STMicroelectronics TSV994AID

Overview

TSV994AID from STMicroelectronics is a quad rail-to-rail input/output operational amplifier with 20 MHz gain-bandwidth, 1.5 mV max input offset voltage (A grade), 820 µA typical supply current per channel, and operation from 2.5 V to 5.5 V. It is stable for closed-loop gains ≥ 4 or ≤ –3 and delivers ±35 mA output drive-used in precision sensor signal conditioning within automotive body control modules.

For engineers reviewing the TSV994AID datasheet, TSV994AID pinout, TSV994AID application, or TSV994AID equivalent, key selection criteria include its A-grade offset voltage tolerance, gain-stability constraints, rail-to-rail swing at low supply, ultra-low 1 pA input bias current, and SO14 package thermal resistance of 103 °C/W.

Technical Context

The TSV994AID implements a high-speed, low-power CMOS input stage enabling 1 pA typical input bias current and 21 nV/√Hz input voltage noise at 10 kHz. Its internal compensation requires minimum closed-loop gain of 4 (non-inverting) or –3 (inverting) for phase margin ≥45° with 100 pF capacitive load.

It supports full rail-to-rail common-mode input range (VCC– –0.1 V to VCC+ +0.1 V) and output swing within 15 mV of rails (RL = 10 kΩ), while maintaining 75 dB CMRR and 82 dB SVR across 2.5–5 V supplies-enabling direct interfacing with SAR ADCs and low-voltage microcontrollers.

Key Specifications

Pinout & Package

TSV994AID is supplied in SO14 (Small Outline 14-pin) package with exposed pad not internally connected. Pin 1 is marked by notch or dot; device orientation follows JEDEC MS-012 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad rail-to-rail op-amp applications.

Compared with TSV994IDT, the TSV994AID provides 5× tighter offset control essential for precision DC-coupled measurements; versus TSV914AIDT, it trades 2.5× higher power for 3× greater bandwidth and 3× higher output current-critical for driving reactive loads in active filters.

Availability

TSV994AID is available at Aetrix Electronics and suitable for automotive body electronics, portable medical diagnostics, industrial sensor nodes, and active filter designs requiring stable component supply across extended temperature ranges.

Supply support for TSV994AID includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

The TSV99x family targets precision, low-voltage analog signal conditioning-specifically engineered for battery-operated and automotive-grade applications demanding rail-to-rail operation, low offset, and robust capacitive-load drive.

FAQ

Is TSV994AID unity-gain stable?

No. The TSV994AID is compensated for minimum closed-loop gains of ≥4 (non-inverting) or ≤–3 (inverting). Using it as a unity-gain buffer requires adding a series resistor (≥10 Ω) at the output to ensure stability with capacitive loads. This is explicitly documented in Section 5.1 of DS4975 Rev 16.

What is the thermal resistance (R_thJA) of the SO14 package?

The SO14 package has a typical junction-to-ambient thermal resistance of 103 °C/W, as specified in Table 1 of DS4975 Rev 16. This value assumes standard JEDEC 2-layer board layout with 1 in² copper pour; actual thermal performance improves with enhanced copper area or thermal vias to inner ground planes.

Can TSV994AID drive a 100 pF capacitive load directly?

Yes-but only when configured with gain ≥4 or ≤–3. At those gains, phase margin remains ≥45° with 100 pF load (per Table 3 AC performance conditions). Driving 100 pF at unity gain will cause peaking or oscillation; stability must be verified on bench with actual PCB layout and load.

Does the exposed pad on SO14 require connection?

No-the SO14 package does not feature an exposed thermal pad. That feature applies only to DFN8 and DFN6 variants. The SO14's thermal path relies solely on leads; no internal connection exists for pad soldering, and no thermal pad footprint is defined in Figure 26 of DS4975 Rev 16.