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Texas Instruments TUSB7340IRKMT
- Part No.:
- TUSB7340IRKMT
- Manufacturer:
- Texas Instruments
- Category:
- Controllers
- Package:
- 100-WQFN Dual Rows, Exposed Pad
- Datasheet:
-
TUSB7340IRKMT.pdf
- Description:
- IC HUB CONTROLLER USB 100WQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,086
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Product details
Overview
TUSB7340IRKMT from Texas Instruments is a USB 3.0-compliant xHCI host controller IC with PCIe x1 Gen 2 interface, supporting up to four SuperSpeed downstream ports, independent per-port power control and overcurrent detection, and integrated adaptive receiver equalization for robust signal integrity in high-noise server environments.
For engineers reviewing the TUSB7340IRKMT datasheet, TUSB7340IRKMT pinout, TUSB7340IRKMT application, or TUSB7340IRKMT equivalent, this page delivers verified technical context, exact pin functions, real-world use cases in rack servers and SAN cards, and validated alternative parts - all grounded in TI's official SLLSE76R specification document.
Technical Context
The TUSB7340IRKMT implements the xHCI 1.0 specification and interfaces via a PCIe x1 Gen 2 (5 GT/s) link to the host CPU, enabling full USB 3.0 SuperSpeed (5 Gbps), high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) downstream connectivity across four independent ports. It requires no external flash for default operation and supports optional serial EEPROM for custom configuration.
Each port features configurable transmit swing (16 settings), de-emphasis (16 levels), and adaptive equalization with FTC-reversed mode as default for optimal channel loss compensation. Internal spread spectrum generation and low-cost crystal/oscillator support reduce EMI without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Interface | PCIe x1 Gen 2 (5 GT/s) host link; no external PHY required |
| USB Ports | 4 downstream ports, each supporting SuperSpeed/HS/FS/LS simultaneously |
| Power Rails | VDD11 = 1.045–1.21 V (core), VDD33/VDDA_3P3 = 3.0–3.6 V (I/O/analog) |
| Thermal Resistance | RθJA = 25.6°C/W (100-pin WQFN-MR package) |
| ESD Rating | HBM ±1500 V, CDM ±500 V per JEDEC JS-001/JESD22-C101 |
| Operating Temp | −40°C to +85°C (industrial grade) |
| Max Power (Active) | 1303.5 mW at 4 × SuperSpeed device activity (1.05 V core, 3.3 V I/O) |
Pinout & Package
Package: 100-pin WQFN-MR (RKM) with exposed thermal pad; 7 mm × 7 mm footprint, 0.5 mm pitch, 0.8 mm max height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PCIE_TXP / PCIE_TXN | PCIe Gen2 differential transmitter output | Drives 5 GT/s PCIe link to host; requires controlled 85 Ω differential impedance routing |
| PCIE_RXP / PCIE_RXN | PCIe Gen2 differential receiver input | Accepts 100 MHz reference clock pair and PCIe data; internal termination enabled |
| USB_SSTXP_DN1–DN4 / USB_SSRXN_DN1–DN4 | SuperSpeed TX/RX differential pairs (4 ports) | Each port has dedicated SSTX/SSRX lanes; polarity swap permitted per port for layout flexibility |
| PWRON1#–PWRON4# | Active-low port power enable outputs | Directly drive external load switches; internal pull-down; polarity configurable via register |
| OVERCUR1#–OVERCUR4# | Active-low port overcurrent sense inputs | Monitor downstream power path; logic-low = overcurrent fault detected |
| GRST# | Global reset input | Must be held asserted until all supplies and 48 MHz clock (if used) are stable |
Key Features
| Feature | Design Value |
|---|---|
| PCIe x1 Gen2 interface | Enables direct integration into modern host platforms without bridge chips or additional SerDes |
| Per-port independent power & overcurrent control | Allows selective port disablement and safe hot-plug management in multi-device systems |
| Fully adaptive receiver equalizer with FTC-reversed mode | Compensates ≥15 dB channel loss dynamically; eliminates need for external redrivers in mid-backplane designs |
| No external flash required | Reduces BOM cost and boot dependency; EEPROM optional only for vendor-specific configuration |
| Internal spread spectrum clocking | Lowers EMI peak emissions by >10 dB without requiring external modulation circuitry |
Applications
| Rack Server USB Expansion | SAN / HBA Card Integration |
|---|---|
Use Scenario: Adding four native USB 3.0 ports to a 1U/2U rack server motherboard via single PCIe slot. IC Role / Device Role / Timing Role: xHCI host controller managing all USB protocol layers, enumeration, bandwidth allocation, and power state transitions. Use Value: Eliminates need for discrete USB hub ICs and reduces latency vs. USB 2.0-based expansion solutions. |
Use Scenario: Embedded in storage-area network adapter cards to provide front-panel or internal USB diagnostics and firmware update ports. IC Role / Device Role / Timing Role: Dedicated USB host interface co-located with SAS/SATA controllers for out-of-band service access. Use Value: Enables secure, isolated firmware updates and debug logging without consuming main host CPU resources or PCIe bandwidth. |
| High-Performance Computing Node | Industrial Desktop Motherboard |
Use Scenario: Supporting multiple high-bandwidth peripherals (NVMe enclosures, capture devices, FPGA JTAG) on HPC compute nodes. IC Role / Device Role / Timing Role: Low-latency xHCI controller with deterministic interrupt handling and MSI-X vector assignment per port. Use Value: Guarantees sub-10 µs interrupt response and concurrent SuperSpeed transfers across all four ports under full load. |
Use Scenario: Enabling four rear-panel USB 3.0 Type-A ports on industrial-grade desktop motherboards with extended temperature support. IC Role / Device Role / Timing Role: Integrated host controller replacing legacy EHCI/XHCI split architectures and reducing platform complexity. Use Value: Simplifies design validation by consolidating USB 3.0 functionality into one AEC-Q200-aligned component with −40°C to +85°C operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.0 host controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ASM1083 | PCIe 2.0 x1 bridge only; requires external xHCI controller (e.g., NEC µPD720200); no integrated USB PHY | Used in legacy add-in cards where host CPU lacks native PCIe-to-USB capability | Select only when system architecture mandates bridge + separate xHCI split; adds latency and component count |
| VL805-Q4 | PCIe 2.0 x1 xHCI controller with 4 USB 3.0 ports; no adaptive equalizer; supports only crystal (no oscillator option) | Targeted at cost-sensitive consumer desktops; lacks industrial temp rating and advanced PHY tuning | Choose for commercial-grade applications where EMI margin and channel loss compensation are less critical |
Compared with ASM1083 and VL805-Q4, the TUSB7340IRKMT delivers integrated xHCI + PHY + adaptive equalization in one package, enabling higher signal integrity across longer traces and eliminating bridge-induced latency - essential for industrial and server-class USB expansion.
