Texas Instruments TUSB213IRGYT
- Part No.:
- TUSB213IRGYT
- Manufacturer:
- Texas Instruments
- Category:
- Specialized
- Package:
- 14-VFQFN Exposed Pad
- Datasheet:
-
TUSB213IRGYT.pdf
- Description:
- IC INTERFACE SPECIALIZED 14VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:324
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Product details
Overview
TUSB213IRGYT from Texas Instruments is a USB 2.0 High-Speed signal conditioner IC designed to restore signal integrity in lossy USB channels. It compensates for inter-symbol interference (ISI) in HS (480 Mbps) signals while transparently passing LS/FS traffic, supports up to 5 m pre-channel or 2 m post-channel cable lengths, and features programmable AC/DC boost via EQ and DC_BOOST pins for compliance with USB electrical specifications in notebooks, docking stations, and active cables.
For engineers reviewing the TUSB213IRGYT datasheet, TUSB213IRGYT pinout, TUSB213IRGYT application, or TUSB213IRGYT equivalent, key selection considerations include its dual-port HS channel architecture, tri-level DC boost (40/60/80 mV), four-level AC boost configuration, I²C or pin-strap configurability, and host/device-agnostic D1P/D1M and D2P/D2M port interchangeability.
Technical Context
The TUSB213IRGYT implements a patent-pending signal conditioning architecture that applies adaptive equalization only to USB 2.0 High-Speed differential signals (480 Mbps), leaving Low-Speed (1.5 Mbps) and Full-Speed (12 Mbps) signaling unaltered. Its dual-path design allows flexible placement-D1P/D1M facing the USB transceiver and D2P/D2M toward the connector-or reversed orientation.
Configuration is supported via either pin-strapping (EQ for AC boost, DC_BOOST for DC gain) or 100 kHz I²C interface (7-bit address 0x2C), with register-based control of ACB_LVL (0–3), DCB_LVL (011/101/111), and CFG_ACTIVE mode bit. Device state transitions (LS/FS/HS/Shutdown) are fully automatic based on line detection and RSTN assertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Signal Rate | 480.24 Mbps High-Speed USB 2.0 data rate; ensures full backward compatibility with USB 2.0 PHYs. |
| AC Boost Levels | Four selectable levels via external EQ pulldown resistor (0–3); enables precise tuning to channel loss profiles. |
| DC Boost Settings | Three configurable DC gain offsets: 40 mV (L), 60 mV (M, default), 80 mV (H); mitigates low-frequency attenuation in long traces/cables. |
| Power Consumption | 30 mA typical active current at 480 Mbps; 1.5 mA suspend current; ultra-low disconnect current (0.86–1.5 mA) extends system power efficiency. |
| Operating Temperature | –40°C to +85°C (TUSB213I grade); qualified for industrial and consumer embedded platforms including docking stations and tablets. |
| ESD Robustness | ±2000 V HBM, ±500 V CDM; meets stringent USB system-level ESD requirements without external protection. |
| Package | VQFN-14 (RGY), 3.5 mm × 3.5 mm; thermally enhanced with exposed thermal pad (RθJB = 24.2°C/W) for high-density PCB layouts. |
Pinout & Package
VQFN-14 (RGY) package with 3.5 mm × 3.5 mm body size and exposed thermal pad for efficient heat dissipation in space-constrained USB routing paths.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EQ | AC boost configuration input | External pulldown resistor selects one of four AC gain levels; sampled at RSTN de-assertion; floating = max boost. |
| D2P / D2M | HS differential output pair | Connects to USB receptacle; supports bidirectional HS signaling; interchangeable with D1P/D1M for layout flexibility. |
| D1P / D1M | HS differential input pair | Connects to USB host/hub PHY; agnostic to host/device role; maintains LS/FS transparency. |
| DC_BOOST/ENA_HS | Tri-level DC gain input / HS status flag | Configures DC offset (40/60/80 mV); outputs ENA_HS high when HS mode is detected and active. |
| SCL/CD | I²C clock / connection detect output | In I²C mode: clock input; in pin-strapped mode: asserts high upon DP/DM pull-up detection (device attach). |
| SDA | I²C data bidirectional | Supports readback of status registers (e.g., ACB_LVL, DCB_LVL) and configuration writes at 100 kHz. |
| RSTN | Active-low enable/reset | Pulled high internally (500 kΩ); must be held low until VCC ≥ 4.4 V; toggling re-latches EQ/DC_BOOST settings. |
| VREG | 1.8 V LDO output | Supplies internal core logic only during HS mode; requires 0.1 µF decoupling to GND. |
Key Features
| Feature | Design Value |
|---|---|
| HS-only signal conditioning | Preserves LS/FS signal integrity unchanged while applying adaptive equalization exclusively to 480 Mbps HS traffic. |
| Dual-port port symmetry | D1P/D1M and D2P/D2M are functionally identical and swappable-enables flexible PCB routing and reversible board placement. |
