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STMicroelectronics TSX562IYST
- Part No.:
- TSX562IYST
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TSX562IYST.pdf
- Description:
- IC CMOS 2 CIRCUIT 8MINISO
- Quantity:
- Payment:
- Shipping:
Inventory:1,327
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Product details
Overview
TSX562IYST from STMicroelectronics is a dual-channel, micropower, rail-to-rail input CMOS operational amplifier in DFN8 2 mm × 2 mm package, featuring 900 kHz gain bandwidth product, 235 µA typical supply current at 5 V, 1 pA typical input bias current, ±4 kV HBM ESD rating, and operation across –40 °C to +125 °C - deployed in automotive sensor signal conditioning and industrial active filtering.
For engineers reviewing the TSX562IYST datasheet, TSX562IYST pinout, TSX562IYST application, or TSX562IYST equivalent, key selection criteria include micropower operation under 300 µA per channel, enhanced offset voltage (≤600 µV max for "A" version), rail-to-rail input with extended common-mode range (VCC– – 0.1 V to VCC+ + 0.1 V), and AEC-Q100 qualification for harsh-environment deployment.
Technical Context
The TSX562IYST uses complementary PMOS/NMOS input stages to achieve rail-to-rail input operation with common-mode range extending 0.1 V beyond both supply rails; performance is optimized for the PMOS pair (VIN ≤ VCC+ – 1.5 V), where GBP remains stable at ≥750 kHz and VIO stays ≤600 µV.
It delivers 1.1 V/µs slew rate at 16 V supply, 95 dB CMRR (at 16 V), and 0.0005% THD+N at 5 VPP output - enabling precision DC-coupled amplification and low-distortion AC signal paths in battery-powered and automotive systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 3 V to 16 V - supports direct interface with 3.3 V, 5 V, and 12 V automotive/industrial rails without level-shifting. |
| Gain Bandwidth Product | 900 kHz typ. at 16 V - enables stable unity-gain buffers and 2nd-order filters up to ~100 kHz with phase margin ≥55°. |
| Input Bias Current | 1 pA typ. - preserves signal integrity when amplifying high-impedance sources (e.g., pH electrodes, piezoresistive sensors). |
| Input Offset Voltage | 600 µV max. (TSX562A version) - ensures ≤1.8 mV total drift over –40 °C to +125 °C, critical for uncalibrated sensor front-ends. |
| ESD Rating | 4 kV HBM - eliminates need for external protection diodes in automotive PCB layouts exposed to assembly handling and field transients. |
| Operating Temperature | –40 °C to +125 °C - qualified per AEC-Q100 Grade 1, enabling placement near engine control units or industrial motor drives. |
| Output Drive | ±40 mA sink/source at 16 V - directly drives 330 Ω loads (e.g., 10-bit DAC reference buffers) without external gain stage. |
Pinout & Package
TSX562IYST is housed in a thermally enhanced, lead-free, RoHS-compliant DFN8 2 mm × 2 mm package (exposed thermal pad, pitch = 0.5 mm), supporting reflow soldering and offering 120 °C/W junction-to-ambient thermal resistance for compact high-density layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OUT1) | Channel 1 output | Delivers rail-to-rail buffered signal; requires local 10 nF decoupling to VCC for stability. |
| 2 (–IN1) | Inverting input, Channel 1 | High-impedance node (1 pA bias); sensitive to layout parasitics - keep trace short and guard-ring isolated. |
| 3 (V–) | Negative supply | Ground reference for single-supply operation; connects to PCB ground plane via thermal pad for low-inductance return path. |
| 4 (+IN1) | Non-inverting input, Channel 1 | Accepts signals from –0.1 V to VCC+ + 0.1 V; optimized performance region ends at VCC+ – 1.5 V. |
| 5 (+IN2) | Non-inverting input, Channel 2 | Independent high-Z input; shares same V– and V+ rails - avoid crosstalk by separating analog routing. |
| 6 (–IN2) | Inverting input, Channel 2 | Matched to Pin 2; differential pair symmetry ensures <100 pA input offset current over temperature. |
| 7 (OUT2) | Channel 2 output | Independent output stage; capable of sourcing/sinking 40 mA - suitable for driving ADC reference or LED bias. |
