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STMicroelectronics TSV911AID
- Part No.:
- TSV911AID
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV911AID.pdf
- Description:
- IC OPAMP GP 1 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,244
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Product details
Overview
TSV911AID from STMicroelectronics is a single-channel, rail-to-rail input/output operational amplifier optimized for low-voltage, low-power applications. It delivers 8 MHz gain-bandwidth, 4.5 V/µs slew rate, and 1.5 mV max input offset voltage (A grade) while consuming only 820 µA typical supply current at 2.5–5.5 V operation - enabling precision signal conditioning in battery-powered medical sensors and portable instrumentation.
For engineers reviewing the TSV911AID datasheet, TSV911AID pinout, TSV911AID application, or TSV911AID equivalent, this page provides verified package mapping (SO8), confirmed rail-to-rail I/O behavior, unity-gain stability, ESD immunity ≥5 kV HBM, and real-world design meaning for key specs including output drive (±35 mA), input bias current (1 pA typ.), and CMRR (up to 82 dB).
Technical Context
The TSV911AID uses a CMOS input stage enabling ultra-low input bias current (1 pA typ.) and rail-to-rail common-mode input range (VCC− − 0.1 V to VCC+ + 0.1 V). Its internal compensation ensures unity-gain stability across 2.5–5.5 V supply, with phase margin maintained at ≥45° into 100 pF capacitive loads.
It features a high-output-current architecture delivering ±35 mA into resistive loads and supports stable operation with supply rejection ratio up to 86 dB and common-mode rejection up to 82 dB - critical for sensor front-ends where DC accuracy and noise immunity must coexist with low quiescent power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain-bandwidth product | 8 MHz - enables stable closed-loop operation up to ~100 kHz with gain ≥10, suitable for active filters and sensor amplification. |
| Input offset voltage (A grade) | 1.5 mV max at 25 °C - ensures ≤0.3% error in 0.5 V full-scale medical sensor outputs without trimming. |
| Supply current per channel | 820 µA typ. at 2.5 V - allows >1-year battery life in coin-cell-powered portable devices operating at 100 µA average system current. |
| Output drive capability | ±35 mA - directly drives 100 Ω loads or 10 kΩ DAC reference buffers without external boost stages. |
| Input bias current | 1 pA typ. - minimizes voltage error across high-impedance pH or photodiode sensor nodes (>1 GΩ source impedance). |
| Common-mode rejection | 82 dB at 5 V supply - suppresses >12× common-mode interference in noisy automotive or industrial analog front-ends. |
| ESD immunity | ≥5 kV HBM - meets IEC 61000-4-2 Level 4 for handheld medical devices exposed to frequent handling. |
Pinout & Package
TSV911AID is supplied in an SO8 (Small Outline Integrated Circuit, 8-pin) package with standard dual-in-line footprint and gull-wing leads. The exposed pad is not internally connected and may be left floating or tied to VCC− for thermal enhancement.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting input (IN−) | High-impedance node accepting feedback signals; 1 pA bias current enables use with MΩ-level feedback networks. |
| 2 | Non-inverting input (IN+) | Rail-to-rail common-mode range (−0.1 V to VCC+ + 0.1 V) supports direct connection to resistive sensor bridges. |
| 3 | Output (OUT) | Capable of sourcing/sinking ±35 mA; rail-to-rail swing allows full utilization of 2.5–5.5 V ADC reference ranges. |
| 4 | VCC− (ground) | Power return path; decoupling capacitor (10 nF) must be placed within 2 mm for stability with 100 pF loads. |
| 5 | NC | No internal connection; electrically isolated - may be left unconnected or used as thermal pad anchor. |
| 6 | NC | No internal connection; electrically isolated - no routing or grounding required. |
| 7 | VCC+ | Positive supply rail (2.5–5.5 V); PSRR of 86 dB rejects ripple from noisy switching regulators. |
| 8 | NC | No internal connection; electrically isolated - no routing or grounding required. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full dynamic range utilization with 2.5 V supplies - critical for low-voltage battery-powered data loggers. |
| Unity-gain stable | Eliminates need for external compensation components in buffer or gain-of-one configurations, reducing BOM count. |
| 820 µA typical supply current | Supports always-on sensor monitoring at <1 µA average system current when paired with duty-cycled microcontrollers. |
| 1.5 mV max input offset (A grade) | Meets Class II medical device DC accuracy requirements without factory calibration or software correction. |
| 5 kV HBM ESD protection | Reduces need for external TVS diodes in handheld diagnostic tools, lowering PCB area and cost. |
Applications
| Portable ECG Monitor | Automotive Cabin Air Quality Sensor |
|---|---|
Use Scenario: Amplifying µV-level bio-potential signals from dry electrodes in a handheld ECG device powered by a CR2032 coin cell. IC Role / Device Role / Timing Role: Primary signal-conditioning amplifier in first-stage instrumentation chain, providing gain, filtering, and rail-to-rail buffering before 12-bit SAR ADC sampling. Use Value: 1 pA input bias prevents electrode polarization drift; 820 µA quiescent current extends battery life beyond 12 months at 10-second measurement intervals. |
Use Scenario: Conditioning output from NDIR CO₂ sensor in HVAC control module, operating across −40 °C to 125 °C under vehicle hood conditions. IC Role / Device Role / Timing Role: Precision transimpedance amplifier converting photodiode current to voltage, followed by low-pass filtering prior to MCU ADC. Use Value: 82 dB CMRR rejects engine compartment EMI; A-grade 1.5 mV offset ensures <±0.5% CO₂ reading error over full temperature range. |
| Wearable Glucose Patch Interface | Industrial Battery Management System (BMS) Cell Monitor |
Use Scenario: Amplifying amperometric current from enzyme-based glucose sensor in disposable skin patch, powered by flexible thin-film battery. IC Role / Device Role / Timing Role: Low-noise, low-drift transimpedance amplifier with programmable gain, driving 10-bit delta-sigma ADC in ultra-low-power SoC. Use Value: 21 nV/√Hz input noise preserves SNR at 1 kHz bandwidth; rail-to-rail output matches ADC's 1.8 V reference without level-shifting. |
