Infineon Technologies TTB6C95N16LOF

Overview

TTB6C95N16LOF from Infineon Technologies is a 6-pulse, dual anti-parallel thyristor module in ISOPACK housing for phase-controlled AC power regulation. It delivers 95 A output current at TC = 85°C, supports 1600 V repetitive peak off-state voltage (VDRM/VRRM), and features glass-passivated silicon chips with Al₂O₃ internal insulation-used in industrial AC motor speed controllers and high-power heating systems.

For engineers reviewing the TTB6C95N16LOF datasheet, TTB6C95N16LOF pinout, TTB6C95N16LOF application, or TTB6C95N16LOF equivalent, key selection criteria include RMS on-state current per chip (75 A), critical di/dt (120 A/µs), gate trigger current (≤150 mA), and thermal resistance junction-to-case (0.137 °C/W).

Technical Context

This module implements a fully isolated, dual anti-parallel thyristor configuration for bidirectional AC line switching in 3-phase bridge rectifier and phase-angle control topologies. Its 125 °C maximum junction temperature, 3.0 kV RMS insulation test voltage, and 120° conduction angle thermal rating support continuous operation under heavy industrial loads.

The device uses solder-bonded, glass-passivated Si pellets with Al₂O₃ ceramic isolation to ensure stable dv/dt immunity (1000 V/µs) and low thermal impedance. Gate drive requirements are defined by IGT ≤ 150 mA and VGT ≤ 2.5 V at 25°C, with latching current IL ≤ 600 mA and holding current IH ≤ 200 mA.

Key Specifications

Pinout & Package

TTB6C95N16LOF is housed in an ISOPACK package-a press-fit, insulated metal-base module with integrated ceramic isolation and M1/M2 screw terminals. Dimensions and mechanical layout conform to Infineon's BIP PPE4 rev. 2 specification (page 3). Mounting torque: 6 Nm ±15% (mechanical), +5%/−10% (electrical terminals).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar phase-control thyristor module applications.

Compared with TD B6HK95N16, TTB6C95N16LOF adds reinforced insulation and eliminates need for external isolation barriers; versus TTB6C125N16LOF, it trades 30 A output headroom for tighter thermal budget and lower gate drive energy demand.

Availability

TTB6C95N16LOF is available at Aetrix Electronics and suitable for industrial AC motor drives, resistive load power controllers, medium-voltage rectification, and reactive power compensation requiring stable component supply across multi-year production cycles.

Supply support for TTB6C95N16LOF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy markets.

This part belongs to Infineon's ISOPACK thyristor module product line, engineered for high-reliability phase-control applications in harsh industrial environments where galvanic isolation, thermal robustness, and surge immunity are critical.

FAQ

What is the maximum allowable case temperature for continuous operation?

The datasheet specifies a maximum case temperature (Tc) of 85°C for rated 95 A output current. At higher case temperatures, output current must be linearly derated per the Tc = f(Id) curve on page 6. Operation above 125°C junction temperature violates absolute maximum ratings and risks irreversible device failure.

Can TTB6C95N16LOF be used in single-phase applications?

Yes-it supports single-phase phase-control topologies such as half-wave or full-wave AC regulators. Its dual anti-parallel configuration allows bidirectional conduction without external reverse-blocking devices, though gate timing must be synchronized to the AC waveform zero-crossing for stable operation.

What gate drive voltage and current are required for reliable turn-on?

A minimum gate trigger voltage of 2.5 V and current of 150 mA at 25°C guarantees turn-on. For robust operation across temperature and aging, gate drivers should deliver ≥3 V and ≥200 mA peak pulse with diG/dt ≥ 0.6 A/µs, as specified in the characteristic values section.

How does the ISOPACK insulation affect PCB or heatsink layout?

The Al₂O₃ internal insulation eliminates need for insulating washers or pads between module baseplate and heatsink. However, creepage distance of 12.5 mm must be maintained between high-voltage terminals and any nearby low-voltage traces or components-requiring careful spacing in enclosure and heatsink cutouts.