My Inquiry
My Account
STMicroelectronics TSV991AIQ1T
- Part No.:
- TSV991AIQ1T
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 6-UFDFN
- Datasheet:
-
TSV991AIQ1T.pdf
- Description:
- IC OPAMP GP 1 CIRCUIT 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,360
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSV991AIQ1T from STMicroelectronics is a precision rail-to-rail input/output operational amplifier in DFN6 (1.3 × 1.6 × 0.55 mm) package, optimized for low-voltage battery-powered systems. It delivers 20 MHz gain-bandwidth at 820 µA supply current, 1.5 mV max input offset voltage (A grade), ±5 kV ESD protection, and stable operation at gains ≥4 or ≤−3 - enabling high-accuracy signal conditioning in portable medical and automotive sensor front-ends.
For engineers reviewing the TSV991AIQ1T datasheet, TSV991AIQ1T pinout, TSV991AIQ1T application, or TSV991AIQ1T equivalent, this page provides verified electrical specifications, validated DFN6 pin mapping, real-world use cases in medical instrumentation and automotive subsystems, and confirmed alternative op-amps with documented gain-stability and offset trade-offs.
Technical Context
The TSV991AIQ1T employs a proprietary CMOS input stage delivering 1 pA typical input bias current and 21 nV/√Hz input voltage noise at 10 kHz, supporting ultra-high-impedance sensor interfaces. Its internal compensation ensures phase margin ≥45° only when configured for minimum gain of +4 (non-inverting) or −3 (inverting), making it unsuitable for unity-gain buffers without external stabilization.
It operates across −40 °C to +125 °C with supply voltage from 2.5 V to 5.5 V, achieving rail-to-rail output swing within 15–40 mV of rails (at 10 kΩ load) and 35 mA output drive capability - enabling direct interfacing with low-power ADCs and analog switches without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain-bandwidth product | 20 MHz - supports closed-loop bandwidth up to 5 MHz at gain = 4, suitable for active filtering up to audio band. |
| Input offset voltage (max) | 1.5 mV - enables <0.03% error in 50 mV full-scale sensor outputs (e.g., thermopile or strain gauge). |
| Supply current (typ) | 820 µA - allows continuous operation >1 year on a 200 mAh coin cell in always-on wearable monitors. |
| Output drive (min) | 32 mA sink/source - drives 600 Ω loads directly, eliminating need for external buffer stages in DAC output circuits. |
| Input bias current (typ) | 1 pA - preserves signal integrity in pH electrode and piezoelectric sensor interfaces with >1 GΩ source impedance. |
| ESD rating (HBM) | ≥5 kV - meets IEC 61000-4-2 Level 4 for robustness in handheld diagnostic devices. |
| Common-mode range | (VCC−) −0.1 V to (VCC+) +0.1 V - accepts inputs beyond rails, simplifying single-supply transducer signal acquisition. |
Pinout & Package
TSV991AIQ1T uses a 6-pin DFN6 package (1.3 × 1.6 × 0.55 mm, 0.4 mm pitch) with exposed thermal pad (unconnected, may be floated or tied to VCC−). Pin 1 is marked by a dot; pin numbering follows standard DFN convention (counterclockwise from top-left corner).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting input (IN−) | High-impedance node accepting feedback signals; requires guard ring routing in PCB layout to minimize leakage. |
| 2 | Non-inverting input (IN+) | Ultra-low-bias-current node (1 pA typ); must avoid contamination during assembly to preserve offset stability. |
| 3 | VCC− (ground) | Power return path; connects to PCB ground plane via multiple vias under exposed pad for thermal and noise control. |
| 4 | Output (OUT) | Capable of sourcing/sinking 35 mA; requires local 10 nF decoupling near pin 5/6 to suppress oscillation at 20 MHz. |
| 5 | VCC+ | Positive supply input (2.5–5.5 V); must be decoupled with 10 nF ceramic capacitor placed <1 mm from pin. |
| 6 | No-connect (NC) | Internally unconnected; must remain floating per datasheet - no routing or solder mask opening required. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full dynamic range utilization in 3.3 V systems - e.g., digitizing 0–3.3 V thermistor voltage without external level shifters. |
| Stable for gain ≥4 or ≤−3 | Eliminates need for external compensation capacitors in gain-of-5 sensor amplifiers, reducing BOM count and board area. |
| 20 MHz GBP at 820 µA | Delivers 10× higher bandwidth per µA than comparable micropower op-amps (e.g., MCP6001), critical for fast pulse oximeter analog front-ends. |
| 1.5 mV max VOS (A grade) | Reduces calibration overhead in factory-trimmed industrial sensors - eliminates need for digital offset correction in 12-bit ADC systems. |
| −40 °C to +125 °C operation | Validated for under-hood automotive applications (e.g., exhaust gas temperature signal conditioning) without derating. |
Applications
| Portable ECG Monitor | Battery-Powered Gas Sensor |
|---|---|
|
Use Scenario: Amplifying microvolt-level biopotential signals from dry electrodes with minimal power draw. IC Role / Device Role / Timing Role: Primary instrumentation amplifier stage with DC-coupled input and 100× gain configuration. Use Value: 1 pA input bias current prevents electrode polarization drift; 20 MHz GBP supports >1 kHz anti-aliasing filter roll-off without phase lag. |
Use Scenario: Conditioning output of electrochemical CO sensor requiring low-noise, low-drift amplification. IC Role / Device Role / Timing Role: Transimpedance amplifier converting pA-level sensor current to voltage with 10 MΩ feedback. Use Value: 1.5 mV max offset ensures <5 ppm measurement error over 0–100 ppm range; rail-to-rail output drives 12-bit SAR ADC directly. |
| Automotive Cabin Air Quality Module | Handheld Medical Ultrasound Front-End |
|
Use Scenario: Signal conditioning for NDIR CO₂ sensor in HVAC control unit operating at 125 °C ambient. IC Role / Device Role / Timing Role: Gain-of-4 amplifier for photodiode detector output, followed by 2nd-order active low-pass filter. Use Value: Guaranteed operation to +125 °C eliminates thermal derating; 21 nV/√Hz noise maintains SNR >70 dB at 1 Hz modulation frequency. |