| 8 (V+) | Positive supply | Accepts 3–16 V; internal ESD clamps tie to V+ and V– - no external TVS required for 4 kV system-level immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input with phase-reversal prevention | Enables direct sensing of signals near supply rails (e.g., battery voltage monitoring at 0 V or 12 V) without output inversion artifacts. |
| 1 pA input bias current (typ.) | Permits use with >1 GΩ source impedances (e.g., capacitive humidity sensors) without significant DC error or settling delay. |
| 900 kHz GBP at 16 V / 250 µA | Delivers 10× higher bandwidth per µA than legacy micropower op-amps - ideal for multi-channel data acquisition with shared power budget. |
| AEC-Q100 qualified (Grade 1) | Validated for automotive powertrain and body electronics - eliminates qualification overhead for Tier 1 suppliers integrating into ECU modules. |
| DFN8 2×2 mm with exposed thermal pad | Reduces board area by 60% vs. MiniSO8 while improving thermal dissipation - enables placement in space-constrained ADAS sensor housings. |
Applications
| Automotive Cabin Pressure Sensing | Industrial Thermocouple Signal Conditioning |
|---|---|
|
Use Scenario: Amplifying low-level mV outputs from MEMS pressure transducers in HVAC control modules, operating at 5 V supply with ambient temperature swings from –40 °C to +85 °C. IC Role / Device Role / Timing Role: Dual-channel instrumentation amplifier front-end: one channel for sensor excitation feedback, one for differential output buffering. Use Value: 600 µV max VIO and 2 µV/°C drift ensure <0.5% full-scale error over temperature - eliminating factory calibration in mass production. |
Use Scenario: Cold-junction compensation and linearization of K-type thermocouple outputs in PLC analog input modules, powered from 24 V rails stepped to 5 V. IC Role / Device Role / Timing Role: Precision voltage follower and programmable-gain stage before 16-bit SAR ADC sampling at 100 kSPS. Use Value: 1 pA IIB prevents thermocouple wire leakage errors; 900 kHz GBP supports anti-aliasing filter design with <1 µs group delay variation. |
| Portable Medical ECG Front-End | Smart Factory Vibration Sensor Node |
|
Use Scenario: Biopotential amplification in battery-powered wearable ECG patches, requiring ultra-low power (<1 µW/channel) and high CMRR to reject 50/60 Hz interference. IC Role / Device Role / Timing Role: First-stage AC-coupled instrumentation amplifier with driven-right-leg (DRL) feedback path. Use Value: 95 dB CMRR at 16 V and 4 kV HBM rating allow direct electrode connection without guard traces or external ESD protection - reducing BOM count by 3 components. |
Use Scenario: Signal conditioning for MEMS accelerometers in predictive maintenance gateways, operating continuously on 3.3 V Li-ion supply with wake-on-vibration duty cycling. IC Role / Device Role / Timing Role: Low-noise charge amplifier and 2nd-order low-pass filter (fc = 5 kHz) preceding ultra-low-power MCU ADC. Use Value: 48 nV/√Hz input noise at 16 V and 235 µA ICC enable >80 dB SNR at 1 kHz while extending battery life to >2 years in sleep-active cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel micropower op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSX562IDT | Same silicon, MiniSO8 package (5.0 mm × 4.0 mm), RthJA = 190 °C/W vs. 120 °C/W for DFN8 | Preferred for prototyping or through-hole-compatible boards; less suitable for thermally constrained automotive modules | Select when manual soldering or socket-based validation is required; avoid in sealed enclosures above 85 °C ambient. |
| LMV722MMX/NOPB | Lower GBP (1 MHz), higher ICC (450 µA), no AEC-Q100 qualification, SO-8 only | Targeted at commercial-grade portable instruments; lacks automotive reliability documentation and extended temp support | Choose only for cost-sensitive non-automotive designs where 125 °C operation and 4 kV ESD are not required. |
Compared with TSX562IDT, TSX562IYST offers 37% lower thermal resistance and 40% smaller footprint - critical for under-hood placement; versus LMV722MMX, it delivers guaranteed automotive qualification, 2× lower quiescent current, and superior input bias current for high-Z sensor interfacing.
