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Texas Instruments TUSB7340RKMT

Part No.:
TUSB7340RKMT
Manufacturer:
Texas Instruments
Category:
Controllers
Package:
100-WQFN Dual Rows, Exposed Pad
Datasheet:
AetrixTUSB7340RKMT.pdf
Description:
IC HUB CONTROLLER USB 100WQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,999

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Product details

Overview

TUSB7340RKMT from Texas Instruments is a USB 3.0-compliant xHCI host controller IC designed for PCIe Gen2-based host systems. It provides four independent SuperSpeed USB 3.0 downstream ports with per-port power control, overcurrent detection, and configurable transmit swing/de-emphasis. It operates with 1.1V core and 3.3V I/O supplies, supports internal spread-spectrum clocking, and targets server-class USB expansion in rack/microserver platforms.

For engineers reviewing the TUSB7340RKMT datasheet, TUSB7340RKMT pinout, TUSB7340RKMT application, or TUSB7340RKMT equivalent, this page delivers verified technical context, real-world port-level configuration capabilities, thermal and power specifications under active load, and validated alternative host controllers for PCIe-to-USB 3.0 bridge designs.

Technical Context

The TUSB7340RKMT implements an xHCI-compliant host controller architecture with a PCIe x1 Gen2 interface (5 GT/s), enabling full USB 3.0 protocol stack offload from the CPU. Its PHY layer includes independently programmable transmitter swing (16 settings, 2.7–1253 mVpp AC-coupled) and de-emphasis (16 levels, 0–69.3% amplitude reduction) per downstream port.

Each of its four USB ports integrates adaptive receiver equalization with five operating modes (flat, fully adaptive FTC normal/reversed, hold, initialize), plus dedicated PWRON#/OVERCUR# signals and dual-speed (HS/FS/LS) backward compatibility alongside SuperSpeed operation. The device requires no external flash for boot, using internal ROM for default xHCI initialization.

Key Specifications

Parameter Value and Actual Design Meaning
InterfacePCIe x1 Gen2 (5 GT/s); compliant with PCI Express Base Specification Rev 2.0
USB Ports4 downstream USB 3.0 ports supporting SuperSpeed (5 Gbps), high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps)
Power SupplyVDD11 = 1.045–1.21 V (core); VDD33/VDDA_3P3 = 3.0–3.6 V (I/O/analog); supports 0°C to 85°C industrial temp range
Thermal ResistanceRθJA = 25.6°C/W (100-pin WQFN-MR package); RθJC(bot) = 0.4°C/W enables direct PCB thermal pad coupling
Power Consumption1303.5 mW max (4 SS devices active); 79.35 mW in system suspend state
ESD RatingHBM ±1500 V, CDM ±500 V - meets JEDEC JS-001 and JESD22-C101 for robust board-level handling
Clock InputSupports 100 MHz differential PCIe REFCLK or 48 MHz single-ended crystal/oscillator with FREQSEL strap

Pinout & Package

Package: 100-pin WQFN-MR (RKM) with exposed thermal pad (VSS), 0.5 mm pitch, 9 mm × 9 mm body size. Thermal pad must be soldered to PCB ground plane for optimal junction-to-board conduction (RθJB = 15.2°C/W).

Pin/Terminal Circuit Role Design Meaning
PCIE_TXP / PCIE_TXNPCIe Gen2 differential transmitter outputDrives host-side PCIe link at 5 GT/s; requires controlled 85 Ω differential impedance routing
PCIE_RXP / PCIE_RXNPCIe Gen2 differential receiver inputAccepts 100 MHz reference clock pair; internal termination enabled by default
USB_SSTXP_DN1–DN4 / USB_SSRXN_DN1–DN4Per-port SuperSpeed TX/RX differential pairsFour independent SS lanes; polarity swap allowed per port to simplify layout
PWRON1#–PWRON4#Active-low port power enable outputsDirectly drive external USB power switches; internal pull-down; supports PWRON_POLARITY bit inversion
OVERCUR1#–OVERCUR4#Active-low port overcurrent sense inputsMonitor downstream bus current; logic low = overcurrent fault; internal pull-up enabled
GRST#Global reset inputAsynchronous reset asserting until all rails stable; required before PCIe enumeration

Key Features

Feature Design Value
Per-port PHY configurabilityIndependent transmit swing (16-step), de-emphasis (16-step), and adaptive equalizer mode (5 options) per downstream port
No external flash requirementBootstraps xHCI stack from internal ROM; optional serial EEPROM only for custom vendor descriptors or port mapping
Integrated spread-spectrum clockingReduces EMI without external components; supports low-cost 48 MHz crystal or oscillator
PCIe Gen2 x1 interfaceEnables low-latency, high-bandwidth connection to host CPU/chipset with full xHCI register compatibility
Industrial temperature supportRated for −40°C to +85°C operation with validated thermal performance up to 105°C junction

Applications

Rack & Microserver Expansion Storage Area Network (SAN) Card

Use Scenario: Adding four native USB 3.0 ports to a 1U rack server motherboard where PCIe slot space is constrained.

IC Role / Device Role / Timing Role: PCIe-to-USB 3.0 bridge controller managing xHCI protocol stack, port power sequencing, and link training independently of CPU.

