Texas Instruments TUSB4041IPAP

Overview

TUSB4041IPAP from Texas Instruments is a four-port USB 2.0 hub IC with Multi-Transaction Translator (MTT) architecture, 24MHz single-clock input support, industrial temperature range (–40°C to 85°C), and integrated battery charging logic compliant with USB BC 1.2 and YD/T 1591-2009. It enables high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) connectivity on downstream ports based on upstream link capability, and supports per-port/ganged power switching for docking stations and monitors.

For engineers reviewing the TUSB4041IPAP datasheet, TUSB4041IPAP pinout, TUSB4041IPAP application, or TUSB4041IPAP equivalent, key selection criteria include MTT-based transaction handling, CDP/DCP/automode battery charging configuration, 64-pin HTQFP package thermal performance (RθJA = 26.2°C/W), and I²C/SMBus programmability of VID/PID and port attributes without requiring OS-specific drivers.

Technical Context

The TUSB4041IPAP implements a true Multi-Transaction Translator hub with four independent transaction translators and four asynchronous endpoint buffers per translator-enabling concurrent high-bandwidth transfers across all downstream ports without bottlenecking at a shared translator. Its USB 2.0 compliance includes automatic speed negotiation: downstream high-speed mode activates only when upstream detects a high-speed capable host; otherwise, it falls back to full/low-speed only.

Power management is configurable via hardware strapping (GANGED, FULLPWRMGMTz, PWRCTL_POL) or register control (REG_5h), supporting both per-port and ganged power switching with overcurrent detection inputs (OVERCUR1z–OVERCUR4z). Battery charging logic operates independently per port using BATEN[4:1] pins and registers (REG_6h, REG_Ah), enabling simultaneous CDP (upstream-connected), DCP (upstream-unconnected), and automode (divider-mode + DCP fallback) operation.

Key Specifications

Pinout & Package

Package: 64-pin HTQFP (PAP), 12 mm × 12 mm, with exposed thermal pad requiring PCB ground connection per TI SLLSEK3F Rev JUNE 2026.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 2.0 hub applications.

Compared with USB2514B-AEZG and UPD720114GA-YL-C-A, the TUSB4041IPAP delivers superior concurrent throughput via MTT, eliminates external charging components through native CDP/DCP/automode, and enables field-customizable identity via I²C/SMBus - making it optimal for intelligent docks and displays requiring robust power delivery and configurability.

Availability

TUSB4041IPAP is available at Aetrix Electronics and suitable for computer docking stations, USB-C monitors, set-top box expansions, and industrial HMI systems requiring stable component supply, long-term lifecycle support, and industrial-grade thermal reliability.

Supply support for TUSB4041IPAP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions, with leadership in USB interface ICs and industrial-grade signal chain products.

The TUSB4041IPAP belongs to TI's USB 2.0 hub product line, engineered specifically for high-reliability embedded docking, display, and peripheral expansion applications demanding MTT performance, battery charging compliance, and flexible configuration.

FAQ

What USB speeds does the TUSB4041IPAP support on its upstream and downstream ports?

The TUSB4041IPAP supports USB 2.0 high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) on its upstream port. Downstream port speeds are dynamically determined: high-speed is enabled only when the upstream port connects to a high-speed-capable host; otherwise, downstream operates at full-speed or low-speed only. This behavior is enforced by hardware and requires no software configuration in the TUSB4041IPAP.

Does the TUSB4041IPAP require external USB transceivers or level shifters?

No, the TUSB4041IPAP integrates fully compliant USB 2.0 transceivers for all five ports (one upstream, four downstream) and supports direct connection to USB connectors. It accepts 1.1V core and 3.3V I/O supplies natively, eliminating need for external level shifters. The USB_R1 pin integrates precision resistor reference for VBUS sensing, and DM/DP polarity swap is handled internally - no external muxes required for Type-C designs.

How is battery charging configured on the TUSB4041IPAP, and what standards does it meet?

Battery charging on the TUSB4041IPAP is configured per port using BATEN[4:1] pins sampled at reset, and further refined via registers (REG_6h, REG_Ah). It supports CDP (USB Battery Charging Specification 1.2), DCP (compliant with Chinese standard YD/T 1591-2009), and automode - which auto-selects D+D– divider mode or DCP based on attached device. All modes operate without host driver involvement and are validated per TI SLLSEK3F Rev JUNE 2026.

Can the TUSB4041IPAP be programmed after soldering onto the PCB?

Yes, the TUSB4041IPAP supports in-system programming via its USB 2.0 upstream port using vendor-defined USB requests. This enables field updates of OTP ROM contents (e.g., VID/PID), I²C EEPROM configuration, and runtime SMBus writes to registers controlling port removability, battery enable, and string descriptors - all without removing the TUSB4041IPAP from the board.

What thermal considerations apply to the TUSB4041IPAP in continuous 4-port high-speed operation?

In continuous 4-port high-speed operation, the TUSB4041IPAP draws up to 87 mA on VDD33 and 98 mA on VDD (per SLLSEK3F Section 5.7), generating ~350 mW total power dissipation. With RθJA = 26.2°C/W and ambient at 85°C, junction temperature reaches ~178°C - exceeding max TJ = 105°C. Therefore, proper PCB thermal design is mandatory: the exposed PowerPAD must be soldered to a ≥4 cm² internal ground plane, and airflow or heatsinking is recommended for sustained HS loads.