STMicroelectronics TSV911AIDT
- Part No.:
- TSV911AIDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV911AIDT.pdf
- Description:
- IC OPAMP GP 1 CIRCUIT 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TSV911AIDT from STMicroelectronics is a single-channel, rail-to-rail input/output operational amplifier optimized for low-voltage, low-power applications. It delivers 8 MHz gain-bandwidth, 4.5 V/µs slew rate, and 1.5 mV max input offset voltage (A grade) while consuming only 820 µA typical supply current at 2.5–5.5 V operation - enabling precision signal conditioning in battery-powered medical sensors and portable instrumentation.
For engineers reviewing the TSV911AIDT datasheet, TSV911AIDT pinout, TSV911AIDT application, or TSV911AIDT equivalent, key selection criteria include its rail-to-rail I/O capability across 2.5–5.5 V supply, ultra-low 1 pA typical input bias current, ±40 °C to +125 °C automotive-grade temperature range, and SO8 package compatibility with standard PCB layout practices for sensor front-ends and active filters.
Technical Context
The TSV911AIDT employs a CMOS input stage enabling 1 pA typical input bias current and rail-to-rail common-mode input range (VCC− − 0.1 V to VCC+ + 0.1 V), supporting direct interfacing with high-impedance sources like piezoresistive sensors and pH electrodes. Its unity-gain-stable architecture ensures stability with capacitive loads up to 100 pF without external compensation.
It achieves 8 MHz gain-bandwidth and 4.5 V/µs slew rate while maintaining low distortion (0.0004% THD+N at 1 kHz, 5 V supply) and 21 nV/√Hz input voltage noise at 10 kHz - making it suitable for DC-coupled amplification and medium-bandwidth signal chains where power efficiency and precision coexist.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain-bandwidth product | 8 MHz - supports stable closed-loop operation up to ~700 kHz at gain = 10 without phase margin degradation. |
| Input offset voltage (max) | 1.5 mV at 25 °C (A grade) - enables <10 µV error in 100× gain stages for sub-mV sensor signals. |
| Supply current (typ) | 820 µA - allows >10-year battery life in coin-cell-powered devices operating at 3.3 V with duty-cycled sampling. |
| Slew rate | 4.5 V/µs - supports clean 100 kHz sine-wave output at 2 Vpp into 10 kΩ load without distortion. |
| Input bias current (typ) | 1 pA - minimizes voltage error across >1 GΩ source impedances (e.g., photodiode transimpedance feedback). |
| Rail-to-rail I/O | Input common-mode range extends 0.1 V beyond rails; output swings within 15 mV of rails at 10 kΩ - preserves dynamic range in low-voltage systems. |
| ESD protection | ≥5 kV HBM - withstands handling and board-level ESD events without latch-up or parameter shift. |
Pinout & Package
TSV911AIDT is supplied in an SO8 (Small Outline Integrated Circuit, 8-pin) package with standard 1.27 mm pitch. The exposed pad is not internally connected and may be left floating or tied to VCC− for thermal enhancement.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting input (IN−) | Negative feedback node; high-impedance CMOS input accepting signals from VCC− − 0.1 V to VCC+ + 0.1 V. |
| 2 | Non-inverting input (IN+) | Positive input node; identical voltage range and impedance as IN−; used for reference or sensor connection. |
| 3 | Output (OUT) | Capable of sourcing/sinking ≥35 mA; swings rail-to-rail into ≥600 Ω load with <150 mV saturation. |
| 4 | VCC− (ground or negative supply) | Reference return path; must be decoupled with 10 nF capacitor placed adjacent to pin. |
| 5 | NC | No internal connection; electrically isolated; may be left unconnected or grounded for mechanical stability. |
| 6 | NC | No internal connection; electrically isolated; no routing required on PCB. |
| 7 | VCC+ | Positive supply input (2.5–5.5 V); requires local 10 nF decoupling to minimize PSRR degradation. |
| 8 | NC | No internal connection; electrically isolated; no functional role in circuit operation. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full utilization of 2.5–5.5 V supply range in single-supply configurations - critical for battery voltage monitoring and analog front-ends. |
| Ultra-low input bias current (1 pA typ.) | Reduces input error voltage across high-Z sources (e.g., glass electrode pH sensors), eliminating need for guard traces or active guarding. |
| Low input offset voltage (1.5 mV max, A grade) | Supports accurate DC amplification of microvolt-level sensor outputs without trimming or auto-zeroing circuitry. |
| Unity-gain stable with 100 pF capacitive load | Eliminates need for external compensation components in driving ADC input buffers or long PCB traces. |
| Automotive-grade temperature range (−40 °C to +125 °C) | Validated for under-hood and dashboard electronics per AEC-Q100 stress testing - no derating required at max ambient. |
Applications
| Portable ECG Monitor | Automotive Cabin Air Quality Sensor |
|---|---|
|
Use Scenario: Amplifying low-amplitude (<1 mV), low-frequency (0.05–100 Hz) biopotential signals from dry electrodes in a handheld ECG device powered by a 3.7 V Li-ion cell. IC Role / Device Role: First-stage instrumentation amplifier input buffer with rail-to-rail I/O and ultra-low bias current to prevent electrode polarization errors. Use Value: 1 pA input bias current prevents DC drift during multi-minute acquisitions; 820 µA quiescent current extends battery runtime beyond 72 hours. |
Use Scenario: Conditioning analog output from NDIR CO₂ sensor in vehicle HVAC control module, operating continuously at 85 °C ambient. IC Role / Device Role: Precision voltage follower driving 10 kΩ ADC input while rejecting common-mode noise from switching regulators. Use Value: 82 dB CMRR at 25 °C and 58 dB at 125 °C maintains <0.5% measurement accuracy; −40 °C to +125 °C rating eliminates thermal derating. |
| Wearable Glucose Monitoring Patch | Industrial Battery Management System (BMS) |
|
