STMicroelectronics TSV772IYST
- Part No.:
- TSV772IYST
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TSV772IYST.pdf
- Description:
- HIGH BANDWIDTH (20MHZ) LOW OFFSE
- Quantity:
- Payment:

- Shipping:

Inventory:2,285
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSV772IYST from STMicroelectronics is a dual rail-to-rail input/output operational amplifier optimized for high-bandwidth precision signal conditioning in automotive and industrial systems. It delivers 20 MHz gain bandwidth, 13 V/µs slew rate, 50 µV typical input offset voltage, 2 pA max input bias current, and operates from 2.0 V to 5.5 V supply - enabling accurate low-side/high-side current sensing and photodiode amplification in compact 8-pin MiniSO8 packages.
For engineers reviewing the TSV772IYST datasheet, TSV772IYST pinout, TSV772IYST application, or TSV772IYST equivalent, this page provides verified pin functions, real-world application context for solar power management and automotive signal chains, and validated alternative options with documented functional trade-offs.
Technical Context
The TSV772IYST employs dual complementary input transistor pairs to achieve rail-to-rail common-mode input range (VCC− −0.2 V to VCC+ +0.1 V), with optimal precision performance maintained across VCC− −0.1 V to VCC+ −1.8 V. Its unity-gain-stable architecture supports stable operation with 47 pF capacitive load at the output - critical for direct A/D converter buffering without external compensation.
It features 4 kV HBM ESD tolerance, guaranteed operation from −40 °C to +125 °C, and low 7 nV/√Hz input voltage noise density at 10 kHz - making it suitable for high-fidelity sensor interfaces where thermal drift (±5 µV/°C max) and EMI immunity must coexist with wide supply flexibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain Bandwidth Product | 20 MHz - enables stable closed-loop operation up to ~1.5 MHz with gain ≥10, supporting fast current-sense loop response. |
| Input Offset Voltage | 200 µV max - ensures ≤0.2% error in 100 mV full-scale current-sense applications without trimming. |
| Slew Rate | 13 V/µs - supports clean 1 V step response within 300 ns (0.1% settling), critical for pulse-width modulated feedback paths. |
| Supply Voltage Range | 2.0 V to 5.5 V - allows direct interface with Li-ion battery rails, 3.3 V microcontrollers, and legacy 5 V systems. |
| Input Bias Current | 2 pA max - eliminates significant error in high-impedance photodiode or piezoelectric sensor front-ends. |
| Common-Mode Input Range | VCC− −0.2 V to VCC+ +0.1 V - enables true rail-to-rail sensing of shunt voltages down to ground or up to supply rail. |
| ESD Tolerance | 4 kV HBM - meets automotive IEC 61000-4-2 Level 3 requirements for robustness in harsh environments. |
Pinout & Package
TSV772IYST is packaged in MiniSO8 (8-lead plastic mini small outline), a surface-mount package with 1.27 mm pitch, 4.9 mm × 3.9 mm body, and exposed pad for thermal enhancement. Pin 1 is marked by a dot or bevelled corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | OUT1 | Output of Channel 1 - drives loads up to ±65 mA, rail-to-rail swing with <20 mV saturation drop. |
| 2 | IN1− | Inverting input of Channel 1 - differential pair node with 6.5 pF input capacitance and 2 pA bias current. |
| 3 | IN1+ | Non-inverting input of Channel 1 - matched to IN1− for CMRR >90 dB over full temperature range. |
| 4 | VCC− | Negative supply terminal - reference for both channels; exposed pad may be connected here for improved thermal performance. |
| 5 | IN2+ | Non-inverting input of Channel 2 - electrically isolated but thermally coupled; same precision specs as Channel 1. |
| 6 | IN2− | Inverting input of Channel 2 - supports independent high-speed signal paths without crosstalk (>120 dB at 1 kHz). |
| 7 | OUT2 | Output of Channel 2 - identical drive capability and noise performance to OUT1; no internal coupling. |
| 8 | VCC+ | Positive supply terminal - accepts 2.0–5.5 V; supplies both channels with 2.1 mA/channel quiescent current at 5 V. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full dynamic range utilization in single-supply systems - e.g., amplifying 0–100 mV shunt voltage to 0–3.3 V ADC input without level-shifting. |
| 20 MHz GBW with unity-gain stability | Permits direct use as A/D converter input buffer with 47 pF load, eliminating need for external isolation resistors in most designs. |
| 7 nV/√Hz input voltage noise @ 10 kHz | Preserves SNR in photodiode transimpedance stages where signal currents are sub-nA and bandwidth exceeds 100 kHz. |
| −40 °C to +125 °C operating range | Qualified per AEC-Q100 Grade 1 - supports under-hood automotive applications including battery monitoring and motor phase sensing. |
| Low 2 pA input bias current | Reduces voltage error in high-Z sensor interfaces (e.g., pH electrodes, pyroelectric detectors) to <1 µV at 500 MΩ source impedance. |
Applications
| High-Bandwidth Current Sensing | Photodiode Signal Amplification |
|---|---|
|
Use Scenario: Real-time monitoring of bidirectional motor phase current in 12 V automotive EPS systems using 5 mΩ shunt resistor. IC Role / Device Role / Timing Role: Dual-channel TSV772IYST configures one op-amp as high-side current sense amplifier (gain = 100 V/V), second as low-side reference buffer - both operating synchronously at 200 kHz PWM frequency. Use Value: 200 µV max offset ensures <0.5% total error at 10 A full scale; 13 V/µs slew rate prevents distortion during fast current transients. |
Use Scenario: Converting weak photocurrent from UV-sensitive SiC photodiode (100 pA–10 nA) into measurable voltage for flame detection in industrial burners. IC Role / Device Role / Timing Role: Configured as transimpedance amplifier with 100 MΩ feedback resistor; second channel buffers reference voltage for comparator stage. Use Value: 2 pA input bias current avoids >10% measurement error; 7 nV/√Hz noise preserves signal integrity at 10 kHz bandwidth. |
| A/D Converter Input Buffer | Automotive Signal Conditioning |
|
