Texas Instruments TUSB215IRGYR

Overview

TUSB215IRGYR from Texas Instruments is a USB 2.0 High-Speed signal conditioner with integrated BC 1.2 Charging Downstream Port (CDP) controller, designed to compensate for inter-symbol interference (ISI) in lossy channels while preserving LS/FS signal integrity. It supports 480 Mbps HS signaling, offers four AC boost levels via EQ pin resistor strap, three DC boost levels (40/60/80 mV) via DC_BOOST pin, and operates across –40°C to 85°C ambient temperature. Used in host-side USB signal restoration before the connector.

For engineers reviewing the TUSB215IRGYR datasheet, TUSB215IRGYR pinout, TUSB215IRGYR application, or TUSB215IRGYR equivalent, key selection criteria include HS eye mask compliance support, CDP controller functionality, dual-port agnostic D1/D2 channel routing, ultra-low 0.76–1.5 mA HS suspend current, and VQFN-14 (3.5 mm × 3.5 mm) package compatibility with high-density PCB layouts.

Technical Context

The TUSB215IRGYR implements a patent-pending architecture that passes LS/FS signals transparently while applying programmable AC and DC gain only to HS differential pairs - ensuring full USB 2.0, OTG 2.0, and BC 1.2 protocol compliance. Its dual-channel topology (D1P/M and D2P/M) is host/device agnostic and supports daisy-chaining for high-loss applications up to 5 m pre-channel or 2 m post-channel cable length.

Configuration is achieved either via pin strapping (EQ for AC boost; DC_BOOST for DC gain; RSTN for enable/disable) or I²C interface (7-bit address 0x2C), enabling runtime adjustment of ACB_LVL (register 0x01) and DCB_LVL (register 0x0E). The device asserts CD on connection detection and ENA_HS upon successful HS handshake, providing real-time status flags for system control logic.

Key Specifications

Pinout & Package

VQFN-14 package (RGY suffix), 3.50 mm × 3.50 mm body size, 0.5 mm pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 2.0 signal conditioning applications.

Compared with TUSB215IRGYR, TUSB216IRGYR adds I²C address configurability but delivers identical signal restoration and CDP performance, while USB2514B-AEZG integrates hub logic at the cost of higher power and inflexible topology - making TUSB215IRGYR the most targeted solution for discrete HS signal conditioning with BC 1.2 CDP support.

Availability

TUSB215IRGYR is available at Aetrix Electronics and suitable for USB host signal restoration, docking station channel extension, and industrial embedded host interfaces requiring stable component supply and guaranteed long-term availability.

Supply support for TUSB215IRGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The TUSB215IRGYR belongs to TI's USB signal conditioning product line, engineered specifically to solve high-speed signal integrity challenges in USB 2.0 host and peripheral designs while integrating essential BC 1.2 charging control.

FAQ

What is the primary function of the TUSB215IRGYR in a USB 2.0 system?

The TUSB215IRGYR functions as a dedicated USB 2.0 High-Speed signal conditioner that restores degraded HS signals by applying programmable AC and DC boost to compensate for inter-symbol interference and channel loss. It also integrates a BC 1.2 Charging Downstream Port (CDP) controller. Unlike hubs or transceivers, the TUSB215IRGYR does not alter LS/FS signaling and operates transparently for non-HS traffic - making it ideal for host-side signal restoration before the physical connector.

How does the TUSB215IRGYR handle USB Low Speed and Full Speed traffic?

The TUSB215IRGYR is explicitly designed to be agnostic to USB Low Speed (1.5 Mbps) and Full Speed (12 Mbps) signals: it passes them unchanged without applying any gain or filtering. This transparency is confirmed in the datasheet's "Detailed Description" section, which states the device's patent-pending architecture leaves LS/FS signal characteristics unaffected while only conditioning HS (480 Mbps) differential pairs. As a result, TUSB215IRGYR maintains full backward compatibility with legacy USB 1.1 devices and avoids timing skew or voltage-level distortion.

Can the TUSB215IRGYR be configured without using I²C?

Yes, the TUSB215IRGYR supports full pin-strapped configuration without I²C. AC boost level is set via an external pulldown resistor on the EQ pin; DC boost level (40/60/80 mV) is selected by pulling the DC_BOOST pin high, floating, or low; and RSTN controls enable/disable state. I²C (address 0x2C) is optional and used only for dynamic register updates (e.g., ACB_LVL or DCB_LVL) during operation. For fixed-function deployments - such as in docking stations or active cables - pin-strapping provides deterministic, zero-software configuration for the TUSB215IRGYR.

What is the role of the CD and ENA_HS pins on the TUSB215IRGYR?

The CD (Connection Detect) pin asserts high when the TUSB215IRGYR detects a DP or DM pull-up resistor, indicating a USB device is attached. The ENA_HS (Enable High-Speed) pin asserts high only after successful HS handshake detection - verified by chirp J/K pair recognition within 18–128 µs - confirming an active 480 Mbps link. Both are open-drain outputs referenced to VCC. These flags provide real-time hardware status to the host system: CD enables port presence detection, while ENA_HS confirms HS link readiness - critical for power management and firmware handshaking in the TUSB215IRGYR application.

Does the TUSB215IRGYR require external components for basic operation?

Yes, the TUSB215IRGYR requires three mandatory external components for reliable operation: (1) a 0.1 µF capacitor from VREG to GND to stabilize the internal 1.8 V LDO; (2) a 0.1 µF capacitor from RSTN to GND if not actively driven by a microcontroller (to ensure clean power-on reset); and (3) external pulldown resistors on EQ and DC_BOOST pins for pin-strapped AC/DC boost configuration. Optional components include I²C pull-ups (4.7 kΩ to 3.6 V) and series termination resistors for impedance matching - all specified in the TUSB215IRGYR reference schematic and layout guidelines.