Use Scenario: Transimpedance amplification of photocurrent from optical glucose sensor in disposable skin patch powered by CR2032 coin cell. IC Role / Device Role: Low-noise, low-power TIA stage with 1 pA input bias to maximize signal-to-noise ratio for sub-nA photocurrents. Use Value: 21 nV/√Hz input noise and 0.0007% THD+N preserve resolution of 16-bit ADC; 820 µA ICC enables >14-day operation per battery. |
Use Scenario: Cell voltage sensing in 12S lithium-ion BMS, where op amp measures 3.0–4.2 V per cell with <1 mV error over temperature. IC Role / Device Role: High-accuracy differential amplifier with 1.5 mV max Vio and 5 µV/°C drift, referenced to isolated ground plane. Use Value: Max 3 mV Vio over −40 °C to +125 °C ensures <0.07% full-scale error; rail-to-rail output drives SAR ADC directly without level-shifting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar rail-to-rail, low-power op amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV911IDT | Standard grade (7.5 mV max Vio vs. 1.5 mV), same package and pinout | Acceptable for non-precision signal paths (e.g., audio preamp, generic buffering) where offset error <10 mV is tolerable | Select when cost sensitivity outweighs DC accuracy requirements; identical footprint and layout. |
| MCP6001T-I/OT | Lower GBP (1 MHz), higher Vio (2.5 mV max), 1 µA ICC - less bandwidth and accuracy, but wider 1.8–6.0 V supply range | Better suited for ultra-low-voltage (1.8 V) logic-compatible systems where 8 MHz bandwidth is unnecessary | Choose only if operating below 2.5 V or requiring extended supply range; not drop-in due to different AC performance. |
Compared with TSV911IDT, the TSV911AIDT provides 5× tighter offset specification for precision DC gain stages; versus MCP6001T-I/OT, it delivers 8× higher bandwidth and 10× lower input bias current - making it superior for sensor interfaces demanding both speed and nanoampere-level input fidelity.
Availability
TSV911AIDT is available at Aetrix Electronics and suitable for portable medical devices, automotive cabin sensors, wearable health monitors, and industrial battery management systems requiring stable component supply with guaranteed long-term availability and AEC-Q100-compliant traceability.
Supply support for TSV911AIDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
The TSV91x series belongs to ST's precision low-power op amp product line, engineered specifically for battery-constrained, high-accuracy analog signal chains in medical, portable, and automotive applications - emphasizing rail-to-rail operation, nanoampere input bias, and robust thermal performance.
FAQ
What is the maximum capacitive load the TSV911AIDT can drive without oscillation?
The TSV911AIDT is unity-gain stable and can drive up to 100 pF capacitive load directly in voltage-follower configuration without external compensation. For loads exceeding 100 pF, ST recommends adding a small series resistor (e.g., 10–100 Ω) between the output and the load capacitance to restore phase margin - verified via bench testing and SPICE simulation using ST's official macromodel.
Does the TSV911AIDT support dual-supply operation?
Yes - the TSV911AIDT operates with split supplies as long as total supply voltage remains within 2.5 V to 5.5 V (e.g., ±2.5 V or ±1.8 V). Its rail-to-rail input common-mode range extends 0.1 V beyond each supply rail, and output swings to within 15 mV of either rail under light load, enabling true bipolar signal processing in dual-supply configurations.
How does the exposed pad on the SO8 package function?
The exposed pad on the TSV911AIDT's SO8 package is not internally connected to any die node. It may be left electrically floating or soldered to the PCB's VCC− (ground) plane solely for improved thermal dissipation - no electrical connection is required or recommended. Thermal resistance junction-to-ambient is 125 °C/W with standard 2-layer PCB copper pour.
Is the TSV911AIDT qualified for automotive use?
Yes - the TSV911AIDT is manufactured and tested to AEC-Q100 Grade 1 standards (−40 °C to +125 °C ambient), with full qualification including HTOL, TC, and ESD testing. Its ordering code "AIDT" explicitly denotes automotive qualification; data sheet specifications are guaranteed across this full temperature range without derating.
TSV911AIDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 1
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 4.5V/µs
- Gain Bandwidth Product:
- 8 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 1.5 mV
- Current - Supply:
- 820µA
- Current - Output / Channel:
- 35 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV911AIDT FAQ
1.How can I place an order for TSV911AIDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV911AIDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV911AIDT reliable?
The price and inventory of TSV911AIDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV911AIDT is usually 5 days.
3.What payment methods are accepted for TSV911AIDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV911AIDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV911AIDT?
TSV911AIDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV911AIDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV911AIDT?
For technical support, including TSV911AIDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV911AIDT requirements.
6.How does Aetrix verify that TSV911AIDT is sourced from the original manufacturer or authorized distributors?
All TSV911AIDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV911AIDT meets industry standards.
7.What is the process for return or replacement of TSV911AIDT?
All TSV911AIDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV911AIDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV911AIDT part is unused and in its original packaging.
Return procedure for TSV911AIDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV911AIDT Tags

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