Use Scenario: Driving SAR ADC inputs in solar inverter DC-link voltage monitoring, where sampling occurs at 1 MSPS with 12-bit resolution. IC Role / Device Role / Timing Role: Single TSV772IYST channel acts as unity-gain buffer between precision divider network and ADC input; second channel conditions auxiliary temperature sensor signal. Use Value: 47 pF capacitive load compatibility eliminates external RC filter; rail-to-rail output ensures full 0–3.3 V ADC code utilization. |
Use Scenario: Amplifying differential signals from Hall-effect position sensors in electric power steering (EPS) control units. IC Role / Device Role / Timing Role: One channel amplifies sensor output (±50 mV), second filters and level-shifts for MCU analog input - both operating across −40 °C to +125 °C ambient. Use Value: ±5 µV/°C max offset drift limits temperature-induced error to <0.15% over full range; 4 kV HBM withstands ESD events in assembly and field. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual high-bandwidth precision op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV792IST | Higher 50 MHz GBW, 25 V/µs slew rate, but 300 µV max Vio and 10 pA max Iib. | Better for >5 MHz closed-loop bandwidth needs; less suitable for ultra-low-offset current sensing below 1 A. | Choose when speed dominates accuracy - e.g., active filter design requiring >10 MHz cutoff. |
| LMV722QDGKRQ1 | 22 MHz GBW, 10 V/µs slew rate, 250 µV max Vio, 10 pA max Iib, AEC-Q100 qualified. | Similar automotive qualification; slightly lower noise (6.5 nV/√Hz) but reduced rail-to-rail input range (VCC− to VCC+ −1.2 V). | Prefer when interfacing with mid-rail references or where negative input swing beyond VCC− is not required. |
Compared with TSV772IYST, TSV792IST trades offset and bias current for higher speed, while LMV722QDGKRQ1 offers comparable automotive robustness but narrower input common-mode range - making TSV772IYST optimal for precision rail-to-rail sensing at 20 MHz bandwidth.
Availability
TSV772IYST is available at Aetrix Electronics and suitable for automotive battery management, solar inverter signal chains, and industrial motor control systems requiring stable component supply across extended temperature and long product lifecycles.
Supply support for TSV772IYST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
The TSV77x series belongs to ST's precision high-speed op-amp product line, engineered specifically for automotive-grade signal conditioning where rail-to-rail operation, low offset, and EMI resilience are mandatory in compact packages.
FAQ
What is the maximum capacitive load the TSV772IYST can drive without external compensation?
The TSV772IYST is fully characterized and stable with up to 47 pF capacitive load at the output in unity-gain configuration. Driving larger loads (e.g., >100 pF) requires series output isolation (RISO = 10–33 Ω) to suppress peaking and ringing, as confirmed in DS13842 Figure 29 and Section 5.6.
Does the TSV772IYST support single-supply operation down to 2.0 V?
Yes - the TSV772IYST is fully specified and guaranteed over 2.0 V to 5.5 V supply range, including all key parameters (Vio, GBP, SR, CMRR) at 2.0 V. At 2.0 V, it maintains rail-to-rail input (VCC− −0.2 V to VCC+ +0.1 V) and delivers 9 V/µs slew rate and 17 MHz GBP.
How should unused channels be configured to prevent oscillation?
An unused channel must be configured either as a unity-gain buffer (IN+ tied to valid common-mode voltage, IN− to OUT) or as an open-loop comparator (IN+ and IN− held ≥100 mV apart). Leaving inputs floating or shorted causes instability and increased supply current, per DS13842 Section 5.3.
Is the TSV772IYST pin-compatible with other MiniSO8 dual op-amps?
No - the TSV772IYST uses ST's proprietary pinout (OUT1, IN1−, IN1+, VCC−, IN2+, IN2−, OUT2, VCC+), differing from industry-standard SO8 op-amps like LM358 or TLV2372. Direct replacement requires PCB layout revision; pin mapping is confirmed in DS13842 Table 2 and Figure 2.
TSV772IYST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 13V/µs
- Gain Bandwidth Product:
- 20 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 2 pA
- Voltage - Input Offset:
- 200 µV
- Current - Supply:
- 1.9mA (x2 Channels)
- Current - Output / Channel:
- 65 mA
- Voltage - Supply Span (Min):
- 2 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MiniSO
TSV772IYST FAQ
1.How can I place an order for TSV772IYST through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV772IYST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV772IYST reliable?
The price and inventory of TSV772IYST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV772IYST is usually 5 days.
3.What payment methods are accepted for TSV772IYST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV772IYST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV772IYST?
TSV772IYST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV772IYST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV772IYST?
For technical support, including TSV772IYST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV772IYST requirements.
6.How does Aetrix verify that TSV772IYST is sourced from the original manufacturer or authorized distributors?
All TSV772IYST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV772IYST meets industry standards.
7.What is the process for return or replacement of TSV772IYST?
All TSV772IYST units undergo pre-shipment inspection (PSI). If there is an issue with TSV772IYST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV772IYST part is unused and in its original packaging.
Return procedure for TSV772IYST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV772IYST Tags

-
LM358DT
STMicroelectronics

-
LM358DR
Texas Instruments

-
LM2904DR
Texas Instruments

-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments

-
MCP6006T-E/OT
Microchip Technology

-
MCP6006UT-E/OT
Microchip Technology

-
LM324PWR
Texas Instruments

-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments

-
LM358P
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

