Infineon Technologies TT61N16KOFHPSA1

Overview

TT61N16KOFHPSA1 from Infineon Technologies is a phase-control thyristor module rated for 1600 V repetitive peak off-state voltage (VDRM/VRRM), 120 A RMS on-state current (ITRMSM), and 76 A average on-state current at TC = 76°C. It features a dual-thyristor (B6-bridge compatible) configuration in an isolated press-pack package with AlN ceramic insulation, designed for industrial AC power control in medium-voltage motor drives and DC power supplies.

For engineers reviewing the TT61N16KOFHPSA1 datasheet, TT61N16KOFHPSA1 pinout, TT61N16KOFHPSA1 application, or TT61N16KOFHPSA1 equivalent, key selection criteria include its 1000 V/µs critical dv/dt rating, 150 A/µs critical di/dt capability, 125°C maximum junction temperature, and UL E83336 listing - all essential for reliable operation in forced-cooled rectifier and phase-angle control systems.

Technical Context

This thyristor module implements a dual-anode, dual-cathode symmetrical structure enabling B6 six-pulse bridge configurations without external series/parallel stacking. Its pressure-contact silicon pellet design with aluminum nitride (AlN) isolation ensures stable thermal performance under high di/dt and dv/dt transients typical of line-commutated converters.

The device operates with gate trigger current ≤120 mA and holding current ≤200 mA, supporting standard pulse transformer or optocoupler-based firing circuits. Its 120 µs typical turn-off time (tq) and 9800 A²s I²t rating at Tvj max allow robust short-circuit withstand in industrial rectification applications up to 500 V DC output.

Key Specifications

Pinout & Package

TT61N16KOFHPSA1 uses a press-pack, double-sided cooled module housing with isolated copper baseplate and AlN ceramic dielectric. Mechanical mounting uses M1 screws (4 Nm ±15%) and M2 terminal screws (4 Nm ±10%). Control terminals conform to DIN 46244 A (2.8 × 0.8 mm).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar phase-control thyristor module applications.

Compared with TT61N16KOFHPSA1, TT61N16KOIHPSA1 trades thermal efficiency for lower cost in less demanding cooling environments, while TT105N16KOFHPSA1 provides scalable current capacity within identical mechanical and control interfaces - enabling drop-in upgrades without gate driver or layout changes.

Availability

TT61N16KOFHPSA1 is available at Aetrix Electronics and suitable for industrial motor drives, DC power supplies, welding equipment, and traction converters requiring stable component supply across extended production lifecycles.

Supply support for TT61N16KOFHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and industrial control devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

This part belongs to Infineon's BIP AC thyristor module product line, engineered specifically for high-reliability, medium-voltage AC power control in industrial automation, energy infrastructure, and heavy machinery applications.

FAQ

What is the recommended gate drive circuit for TT61N16KOFHPSA1?

A pulse transformer or isolated gate driver delivering ≥1 A peak gate current with <3 µs delay (tgd) and ≥120 mA steady-state trigger current is required. Gate resistors must limit IGT to ≤120 mA at 6 V forward voltage, and negative gate bias (≤−0.2 V) prevents false triggering during high dv/dt events.

Can TT61N16KOFHPSA1 be used in parallel configurations?

No - this module is not designed for paralleling. Its pressure-contact construction and lack of dynamic current-sharing features (e.g., emitter ballasting or matched dv/dt) make parallel operation unreliable. For higher current, use higher-rated variants like TT105N16KOFHPSA1 or multi-module B6 arrangements with individual firing control.

What thermal interface material is specified for mounting?

Infineon specifies no thermal compound; direct metal-to-metal contact between the module's copper baseplate and heatsink is required. Surface roughness ≤1.6 µm Ra and flatness ≤0.05 mm over the mounting area ensure optimal thermal transfer. Use only torque-controlled tightening (4 Nm ±10%) to avoid uneven pressure distribution.

Does TT61N16KOFHPSA1 support reverse conduction?

No - it is a unidirectional thyristor module. Each arm conducts only from anode to cathode when triggered. Reverse conduction requires external anti-parallel diodes or use of a back-to-back thyristor configuration (e.g., two TT61N16KOFHPSA1 modules per phase in a cycloconverter).