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STMicroelectronics TSV912IYDT
- Part No.:
- TSV912IYDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV912IYDT.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,673
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Product details
Overview
TSV912IYDT from STMicroelectronics is a dual rail-to-rail input/output operational amplifier in TSSOP-14 package, designed for precision signal conditioning in low-voltage systems. It delivers 8 MHz gain-bandwidth, 4.5 V/µs slew rate, 1.1 mA max supply current per channel, and operates from 2.5 V to 5.5 V - enabling high-fidelity analog front-ends in battery-powered medical sensors and automotive body electronics.
For engineers reviewing the TSV912IYDT datasheet, TSV912IYDT pinout, TSV912IYDT application, or TSV912IYDT equivalent, key selection criteria include its 1 pA typical input bias current, 1.5 mV max input offset voltage (A grade), rail-to-rail swing capability, and AEC-Q100 qualified automotive reliability - critical for sensor interface stability and low-power active filtering.
Technical Context
The TSV912IYDT integrates two independent unity-gain-stable op-amps with matched AC performance: 8 MHz GBP, 4.5 V/µs slew rate, and 45° phase margin into capacitive loads up to 100 pF. Its ultra-low input bias current (1 pA typ.) and 5 µV/°C offset drift support high-impedance source interfacing without significant error accumulation across temperature.
Designed for single-supply operation down to 2.5 V, it features rail-to-rail input common-mode range (VCC− − 0.1 V to VCC+ + 0.1 V) and rail-to-rail output swing (within 15 mV of rails at 10 kΩ load), enabling full dynamic range utilization in 3.3 V and 5 V embedded systems without level-shifting circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain-bandwidth product | 8 MHz - supports stable closed-loop operation up to ~1 MHz with gain ≥ 1, suitable for anti-aliasing and reconstruction filters. |
| Supply voltage range | 2.5 V to 5.5 V - enables direct integration into Li-ion (3.0–4.2 V) and USB-powered (5 V) systems without regulation overhead. |
| Input offset voltage (max) | 1.5 mV (A grade) - ensures ≤ 0.3% error in 0.5 V full-scale sensor outputs, critical for medical instrumentation accuracy. |
| Input bias current (typ) | 1 pA - minimizes voltage error across >100 MΩ source impedances, essential for photodiode and pH electrode interfaces. |
| Slew rate | 4.5 V/µs - supports clean 10 kHz sine wave amplification at 10 Vpp without distortion, meeting audio and ultrasonic sensing requirements. |
| ESD protection | ≥5 kV HBM - provides robust handling during PCB assembly and field service in automotive cabin modules. |
| Operating temperature | −40 °C to +125 °C - qualified per AEC-Q100 Grade 1, enabling use in engine control units and ADAS domain controllers. |
Pinout & Package
TSSOP-14 package: 4.9 mm × 6.4 mm × 1.05 mm body, 0.65 mm pitch, exposed pad not internally connected (may be tied to VCC− or left floating).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Out1) | Channel 1 output | Delivers rail-to-rail sourced/sunk current up to ±35 mA; requires local 10 nF decoupling near pins 7/14. |
| 2 (In1−) | Channel 1 inverting input | High-impedance node (1 pA bias); sensitive to layout-induced leakage - guard ring recommended for <100 fA applications. |
| 3 (In1+) | Channel 1 non-inverting input | Accepts common-mode voltages from VCC− − 0.1 V to VCC+ + 0.1 V, enabling direct connection to resistive divider references. |
| 4 (VCC+) | Positive supply | Must be decoupled to VCC− (pin 11) with 10 nF ceramic capacitor placed ≤2 mm from pin; shared with Channel 2 supply. |
| 5 (In2−) | Channel 2 inverting input | Electrically isolated from In1−; matched offset and drift enable differential pair configurations without calibration. |
| 6 (In2+) | Channel 2 non-inverting input | Identical CMVR and bias specs as In1+; supports dual-channel active filtering with identical transfer functions. |
| 7 (Out2) | Channel 2 output | Independent output stage; can drive separate loads without crosstalk - verified by <−80 dB PSRR at 100 kHz. |
| 8 (NC) | No connect | Internal die pad; must remain unconnected per datasheet - no routing or thermal tie permitted. |
| 9 (NC) | No connect | Unused bond wire; floating per design - avoid solder mask openings or trace proximity. |
| 10 (NC) | No connect | Reserved for future test access; electrically open - treat as mechanical-only pin. |
| 11 (VCC−) | Negative supply / ground reference | Common return for both channels; connects to PCB ground plane via shortest possible path to minimize noise coupling. |
| 12 (NC) | No connect | Not bonded; no internal connection - leave unpopulated on footprint. |
| 13 (NC) | No connect | Die test structure; no electrical function - omit from schematic symbol. |
| 14 (NC) | No connect | Manufacturing alignment marker; no circuit role - exclude from netlist. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full-scale signal acquisition from 0 V to VCC without external level shifters - reduces BOM count in portable ECG front-ends. |
| Unity-gain stability | Eliminates need for external compensation components in buffer and gain-of-one configurations - simplifies layout in space-constrained TCU modules. |
| Low power consumption (820 µA typ.) | Permits continuous operation in always-on vehicle occupancy sensors with <10 µA total system sleep current budget. |
| High output current (35 mA) | Drives 2 kΩ loads directly - avoids external transistor buffers in thermistor linearization circuits for HVAC control. |
| AEC-Q100 Grade 1 qualification | Validated for automotive under-hood environments (−40 °C to +125 °C), including 1000-cycle thermal shock and 2000-hour HTOL testing. |
Applications
| Medical Sensor Interface | Automotive Cabin Monitoring |
|---|---|
|
Use Scenario: Amplifying microvolt-level EEG signals from dry electrodes in wearable neurofeedback headsets. IC Role / Device Role / Timing Role: Dual-channel instrumentation amplifier front-end with matched DC specs for common-mode rejection and low-noise gain. Use Value: 1 pA input bias prevents electrode polarization drift; 1.5 mV max Vio ensures <0.5% baseline error over 8-hour sessions. |
