rail-to-rail common-mode input range (VCC– – 0.2 V to VCC+ + 0.1 V) with optimized precision in the low-pair region (VCC– – 0.1 V to VCC+ – 1.8 V). Its unity-gain-stable architecture features 50° phase margin and 9 dB gain margin at 5 V supply with 47 pF capacitive load.

It integrates EMI-hardened input stages delivering >70 dB EMIRR from 400 MHz to 2.4 GHz, and supports stable operation with 10–33 Ω isolation resistors for loads exceeding 47 pF. Unused channels must be configured as unity-gain buffers or comparators to prevent oscillation and cross-talk.

Key Specifications

Pinout & Package

TSV772IQ2T is housed in a 2 mm × 2 mm DFN8 package with exposed thermal pad (pin 8), rated for 39 °C/W junction-to-ambient thermal resistance. The exposed pad may be connected to VCC– or left floating per layout requirements.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual high-speed precision op amp applications.

Compared with TSV772IQ2T, TSV792IYDT trades lower noise and tighter offset for higher speed and power, while LMV722QDRQ1 sacrifices bandwidth and ESD robustness for cost - making TSV772IQ2T the optimal balance for automotive current sensing and precision buffered ADC interfaces.

Availability

TSV772IQ2T is available at Aetrix Electronics and suitable for high-bandwidth current sensing, photodiode amplification, and A/D converter input buffering requiring stable component supply across automotive, industrial automation, and renewable energy applications.

Supply support for TSV772IQ2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for automotive, industrial, and consumer markets.

The TSV77x series belongs to ST's precision high-speed op amp product line, engineered specifically for automotive-grade signal conditioning where accuracy, bandwidth, and ruggedness must coexist in space-constrained DFN packages.

FAQ

What is the maximum capacitive load the TSV772IQ2T can drive without external compensation?

The TSV772IQ2T is fully characterized and stable with 47 pF capacitive load in unity-gain configuration. For loads exceeding 47 pF, a 10–33 Ω series isolation resistor (RISO) must be placed between the output pin and the load to suppress peaking and ringing, as confirmed in Figure 29 and Section 5.6 of DS13842 Rev 7.

How should unused channels be terminated to prevent oscillation?

An unused channel must be configured either as a unity-gain buffer (IN+ tied to a valid common-mode voltage within VCC– – 0.2 V to VCC+ + 0.1 V, IN– connected to OUT) or as an open-loop comparator (IN+ and IN– held ≥100 mV apart). Leaving inputs floating or shorted causes internal instability and increased supply current, per Section 5.3 of the datasheet.

Does the TSV772IQ2T support true rail-to-rail input at 2.0 V supply?

Yes - the input common-mode range extends from VCC– – 0.2 V to VCC+ + 0.1 V across the full 2.0–5.5 V supply range. At 2.0 V supply, this means inputs function correctly from –0.2 V to +2.1 V, verified in Table 6 and Figure 14 of DS13842 Rev 7, with best precision maintained between VCC– – 0.1 V and VCC+ – 1.8 V.

Is the exposed thermal pad on the DFN8 package electrically connected?

The exposed pad (pin 8) is internally connected to VCC– and must be soldered to a PCB copper pour tied to the negative supply plane to achieve the specified 39 °C/W thermal resistance. Leaving it unconnected degrades thermal performance by >25%, as documented in Table 5 footnote (1) and layout guidelines on page 32 of DS13842 Rev 7.