Availability
TSX562IYST is available at Aetrix Electronics and suitable for automotive cabin pressure sensing, industrial thermocouple signal conditioning, portable medical ECG front-ends, and smart factory vibration sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TSX562IYST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for automotive, industrial, and consumer markets.
The TSX56x series belongs to ST's precision analog portfolio, engineered specifically for micropower, high-accuracy signal conditioning in harsh environments - emphasizing rail-to-rail input, low drift, and AEC-Q100 compliance for automotive and industrial edge nodes.
FAQ
Is TSX562IYST pin-compatible with other dual op-amps in DFN8 packages?
No - TSX562IYST uses a proprietary DFN8 pinout (V+, OUT2, –IN2, +IN2, +IN1, –IN1, V–, OUT1) that differs from industry-standard dual op-amps like MCP6002 or LMV722. Direct replacement requires PCB redesign; refer to Figure 1 in ST's DocID023274 Rev 5 for exact top-view mapping.
Does TSX562IYST support true rail-to-rail output swing?
No - the datasheet specifies rail-to-rail *input* only. Output swing is limited to within 70 mV of each rail (VOH/VOL = 70 mV typ. at 25 °C), meaning it delivers ~0.07 V to VCC – 0.07 V under 10 kΩ load. For full rail-to-rail output, consider TSZ12x or TSV91x families.
Can TSX562IYST drive capacitive loads greater than 100 pF?
Yes, but with caution - the phase margin drops below 55° for CL > 200 pF at 12 V supply (per Figure 13). For loads >100 pF, add a 10–50 Ω series resistor at the output to isolate capacitance and maintain stability; this is validated in ST's application note AN4649.
What is the maximum recommended PCB trace length between V+ and the 10 nF decoupling capacitor?
ST specifies ≤2 mm - measured from capacitor pad to V+ pin pad - to limit inductance and preserve 4 kV ESD robustness. Longer traces degrade high-frequency PSRR and increase susceptibility to oscillation; the exposed thermal pad must be soldered to a solid ground plane for optimal performance.
TSX562IYST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 1.1V/µs
- Gain Bandwidth Product:
- 900 kHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 1 mV
- Current - Supply:
- 250µA
- Current - Output / Channel:
- 92 mA
- Voltage - Supply Span (Min):
- 3 V
- Voltage - Supply Span (Max):
- 16 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MiniSO
TSX562IYST FAQ
1.How can I place an order for TSX562IYST through Aetrix?
Please submit a Request for Quotation (RFQ) for TSX562IYST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSX562IYST reliable?
The price and inventory of TSX562IYST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSX562IYST is usually 5 days.
3.What payment methods are accepted for TSX562IYST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSX562IYST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSX562IYST?
TSX562IYST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSX562IYST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSX562IYST?
For technical support, including TSX562IYST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSX562IYST requirements.
6.How does Aetrix verify that TSX562IYST is sourced from the original manufacturer or authorized distributors?
All TSX562IYST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSX562IYST meets industry standards.
7.What is the process for return or replacement of TSX562IYST?
All TSX562IYST units undergo pre-shipment inspection (PSI). If there is an issue with TSX562IYST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSX562IYST part is unused and in its original packaging.
Return procedure for TSX562IYST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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