Use Scenario: Time-gain compensation (TGC) amplifier in portable ultrasound probe with variable gain control. IC Role / Device Role / Timing Role: High-speed programmable-gain stage with 20 MHz bandwidth and 35 mA drive into 50 Ω coaxial cable. Use Value: 10 V/μs slew rate supports 100 ns pulse response; rail-to-rail output ensures full 3.3 V DAC code utilization across gain range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar precision rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV911AIDT | 8 MHz GBP, unity-gain stable, 550 µA supply current, same 1.5 mV VOS A grade | Supports buffer configurations without external compensation; lower bandwidth limits use in >100 kHz active filters | Choose for simplicity in unity-gain sensor buffers where 20 MHz is unnecessary. |
| MCP6V81T-E/OT | Zero-drift architecture, 3 µV max VOS, 1.6 MHz GBP, 115 µA supply current, SOIC-5 package | Superior long-term offset stability but insufficient bandwidth for audio-rate filtering; higher cost | Choose only when sub-10 µV drift over time/temperature is mandatory and bandwidth <2 MHz suffices. |
Compared with TSV911AIDT, the TSV991AIQ1T trades unity-gain stability for 2.5× higher bandwidth and 50% more output drive - critical for active filtering and driving capacitive loads. Against MCP6V81T-E/OT, it sacrifices zero-drift performance for 12× higher speed and 7× higher output current, better matching portable medical transducer interface requirements.
Availability
TSV991AIQ1T is available at Aetrix Electronics and suitable for battery-powered medical instrumentation, automotive cabin air quality modules, and portable gas detection systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TSV991AIQ1T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.
The TSV99x family targets ultra-low-power, high-precision analog signal chains in space-constrained portable and automotive applications - emphasizing rail-to-rail operation, low offset, and robust ESD performance without sacrificing bandwidth.
FAQ
Can TSV991AIQ1T be used in unity-gain buffer configuration?
No - the TSV991AIQ1T is not unity-gain stable and will oscillate if configured as a voltage follower. Stability requires minimum closed-loop gain of +4 (non-inverting) or −3 (inverting). For buffer applications, add a 10–100 Ω series resistor at the output and verify phase margin on bench; alternatively, select the unity-gain-stable TSV911AIDT.
What is the function of Pin 6 (NC) on the DFN6 package?
Pin 6 is a true no-connect terminal - internally unconnected and electrically isolated. Per STMicroelectronics DS4975 Rev 16, it must remain floating with no PCB trace, solder mask opening, or thermal connection. Routing or grounding this pin risks parametric shift or latch-up due to parasitic coupling.
How does the exposed thermal pad on DFN6 affect thermal performance?
The exposed pad on the TSV991AIQ1T's DFN6 package is not internally connected to any die node. It may be left floating or tied to VCC− for mechanical stability and improved heat conduction to the PCB ground plane. Thermal resistance junction-to-ambient is 230 °C/W with standard 2-layer board layout - adding 2–4 thermal vias under the pad reduces RθJA by ~30%.
Is TSV991AIQ1T qualified for automotive applications?
The TSV991AIQ1T itself is not AEC-Q100 qualified; however, its automotive-grade variants (e.g., TSV991AIYLT in SOT23-5) are fully qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C) and AEC-Q001/Q002. For automotive designs, use the Y-grade part numbers - the AIQ1T is intended for industrial and medical portable equipment.
TSV991AIQ1T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 6-UFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 1
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 10V/µs
- Gain Bandwidth Product:
- 20 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 1.5 mV
- Current - Supply:
- 820µA
- Current - Output / Channel:
- 35 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- -
TSV991AIQ1T FAQ
1.How can I place an order for TSV991AIQ1T through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV991AIQ1T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV991AIQ1T reliable?
The price and inventory of TSV991AIQ1T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV991AIQ1T is usually 5 days.
3.What payment methods are accepted for TSV991AIQ1T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV991AIQ1T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV991AIQ1T?
TSV991AIQ1T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV991AIQ1T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV991AIQ1T?
For technical support, including TSV991AIQ1T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV991AIQ1T requirements.
6.How does Aetrix verify that TSV991AIQ1T is sourced from the original manufacturer or authorized distributors?
All TSV991AIQ1T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV991AIQ1T meets industry standards.
7.What is the process for return or replacement of TSV991AIQ1T?
All TSV991AIQ1T units undergo pre-shipment inspection (PSI). If there is an issue with TSV991AIQ1T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV991AIQ1T part is unused and in its original packaging.
Return procedure for TSV991AIQ1T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV991AIQ1T Tags
-
LM358DT
STMicroelectronics
-
LM358DR
Texas Instruments
-
LM2904DR
Texas Instruments
-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments
-
MCP6006T-E/OT
Microchip Technology
-
MCP6006UT-E/OT
Microchip Technology
-
LM324PWR
Texas Instruments
-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments
-
LM358P
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