Use Scenario: Signal conditioning for capacitive touch sliders in center console infotainment panels. IC Role / Device Role / Timing Role: Dual op-amp implementing correlated double sampling (CDS) and programmable gain amplification (PGA) per channel. Use Value: Rail-to-rail output swing maintains SNR across 3.3 V supply; 8 MHz GBP supports 200 kHz modulation frequency for noise immunity. |
| Battery-Powered Gas Detection | Portable Diagnostic Ultrasound |
|
Use Scenario: Transimpedance amplification of photocurrent from NDIR CO₂ sensor elements powered by coin-cell batteries. IC Role / Device Role / Timing Role: Low-input-bias-current transimpedance amplifier with 10 MΩ feedback resistor and active filtering. Use Value: 1 pA Iib limits dark-current error to <10 µV across 100 MΩ effective source impedance - extends usable battery life to 2+ years. |
Use Scenario: Time-gain compensation (TGC) amplifiers in handheld ultrasound probe front-ends operating from 3.7 V Li-Po cells. IC Role / Device Role / Timing Role: Dual variable-gain stage providing 40 dB dynamic range adjustment with <10 ns settling time per gain step. Use Value: 4.5 V/µs slew rate enables 100 ns step response; 2.5 V min supply allows direct battery connection without LDO dropout loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV912IDT | Industrial-grade (−40 °C to +125 °C), same electrical specs but lacks AEC-Q100 qualification and automotive marking. | Approved for industrial PLC I/O modules but not automotive ECUs requiring PPAP documentation. | Select when cost sensitivity outweighs automotive qualification requirements and ambient temperature stays below 105 °C. |
| TSV992IYDT | Higher speed: 20 MHz GBP, 10 V/µs slew rate; higher ICC (1.5 mA/ch); same package and pinout. | Required for >500 kHz active filters in radar-based blind-spot detection, but increases power in always-on cabin sensors. | Choose only when bandwidth demand exceeds 8 MHz - otherwise TSV912IYDT's lower power preserves battery runtime. |
Compared with TSV912IDT, the TSV912IYDT adds AEC-Q100 compliance and tighter Vio distribution for automotive safety-critical signal chains; versus TSV992IYDT, it trades 2.5× bandwidth for 45% lower quiescent current - optimizing for energy-constrained telematics nodes.
Availability
TSV912IYDT is available at Aetrix Electronics and suitable for automotive body control modules, portable medical diagnostics, and battery-powered industrial IoT gateways requiring stable component supply with guaranteed long-term availability.
Supply support for TSV912IYDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering silicon solutions for automotive, industrial, and consumer markets since 1987.
The TSV91x series belongs to ST's precision analog portfolio, engineered specifically for low-voltage, low-power signal conditioning in automotive and medical applications where rail-to-rail operation and nanoscale input bias current are mandatory.
FAQ
What is the maximum capacitive load the TSV912IYDT can drive without external compensation?
The TSV912IYDT drives up to 100 pF capacitive loads stably in unity-gain follower configuration, as verified by ≥45° phase margin measurements at 5 V supply. For loads exceeding 100 pF, a series resistor (2–10 Ω) between output and load restores stability - values are documented in Figure 19 of DS4899 Rev 13.
Does the exposed pad on the TSSOP-14 package require grounding?
No - the exposed pad of the TSV912IYDT's TSSOP-14 package is not internally connected. Per datasheet Section 6.5, it may be left floating or tied to VCC− for improved thermal dissipation; neither choice affects electrical performance, but thermal vias to inner ground planes are recommended for >100 mW power dissipation.
How does the TSV912IYDT's input offset voltage compare between 25 °C and 125 °C?
For the A-grade version (TSV912A), input offset voltage is guaranteed ≤1.5 mV at 25 °C and ≤3.0 mV over −40 °C to +125 °C. The drift coefficient is 5 µV/°C, meaning worst-case Vio increase from 25 °C to 125 °C is 500 µV - confirmed by Figure 3's measured distribution at 125 °C showing 99.5% of units within ±3 mV.
Can the TSV912IYDT operate from a single 2.5 V supply while maintaining rail-to-rail output swing?
Yes - the TSV912IYDT achieves rail-to-rail output swing down to 2.5 V supply, delivering ≥15 mV from each rail into 10 kΩ (Table 3, VCC = 2.5 V). At 600 Ω load, swing degrades to ≥45 mV from rails, sufficient for driving ADC references or LED drivers in ultra-low-power wearables.
TSV912IYDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 4.5V/µs
- Gain Bandwidth Product:
- 8 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 4.5 mV
- Current - Supply:
- 780µA (x2 Channels)
- Current - Output / Channel:
- 35 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV912IYDT FAQ
1.How can I place an order for TSV912IYDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV912IYDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV912IYDT reliable?
The price and inventory of TSV912IYDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV912IYDT is usually 5 days.
3.What payment methods are accepted for TSV912IYDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV912IYDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV912IYDT?
TSV912IYDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV912IYDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV912IYDT?
For technical support, including TSV912IYDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV912IYDT requirements.
6.How does Aetrix verify that TSV912IYDT is sourced from the original manufacturer or authorized distributors?
All TSV912IYDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV912IYDT meets industry standards.
7.What is the process for return or replacement of TSV912IYDT?
All TSV912IYDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV912IYDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV912IYDT part is unused and in its original packaging.
Return procedure for TSV912IYDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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