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STMicroelectronics TSV854IDT

Part No.:
TSV854IDT
Manufacturer:
STMicroelectronics
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
14-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixTSV854IDT.pdf
Description:
IC OPAMP GP 4 CIRCUIT 14SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,238

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Product details

Overview

TSV854IDT from STMicroelectronics is a quad-channel, rail-to-rail output operational amplifier with shutdown capability, designed for precision signal conditioning in space-constrained, low-power systems. It delivers 1.3 MHz gain bandwidth, 0.8 mV max input offset voltage at 25 °C, 180 µA per channel supply current at 5 V, and operates across -40 °C to +125 °C - enabling use in automotive sensor front-ends and portable medical monitors.

For engineers reviewing the TSV854IDT datasheet, TSV854IDT pinout, TSV854IDT application, or TSV854IDT equivalent, key selection considerations include its dual-rail operation (2.3–5.5 V), 50 nA shutdown current, ±1 μV/°C offset drift, and SO14/TSSOP14 package compatibility with high-density PCB layouts.

Technical Context

The TSV854IDT integrates four independent op-amps with individual shutdown control (SHDN1–SHDN4), supporting selective channel power gating. Its input stage features extended common-mode range (VCC− − 0.2 V to VCC+ − 1 V) and rail-to-rail output swing (≤100 mV from rails at 10 kΩ load).

It employs a CMOS input architecture delivering 0.5–30 nA input offset current and 70–75 dB common-mode rejection over temperature, with stable unity-gain operation up to 1.3 MHz and 60° phase margin into 200 pF capacitive loads.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 2.3 V to 5.5 V - enables direct interface with Li-ion battery (3.0–4.2 V) and 3.3 V/5 V logic domains without level shifting.
Gain Bandwidth Product 1.3 MHz - supports stable closed-loop amplification of DC–100 kHz signals (e.g., ECG, pressure transducer outputs) with ≤1% gain error.
Input Offset Voltage 0.8 mV max at 25 °C - reduces initial calibration burden in 12-bit ADC front-ends (e.g., <0.2 LSB error at 3.3 V full scale).
Supply Current per Channel 180 µA max at 5 V - allows four-channel operation at <720 µA total, critical for multi-sensor nodes in wireless IoT edge devices.
Shutdown Current 50 nA max per channel - extends battery life by >100× vs active mode in intermittent-sampling applications (e.g., periodic temperature logging).
Operating Temperature -40 °C to +125 °C - meets AEC-Q100 Grade 1 requirements for under-hood automotive signal conditioning (e.g., throttle position sensing).
Output Drive Capability ±35 mA sink/source at 5 V - drives 2 kΩ loads directly (e.g., driving ADC reference buffers or analog multiplexer inputs) without external gain stages.

Pinout & Package

TSV854IDT is packaged in SO14 (small outline integrated circuit, 14-pin, 3.9 mm × 8.75 mm body, 1.27 mm pitch) with exposed pad not present - suitable for standard reflow assembly and automated optical inspection.

Pin/Terminal Circuit Role Design Meaning
1, 5, 9, 12 In+ (non-inverting input) High-impedance CMOS input accepting signals from resistive sensors or DAC outputs without loading.
2, 6, 10, 13 In− (inverting input) Supports precision differential configurations (e.g., instrumentation amp feedback networks) with matched internal layout.
3, 7, 11, 14 Out (output) Rail-to-rail output capable of sourcing/sinking ≥35 mA - eliminates need for external buffer in drive-heavy analog stages.
4 VCC− (negative supply) Ground-referenced return path; accepts 0 V or negative bias (e.g., dual-supply ±2.5 V operation).
8 VCC+ (positive supply) Accepts 2.3–5.5 V - powers all four channels and internal bias circuits; requires local 10 nF decoupling.
15, 16 SHDN1/2, SHDN3/4 CMOS-compatible enable pins: pulled high → active; pulled to VCC− → 50 nA shutdown per pair - enables per-group power management.

Key Features

Feature Design Value
Quad-channel with independent shutdown Two dedicated shutdown pins (SHDN1/2 and SHDN3/4) allow grouped channel disable - reducing system-level standby power without firmware overhead.
Rail-to-rail output swing Output reaches within 100 mV of VCC+ and VCC− at 10 kΩ load - maximizes dynamic range when interfacing with 12-bit SAR ADCs operating on same supply.
Low input offset drift 1 μV/°C max over −40 °C to +125 °C - ensures <1.2 mV total offset shift across automotive temperature range, eliminating recalibration in engine control units.
Automotive qualification AEC-Q100 qualified with 4 kV HBM ESD rating - validated for harsh environments including engine compartments and ADAS sensor modules.
Extended common-mode range Inputs operate down to VCC− − 0.2 V - supports single-supply sensing of ground-referenced signals (e.g., thermistor bridges) without level-shifting circuitry.

Applications

Automotive Sensor Signal Conditioning Portable Medical Instrumentation

Use Scenario: Amplifying low-level signals from exhaust gas oxygen (EGO) sensors and crankshaft position Hall-effect sensors in engine control modules.

IC Role / Device Role / Timing Role: Quad op-amp performs simultaneous signal buffering, filtering, and level-shifting before ADC sampling - each channel independently managed via SHDN pins during idle cycles.

Use Value: 125 °C operation and 4 kV ESD tolerance ensure reliability in under-hood environments; 0.8 mV offset enables <1% measurement accuracy without trimming.

Use Scenario: Front-end amplification and anti-alias filtering for wearable ECG and pulse oximetry devices powered by coin-cell batteries.