| Configurable boost architecture | Independent AC (via EQ resistor) and DC (via DC_BOOST strap) gain tuning allows optimization for pre- or post-channel loss scenarios. |
| Automatic mode detection | No firmware or host intervention required: device autonomously enters LS/FS/HS/Shutdown modes based on line state and RSTN. |
| USB protocol compatibility | Fully compliant with USB 2.0, OTG 2.0, and BC 1.2 specifications-including chirp handshake, TEST_PACKET transmission, and battery charging handshakes. |
Applications
| USB Docking Station | Tablet Host Interface |
|---|---|
Use Scenario: Extends USB 2.0 connectivity from laptop to multiple peripherals (HDD, display adapter, Ethernet) through a compact dock with internal 10+ cm PCB traces and 1–2 m cables. IC Role / Device Role / Timing Role: Signal conditioner placed between host controller and USB upstream port to restore HS eye opening degraded by trace loss and connector parasitics. Use Value: Enables reliable 480 Mbps operation across full dock stack without redesigning layer stackup or adding repeaters-reduces BOM cost and layout complexity. | Use Scenario: Integrates USB 2.0 host capability into a thin tablet chassis where internal routing exceeds 8 cm and includes flex-to-PCB transitions. IC Role / Device Role / Timing Role: HS signal integrity enhancer positioned adjacent to USB Type-A receptacle to meet USB-IF near-end eye mask at the connector. Use Value: Passes USB compliance testing with margin using mid-level AC/DC boost (Level 2 + 60 mV), eliminating need for costly high-speed stackup or impedance-matched connectors. |
| Active USB Extension Cable | Industrial Backplane Interface |
Use Scenario: Enables 5 m active USB 2.0 extension cable with integrated signal regeneration, supporting plug-and-play without driver changes. IC Role / Device Role / Timing Role: Pre-channel conditioner placed at host-end connector to compensate for cable attenuation before signal degradation occurs. Use Value: Achieves full HS bandwidth over 5 m by applying maximum AC boost (Level 3) and high DC boost (80 mV), validated against USB-IF far-end eye mask. | Use Scenario: Connects embedded USB host module to remote I/O card across a 20 cm backplane with multiple vias and split planes causing >12 dB insertion loss at 240 MHz. IC Role / Device Role / Timing Role: Mid-channel signal restorer inserted between backplane segments to recover HS signal amplitude and jitter margin. Use Value: Restores 0.8 UI eye height and <0.3 UI jitter at receiver, enabling robust enumeration and bulk transfer even under temperature cycling (-40°C to +85°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 2.0 signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TUSB214IRGYT | Single-channel variant with identical AC/DC boost architecture, same VQFN-14 package, but lacks I²C interface and CD/ENA_HS status flags. | Best suited for cost-sensitive, fixed-configuration designs where real-time status monitoring or field-upgradable boost settings are unnecessary. | Select TUSB214IRGYT only when I²C configurability and status flag outputs are not required-reduces software overhead and external component count. |
| USB2244-AEZG | USB 2.0 hub controller with integrated signal conditioning; 4-port, 28-pin QFN; includes built-in transceivers and packet routing logic-not a standalone conditioner. | Applicable where system requires multi-device connectivity and centralized USB management, not just signal restoration on a single path. | Choose USB2244-AEZG only when adding hub functionality is acceptable; it cannot replace TUSB213IRGYT in point-to-point signal conditioning roles due to different architecture and pinout. |
Compared with TUSB213IRGYT, TUSB214IRGYT offers identical signal conditioning performance with reduced feature set (no I²C, no status flags), while USB2244-AEZG provides integrated hub logic at the expense of design flexibility and direct signal path control-making TUSB213IRGYT the optimal choice for discrete, configurable HS channel restoration.
Availability
TUSB213IRGYT is available at Aetrix Electronics and suitable for USB docking stations, industrial backplanes, and active cable extenders requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing for production programs.
Supply support for TUSB213IRGYT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in interface, signal chain, and power management technologies.
The TUSB213IRGYT belongs to TI's USB signal integrity product line, engineered specifically to solve high-loss channel challenges in USB 2.0 host, peripheral, and cable applications-enabling robust HS compliance without system-level redesign.
FAQ
What is the primary function of the TUSB213IRGYT in a USB 2.0 system?