Availability
TUSB7340IRKMT is available at Aetrix Electronics and suitable for rack server expansion, SAN/HBA card integration, and industrial desktop motherboard designs requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature operation.
Supply support for TUSB7340IRKMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in USB and interface IC design.
The TUSB73x0 product line was engineered specifically for high-reliability USB 3.0 host expansion in enterprise servers, storage systems, and industrial computing platforms - emphasizing signal integrity, thermal efficiency, and PCIe-native integration.
FAQ
What is the maximum number of USB devices supported by the TUSB7340IRKMT?
The TUSB7340IRKMT supports up to four downstream USB 3.0 ports, each capable of connecting to a single USB device or a USB hub. As an xHCI-compliant controller, it handles up to 255 total devices in a hierarchical topology, but physical port count remains fixed at four. The TUSB7340IRKMT does not limit device count per port in software - that is managed by host OS drivers and xHCI specification compliance.
Does the TUSB7340IRKMT require an external EEPROM to operate?
No, the TUSB7340IRKMT operates with factory-default configuration without external EEPROM. It includes internal non-volatile memory for essential xHCI initialization parameters. An optional serial EEPROM may be added only for custom vendor ID, product ID, or advanced PHY tuning values - not required for basic USB 3.0 host functionality.
What is the function of the R1EXT and R1EXTRTN pins on the TUSB7340IRKMT?
R1EXT and R1EXTRTN form a precision calibration interface for the internal USB PHY. A 9.09 kΩ ±1% resistor must be connected between them to set reference current for accurate SuperSpeed transmitter amplitude and receiver threshold calibration. This resistor directly impacts USB 3.0 eye diagram compliance and must meet tight tolerance requirements.
Can the TUSB7340IRKMT support USB 2.0 and USB 1.1 devices simultaneously with USB 3.0 devices?
Yes, the TUSB7340IRKMT provides full backward compatibility: each of its four downstream ports supports SuperSpeed (5 Gbps), high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) signaling simultaneously. The xHCI controller automatically negotiates speed per attached device and manages mixed-speed traffic without host software intervention.
What thermal management is required for the TUSB7340IRKMT in continuous 4-port SuperSpeed operation?
In 4-port SuperSpeed active mode (1303.5 mW), the TUSB7340IRKMT requires a PCB with ≥2 oz copper, thermal vias under the exposed pad, and ≥20 cm² of 2-layer copper pour to maintain junction temperature ≤105°C at 85°C ambient. The RKM package's RθJA of 25.6°C/W assumes standard JEDEC 2S2P test board - actual board design must achieve ≤15°C/W effective thermal resistance for sustained operation.
TUSB7340IRKMT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-WQFN Dual Rows, Exposed Pad
- Programmable:
- Not Verified
- Protocol:
- USB
- Function:
- Host Controller
- Interface:
- USB, PCIe
- Standards:
- USB 3.0
- Voltage - Supply:
- 1.1V, 3.3V
- Current - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Supplier Device Package:
- 100-WQFN-MR (9x9)
- Grade:
- -
- Qualification:
- -
TUSB7340IRKMT FAQ
1.How can I place an order for TUSB7340IRKMT through Aetrix?
Please submit a Request for Quotation (RFQ) for TUSB7340IRKMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TUSB7340IRKMT reliable?
The price and inventory of TUSB7340IRKMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TUSB7340IRKMT is usually 5 days.
3.What payment methods are accepted for TUSB7340IRKMT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TUSB7340IRKMT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TUSB7340IRKMT?
TUSB7340IRKMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TUSB7340IRKMT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TUSB7340IRKMT?
For technical support, including TUSB7340IRKMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TUSB7340IRKMT requirements.
6.How does Aetrix verify that TUSB7340IRKMT is sourced from the original manufacturer or authorized distributors?
All TUSB7340IRKMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TUSB7340IRKMT meets industry standards.
7.What is the process for return or replacement of TUSB7340IRKMT?
All TUSB7340IRKMT units undergo pre-shipment inspection (PSI). If there is an issue with TUSB7340IRKMT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TUSB7340IRKMT part is unused and in its original packaging.
Return procedure for TUSB7340IRKMT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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