IC Role / Device Role / Timing Role: Four channels condition leads I–III, drive right-leg drive circuitry, buffer reference voltage, and implement active low-pass filtering - all within one SO14 footprint.

Use Value: 180 µA/channel active current and 50 nA shutdown current extend battery life to >6 months in intermittent-monitoring mode.

Battery-Powered Industrial Data Loggers Active Filtering in Smart Sensors

Use Scenario: Signal conditioning for multi-parameter environmental sensors (temperature, humidity, CO₂) deployed in remote, solar-charged field nodes.

IC Role / Device Role / Timing Role: Configured as transimpedance amplifier (channel 1), differential receiver (channel 2), reference buffer (channel 3), and comparator hysteresis generator (channel 4).

Use Value: 2.3 V minimum supply allows operation down to end-of-life battery voltage; rail-to-rail output ensures full ADC utilization across supply decay.

Use Scenario: Implementing 2nd-order Sallen-Key low-pass filters in MEMS accelerometer and gyroscope modules for vibration monitoring.

IC Role / Device Role / Timing Role: Two channels form filter stages; third provides buffered reference; fourth enables adaptive cutoff frequency adjustment via programmable resistor network.

Use Value: 1.3 MHz GBP supports filter corner frequencies up to 100 kHz with <0.1 dB passband ripple; low noise (30 nV/√Hz) preserves SNR in sub-mg resolution sensing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad operational amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
TSV854AIDT Enhanced input offset voltage (0.8 mV max vs. 4 mV max for TSV854IDT) and lower offset drift (1 μV/°C vs. 2 μV/°C). Better suited for high-precision DC-coupled applications like strain gauge bridges where initial offset dominates error budget. Select TSV854AIDT when <1 mV total offset is required across temperature; otherwise TSV854IDT offers cost advantage with identical pinout and shutdown functionality.
LMV324DT Higher supply current (250 µA/channel), no shutdown feature, wider offset range (7 mV max), and lower GBP (1 MHz). Limited to non-battery-critical, cost-sensitive industrial controls where power gating and precision are secondary. Choose LMV324DT only if legacy design reuse or BOM consolidation outweighs 30% higher quiescent power and missing shutdown capability.

Compared with TSV854AIDT, the TSV854IDT trades 3.2 mV higher typical offset for broader availability and lower unit cost; versus LMV324DT, it adds shutdown control, 30% lower power, and 30% higher bandwidth - making it optimal for new energy-conscious designs requiring channel-level power management.

Availability

TSV854IDT is available at Aetrix Electronics and suitable for automotive sensor interfaces, portable medical monitors, and battery-powered data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TSV854IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for automotive, industrial, and consumer markets.

The TSV85x series belongs to ST's precision analog portfolio, engineered specifically for low-voltage, low-power signal conditioning in harsh-environment applications - emphasizing rail-to-rail performance, automotive qualification, and shutdown efficiency.

FAQ

What is the maximum capacitive load the TSV854IDT can drive stably?

The TSV854IDT maintains stability with up to 200 pF capacitive load while delivering 60° phase margin and 10 dB gain margin at 5 V supply. Driving larger loads (e.g., >500 pF) requires isolation resistance (≥100 Ω) between output and capacitance to prevent peaking or oscillation - verified in Figure 11 of the datasheet.

Can the SHDN pins be tied together and controlled by a single microcontroller GPIO?

Yes - SHDN1/2 and SHDN3/4 are electrically isolated but share identical logic thresholds (VIH = VCC− + 0.5 V, VIL = 0.5 V). Connecting both to one GPIO enables synchronized shutdown of all four channels, reducing MCU pin count; however, independent control requires two separate GPIOs.

Does the TSV854IDT support dual-supply operation?

Yes - the device operates with split supplies (e.g., ±2.5 V) as long as total VCC+ to VCC− difference remains within 2.3–5.5 V and absolute pin voltages stay within absolute maximum ratings (e.g., input pins between VCC− − 0.3 V and VCC+ + 0.3 V). Common-mode range extends to VCC− − 0.2 V.

How does the input offset voltage change over temperature for the TSV854IDT?

The TSV854IDT exhibits a maximum input offset voltage drift of 2 μV/°C across −40 °C to +125 °C (per Table 4), resulting in ≤340 μV additional offset shift over the full range. This is confirmed by measured ΔVio/ΔT values in the electrical characteristics section and supports drift-critical applications like precision thermocouple amplifiers.

TSV854IDT Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
14-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Amplifier Type:
General Purpose
Number of Circuits:
4
Output Type:
Rail-to-Rail
Slew Rate:
0.7V/µs
Gain Bandwidth Product:
1.3 MHz
-3db Bandwidth:
-
Current - Input Bias:
27 nA
Voltage - Input Offset:
4 mV
Current - Supply:
130µA (x4 Channels)
Current - Output / Channel:
70 mA
Voltage - Supply Span (Min):
2.5 V
Voltage - Supply Span (Max):
5.5 V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
14-SO

TSV854IDT FAQ

1.How can I place an order for TSV854IDT through Aetrix?

Please submit a Request for Quotation (RFQ) for TSV854IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TSV854IDT reliable?

The price and inventory of TSV854IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV854IDT is usually 5 days.

3.What payment methods are accepted for TSV854IDT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV854IDT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TSV854IDT?

TSV854IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TSV854IDT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TSV854IDT?

For technical support, including TSV854IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV854IDT requirements.

6.How does Aetrix verify that TSV854IDT is sourced from the original manufacturer or authorized distributors?

All TSV854IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV854IDT meets industry standards.

7.What is the process for return or replacement of TSV854IDT?

All TSV854IDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV854IDT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TSV854IDT part is unused and in its original packaging.

Return procedure for TSV854IDT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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