The TUSB213IRGYT is a dedicated USB 2.0 High-Speed signal conditioner that restores signal integrity by compensating for inter-symbol interference (ISI) in lossy channels. It applies programmable AC and DC boost exclusively to 480 Mbps HS signals while leaving LS and FS traffic unaffected. This enables reliable USB-IF electrical compliance at the connector-critical for docking stations, active cables, and tablets with long or lossy PCB traces. The TUSB213IRGYT does not act as a repeater, hub, or transceiver; it is a transparent analog signal restorer.
How does the TUSB213IRGYT handle USB Low-Speed and Full-Speed traffic?
The TUSB213IRGYT is explicitly designed to be agnostic to USB Low-Speed (1.5 Mbps) and Full-Speed (12 Mbps) signaling. Its patent-pending architecture bypasses LS/FS differential pairs without amplification, equalization, or DC offset-preserving original signal rise/fall times, voltage levels, and timing margins. This ensures full compatibility with legacy USB devices and avoids enumeration failures or handshake errors. Only HS (480 Mbps) traffic undergoes conditioning; the TUSB213IRGYT automatically detects mode transitions and disables boost during LS/FS operation.
Can the TUSB213IRGYT be configured after power-up, or is setup limited to reset-time only?
Configuration of AC and DC boost settings in the TUSB213IRGYT is latched at RSTN de-assertion and cannot be changed dynamically during normal operation-unless using the optional I²C interface. In pin-strapped mode, toggling RSTN is required to re-sample EQ and DC_BOOST pin states. With I²C enabled (SCL/SDA pulled high at reset), registers ACB_LVL (0x01[6:4]) and DCB_LVL (0x0E[2:0]) can be written at runtime via slave address 0x2C, provided CFG_ACTIVE (0x03[0]) is asserted and cleared to restart the state machine. Thus, the TUSB213IRGYT supports both static (reset-time) and dynamic (I²C) configuration.
What are the thermal limitations and PCB layout requirements for the TUSB213IRGYT?
The TUSB213IRGYT in VQFN-14 (RGY) package has a junction-to-board thermal resistance (RθJB) of 24.2°C/W and requires proper thermal pad soldering to PCB ground plane. Layout must route D1P/D1M and D2P/D2M on the same layer as the IC to avoid vias, maintain 90 Ω differential impedance, and minimize stub length. A 0.1 µF capacitor is mandatory between VREG and GND. For thermal reliability in continuous HS operation, keep ambient temperature ≤85°C (TUSB213I grade) and ensure ≥200 mm² copper pour under the thermal pad. The TUSB213IRGYT's low 30 mA active current simplifies thermal design versus active redrivers.
Does the TUSB213IRGYT support USB On-The-Go (OTG) and Battery Charging (BC) protocols?
Yes, the TUSB213IRGYT is explicitly compatible with USB On-The-Go (OTG) 2.0 and Battery Charging (BC) 1.2 specifications. Its transparent LS/FS pass-through preserves OTG session request protocol (SRP) and host negotiation protocol (HNP) signaling, while HS conditioning supports BC 1.2 downstream port detection-including D+ short-to-D− and dedicated charger identification. The device does not interfere with BC handshake sequences or OTG role swaps because it operates below the protocol layer, acting solely on physical-layer signal integrity. This makes the TUSB213IRGYT suitable for dual-role mobile and docking applications where BC and OTG compliance are mandatory.
TUSB213IRGYT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 14-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Signal Processing
- Interface:
- USB
- Voltage - Supply:
- 4.4V ~ 5.5V
- Supplier Device Package:
- 14-VQFN (3.5x3.5)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
TUSB213IRGYT FAQ
1.How can I place an order for TUSB213IRGYT through Aetrix?
Please submit a Request for Quotation (RFQ) for TUSB213IRGYT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TUSB213IRGYT reliable?
The price and inventory of TUSB213IRGYT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TUSB213IRGYT is usually 5 days.
3.What payment methods are accepted for TUSB213IRGYT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TUSB213IRGYT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TUSB213IRGYT?
TUSB213IRGYT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TUSB213IRGYT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TUSB213IRGYT?
For technical support, including TUSB213IRGYT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TUSB213IRGYT requirements.
6.How does Aetrix verify that TUSB213IRGYT is sourced from the original manufacturer or authorized distributors?
All TUSB213IRGYT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TUSB213IRGYT meets industry standards.
7.What is the process for return or replacement of TUSB213IRGYT?
All TUSB213IRGYT units undergo pre-shipment inspection (PSI). If there is an issue with TUSB213IRGYT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TUSB213IRGYT part is unused and in its original packaging.
Return procedure for TUSB213IRGYT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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