Use Scenario: Measuring voltage across individual Li-ion cells (2.5–4.3 V) in 12S BMS, requiring high common-mode rejection and low self-heating. IC Role / Device Role / Timing Role: High-side differential amplifier feeding isolated sigma-delta modulator, operating from local LDO-regulated 3.3 V rail. Use Value: 86 dB PSRR rejects LDO ripple; ±35 mA output drives 100 pF isolation barrier input capacitance without phase margin loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar rail-to-rail, low-power op amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV911ID | Standard grade (7.5 mV max Vio vs. 1.5 mV for A grade); otherwise identical specs and pinout. | Suitable for non-critical signal paths where offset drift <3 mV is acceptable, e.g., LED bias control or generic voltage followers. | Select TSV911ID when cost sensitivity outweighs precision requirements and system-level calibration is available. |
| MCP6001T-E/OT | Lower GBP (1 MHz), higher Vio (2.5 mV typ.), but same 820 µA ICC and rail-to-rail I/O; SOT23-5 only. | Limited to lower-bandwidth applications (<100 kHz) like simple comparators or slow-settling sensor buffers. | Choose MCP6001T-E/OT only if board space constraints mandate SOT23-5 and bandwidth demand is <500 kHz. |
Compared with TSV911ID, the TSV911AID delivers 5× tighter offset tolerance critical for medical-grade DC accuracy; versus MCP6001T-E/OT, it provides 8× higher bandwidth and superior PSRR for noisy industrial environments - making it the optimal choice for precision, wideband, low-power analog front-ends.
Availability
TSV911AID is available at Aetrix Electronics and suitable for portable medical devices, automotive cabin sensors, wearable health monitors, and industrial battery management systems requiring stable component supply across extended temperature ranges (−40 °C to 125 °C) and long production lifecycles.
Supply support for TSV911AID includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The TSV91x series belongs to ST's precision analog portfolio, engineered specifically for ultra-low-power, rail-to-rail signal conditioning in battery-constrained and high-reliability applications - emphasizing DC accuracy, ESD robustness, and wide supply flexibility.
FAQ
What is the maximum capacitive load the TSV911AID can drive without external compensation?
The TSV911AID is stable driving up to 100 pF capacitive loads in unity-gain follower configuration, as verified by phase margin ≥45° across 2.5–5.5 V supply and −40 °C to 125 °C temperature range. For loads exceeding 100 pF, a series resistor (10–100 Ω) between output and load is recommended to restore stability - values are detailed in Figure 19 of DS4899 Rev 13.
Does the TSV911AID support true rail-to-rail input at 2.5 V supply?
Yes - the TSV911AID guarantees rail-to-rail input common-mode range from (VCC− − 0.1 V) to (VCC+ + 0.1 V) at all supply voltages including 2.5 V. At 2.5 V, this means IN+ and IN− accept signals from −0.1 V to +2.6 V, enabling direct interface with resistive sensors referenced to ground or VCC.
How does the A grade differ from standard grade in production testing?
The TSV911AID undergoes 100% final test screening for input offset voltage ≤1.5 mV at 25 °C and ≤3 mV across −40 °C to 125 °C, whereas standard-grade TSV911ID is tested to ≤4.5 mV (typ.) and ≤7.5 mV (max) over temperature. No other parameters are binned - all other specs (GBW, SR, ICC) are identical.
Can the NC pins on the SO8 package be used for thermal relief or grounding?
No - pins 5, 6, and 8 of the TSV911AID SO8 package are unconnected internally and electrically isolated. They must remain unconnected or serve only as mechanical anchors; tying them to ground or VCC risks parasitic coupling or solder wicking. Thermal relief is achieved solely via the exposed pad (not present in SO8) or PCB copper pour under the body.
TSV911AID Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 1
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 4.5V/µs
- Gain Bandwidth Product:
- 8 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 1.5 mV
- Current - Supply:
- 820µA
- Current - Output / Channel:
- 35 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV911AID FAQ
1.How can I place an order for TSV911AID through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV911AID on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV911AID reliable?
The price and inventory of TSV911AID are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV911AID is usually 5 days.
3.What payment methods are accepted for TSV911AID?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV911AID transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV911AID?
TSV911AID orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV911AID order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV911AID?
For technical support, including TSV911AID datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV911AID requirements.
6.How does Aetrix verify that TSV911AID is sourced from the original manufacturer or authorized distributors?
All TSV911AID products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV911AID meets industry standards.
7.What is the process for return or replacement of TSV911AID?
All TSV911AID units undergo pre-shipment inspection (PSI). If there is an issue with TSV911AID, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV911AID part is unused and in its original packaging.
Return procedure for TSV911AID:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV911AID Tags
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LM358DT
STMicroelectronics
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LM358DR
Texas Instruments
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LM2904DR
Texas Instruments
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LM358ADR
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LM2904DGKR
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LM324DR
Texas Instruments
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MCP6006T-E/OT
Microchip Technology
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MCP6006UT-E/OT
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LM324PWR
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LM2902PWR
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LM2902DR
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LM358P
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