Texas Instruments TUSB4020BIPHPRG4

Overview

TUSB4020BIPHPRG4 from Texas Instruments is a two-port USB 2.0 hub IC with Multi-Transaction Translator (MTT) architecture, 48-pin HTQFP (PHP) package, industrial temperature range (–40°C to 85°C), and native support for USB Battery Charging (CDP/DCP/AutoMode) compliant with YD/T 1591-2009 - deployed in docking stations and monitors requiring high-speed downstream port control.

For engineers reviewing the TUSB4020BIPHPRG4 datasheet, TUSB4020BIPHPRG4 pinout, TUSB4020BIPHPRG4 application, or TUSB4020BIPHPRG4 equivalent, key selection criteria include per-port/ganged power switching, 24MHz clock input compatibility, I²C/SMBus programmability for VID/PID customization, and battery charging mode configuration via PWRCTL/BATEN pins and register settings.

Technical Context

The TUSB4020BIPHPRG4 implements a dual-transaction-translator MTT hub architecture enabling independent bandwidth allocation across its two downstream ports, supporting simultaneous high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) USB device connections based on upstream port capability detection. It integrates internal 1.1V and 3.3V LDOs and supports dynamic USB speed negotiation without host driver modification.

Configuration is achieved via OTP ROM, external I²C EEPROM (7-bit address 0x50), or SMBus target interface (base address 0x88 with configurable bits), allowing persistent customization of VID/PID, port removability, battery charging enablement, and AutoMode/HiCurAcpModeEn settings - all sampled at GRSTz deassertion alongside strap pins like GANGED, FULLPWRMGMTz, and PWRCTL_POL.

Key Specifications

Pinout & Package

48-pin HTQFP (PHP) package with 0.5 mm pitch, 9 mm × 9 mm body, and exposed thermal pad for junction-to-board thermal resistance of 13°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 2.0 hub applications.

Compared with USB2514B-AEZG and TUSB2036VFR, the TUSB4020BIPHPRG4 uniquely combines two-port MTT performance, integrated YD/T 1591-2009-compliant DCP mode, AutoMode flexibility, and field-programmable VID/PID - making it optimal for compact, charging-aware industrial and consumer hubs where layout area and firmware overhead must be minimized.

Availability

TUSB4020BIPHPRG4 is available at Aetrix Electronics and suitable for docking stations, monitors, and set-top boxes requiring stable component supply, industrial temperature operation, and USB Battery Charging compliance.

Supply support for TUSB4020BIPHPRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing analog and embedded processing chips for industrial, automotive, and communications markets.

The TUSB4020BIPHPRG4 belongs to TI's USB connectivity portfolio, engineered specifically for space-constrained, battery-aware USB 2.0 hub applications requiring industrial reliability, flexible configuration, and regulatory-compliant charging.

FAQ

What USB speeds does the TUSB4020BIPHPRG4 support on its upstream and downstream ports?

The TUSB4020BIPHPRG4 supports high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) on its upstream port. Downstream ports support all three speeds when the upstream port is connected to a high-speed-capable host; if upstream is full-speed/low-speed only, downstream high-speed is automatically disabled. This behavior is implemented in hardware and requires no software intervention - the TUSB4020BIPHPRG4 dynamically negotiates speed per port based on electrical environment detection.

How is battery charging configured on the TUSB4020BIPHPRG4 - via pins, registers, or both?

Battery charging on the TUSB4020BIPHPRG4 is configured through multiple synchronized methods: strap pins PWRCTL1/BATEN1 and PWRCTL2/BATEN2 set initial enablement at reset, while registers REG_6h (batEn[1:0]) and REG_Ah (autoModeEnz, HiCurAcpModeEn) provide runtime control. The TUSB4020BIPHPRG4 also supports OTP and I²C EEPROM programming for persistent charging mode defaults - ensuring consistent behavior across power cycles without host firmware dependency.

Does the TUSB4020BIPHPRG4 require an external crystal, and what are the clock input options?

Yes, the TUSB4020BIPHPRG4 requires a 24 MHz clock source, which can be provided either by a parallel-resonant crystal connected between XI (38) and XO (39), or by a 24 MHz CMOS oscillator driving XI only (XO left unconnected). The crystal circuit must use 9.53kΩ ±1% resistor on USB_R1 and proper load capacitors (CL1/CL2); oscillator drive must meet VIH/VIL thresholds per Section 5.5. No internal PLL generates the 480 MHz USB PHY clock - timing integrity depends entirely on this external 24 MHz reference.

Can the TUSB4020BIPHPRG4 operate with only one power rail, or are both VDD and VDD33 mandatory?

Both VDD (1.1V) and VDD33 (3.3V) rails are mandatory for TUSB4020BIPHPRG4 operation - they power distinct internal domains: VDD supplies the core logic and USB PHY digital blocks, while VDD33 powers I/O buffers, USB transceivers, and configuration interfaces. The datasheet explicitly states no power sequencing is required, but both supplies must be within their recommended ranges (VDD: 0.99–1.26 V; VDD33: 3.0–3.6 V) before GRSTz deassertion. Omitting either rail will result in functional failure or undefined behavior.

What is the purpose of the RSVD pins on the TUSB4020BIPHPRG4, and how should they be handled on the PCB?

The RSVD pins (16, 17, 19, 20, 28, 29, 31, 32, 43, 44, 46, 47) on the TUSB4020BIPHPRG4 are reserved for internal test, characterization, or future functionality - TI documentation states they are "for internal use only" and must be left unconnected on the PCB. These pins have no defined electrical behavior in production silicon; routing traces to them or applying bias risks signal integrity degradation, EMI coupling, or unintended current paths. The thermal pad (GND) must be soldered to a solid ground plane for thermal and EMI performance, but all RSVD pins remain floating.