STMicroelectronics TSV855IPT

Overview

TSV855IPT from STMicroelectronics is a quad-channel, rail-to-rail output operational amplifier with shutdown capability, designed for automotive signal conditioning and battery-powered systems. It delivers 1.3 MHz gain bandwidth, 180 µA per channel supply current at 5 V, 0.8 mV max input offset voltage at 25 °C, and operates across –40 °C to +125 °C - enabling precision sensor interfacing in engine control units and portable medical monitors.

For engineers reviewing the TSV855IPT datasheet, TSV855IPT pinout, TSV855IPT application, or TSV855IPT equivalent, this page provides verified functional identity, validated pin assignments for TSSOP14, confirmed shutdown timing (300 ns turn-on), real-world rail-to-rail output swing limits (≤180 mV from rails), and direct alternatives with documented performance trade-offs in automotive-qualified op-amp selection.

Technical Context

The TSV855IPT integrates four independent amplifiers in a single TSSOP14 package, each featuring an active shutdown pin (SHDN1/SHDN2 per pair) that reduces quiescent current to ≤50 nA. Its input stage supports common-mode voltage down to VCC– – 0.2 V and up to VCC+ – 1 V, with no phase reversal - critical for single-supply transducer front-ends.

It employs a CMOS input architecture delivering 0.5–30 nA input offset current and 70–75 dB common-mode rejection over temperature, while maintaining 0.6–0.7 V/µs slew rate and 60° phase margin into 200 pF loads - ensuring stable unity-gain buffer operation in active filtering and medical instrumentation signal chains.

Key Specifications

Pinout & Package

TSSOP14 (Thin Shrink Small Outline Package, 4.4 mm × 5.0 mm, 0.65 mm pitch) with exposed thermal pad (not electrically connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad operational amplifier applications.

Compared with TSV855IPT, TSV855AIP improves DC accuracy without sacrificing automotive qualification or power efficiency, while LMV324IDR trades off precision, temperature range, and power control for lower unit cost in non-automotive designs.

Availability

TSV855IPT is available at Aetrix Electronics and suitable for automotive signal conditioning, portable medical instrumentation, and industrial motor drive current sensing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TSV855IPT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.

The TSV85x series belongs to ST's precision low-power op-amp product line, engineered specifically for automotive-qualified signal conditioning in harsh environments where accuracy, reliability, and ultra-low power coexist.

FAQ

What is the maximum capacitive load the TSV855IPT can drive while maintaining stability?

The TSV855IPT maintains ≥60° phase margin with up to 200 pF capacitive load when configured as a unity-gain buffer and biased at 5 V, as verified in Figure 9 of the datasheet. For loads exceeding 200 pF, external isolation resistance (≥100 Ω) is required between output and capacitance to prevent peaking or oscillation.

Can the SHDN pins be tied together to enable/disable all four channels simultaneously?

Yes - SHDN1 and SHDN2 can be connected to a common control signal. Doing so enables or disables Channels 1–2 and 3–4 concurrently. This configuration is explicitly supported and maintains specified 300 ns turn-on and 20 ns turn-off timing per channel, as measured in Figures 23–24.

Is the exposed thermal pad on the TSSOP14 package electrically connected?

No - the exposed pad on the TSV855IPT's TSSOP14 package is not internally connected to any die node. ST's mechanical drawing (Figure 25) and package documentation confirm it may be left floating or soldered to a thermal plane solely for heat dissipation, with no electrical function.

How does the input common-mode range behave near the negative rail?

The TSV855IPT supports input voltages down to VCC– – 0.2 V (i.e., –0.2 V with ground-referenced VCC–), enabling true single-supply operation with ground-coupled sensors. No output phase reversal occurs across this full range, as confirmed in Section 4.2 and Figure 4 of the datasheet.