Use Value: Eliminates need for discrete USB hub ICs and reduces host CPU interrupt load via MSI-X vectoring per port event.

Use Scenario: Enabling high-throughput USB-attached NVMe enclosures or JBOD arrays on enterprise HBA cards.

IC Role / Device Role / Timing Role: Host controller providing concurrent SuperSpeed transfers across four downstream ports with per-port overcurrent protection.

Use Value: Sustains >3.5 Gbps aggregate bandwidth (4× SS links) while maintaining strict USB compliance for certified peripheral attachment.

Desktop Motherboard USB Expansion Industrial Embedded Host Interface

Use Scenario: Integrating additional rear-panel USB 3.0 ports on ATX motherboards using a single PCIe x1 lane.

IC Role / Device Role / Timing Role: xHCI-compliant host controller with integrated PHY, eliminating external transceivers and reducing BOM count.

Use Value: Reduces PCB layer count via compact 9 mm × 9 mm WQFN-MR package and eliminates external clock buffer requirements.

Use Scenario: Providing ruggedized USB 3.0 connectivity in fanless industrial PCs operating in extended temperature environments.

IC Role / Device Role / Timing Role: Industrial-grade USB host controller with −40°C to +85°C qualification and validated thermal derating up to 105°C junction.

Use Value: Ensures reliable port enumeration and sustained data transfer under thermal stress without throttling or reset events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 host controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
ASM1083PCIe 2.0 x1 bridge only; requires external USB 3.0 controller (e.g., VL805) for xHCI functionalityNot a drop-in replacement; adds latency and component count; lacks integrated PHY and per-port power controlSelect only when legacy PCIe bridge functionality is needed alongside separate USB controller design
VL805-Q4USB 3.0 xHCI controller with PCIe 2.0 x1 interface; 4-port; supports USB 3.1 Gen1 but no internal spread spectrum or adaptive equalizer tuningHigher power draw (1450 mW active); no per-port de-emphasis control; requires external EEPROM for firmwarePrefer when USB 3.1 Gen1 compliance is mandatory and TI's adaptive PHY tuning is not required

Compared with ASM1083 and VL805-Q4, the TUSB7340RKMT delivers integrated xHCI + PHY in one package, lower active power (1303.5 mW vs. 1450 mW), and field-tunable signal integrity per port-enabling robust USB 3.0 link establishment across variable trace lengths and connector losses without layout respins.

Availability

TUSB7340RKMT is available at Aetrix Electronics and suitable for rack server expansion, SAN HBA development, and industrial embedded host interface applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TUSB7340RKMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions with over 50 years of innovation in interface and system-on-chip technologies.

The TUSB73x0 product line was engineered specifically for PCIe-based USB 3.0 host expansion in space-constrained, thermally demanding server and storage applications-delivering full xHCI compliance with minimal external components.

FAQ

What is the PCIe interface specification supported by the TUSB7340RKMT?

The TUSB7340RKMT implements a PCIe x1 Gen2 interface compliant with the PCI Express Base Specification Revision 2.0, operating at 5 GT/s with full MSI-X interrupt support. It uses differential PCIE_TXP/PCIE_TXN and PCIE_RXP/PCIE_RXN signals and requires a 100 MHz differential reference clock (PCIE_REFCLKP/PCIE_REFCLKN). This interface enables low-latency communication with the host CPU while maintaining full xHCI register compatibility. The TUSB7340RKMT does not support PCIe Gen3 or wider link widths.

Does the TUSB7340RKMT require an external EEPROM for basic operation?

No, the TUSB7340RKMT does not require an external EEPROM for basic operation. It boots from internal ROM with default xHCI configuration, including port enumeration and standard USB descriptors. An optional serial EEPROM may be used only for custom vendor-specific configurations, such as modified port mapping, custom device strings, or non-default PHY tuning parameters. The TUSB7340RKMT functions fully without EEPROM in standard USB 3.0 host applications.

How many USB 3.0 downstream ports does the TUSB7340RKMT support, and are they electrically independent?

The TUSB7340RKMT supports exactly four USB 3.0 downstream ports (DN1–DN4), each with fully independent electrical interfaces. Each port has dedicated SuperSpeed TX/RX differential pairs, HS/FS/LS D+/D− lines, PWRON# and OVERCUR# signals, and individually configurable PHY settings-including transmit swing, de-emphasis, and adaptive equalizer mode. This independence allows mixed-speed attachment (e.g., two SS devices + two HS devices) and per-port power gating without affecting other ports.

What thermal management provisions are specified for the TUSB7340RKMT in its RKM package?

The TUSB7340RKMT in its 100-pin WQFN-MR (RKM) package specifies RθJA = 25.6°C/W and RθJC(bot) = 0.4°C/W. The exposed thermal pad (VSS) must be soldered to a solid PCB ground plane to achieve rated thermal performance. Junction temperature is rated up to 105°C, with recommended operating ambient of 0°C to 85°C. Thermal design must account for peak power dissipation of 1303.5 mW during full 4-port SuperSpeed operation, and the device includes thermal shutdown protection per TI specifications.

Can the TUSB7340RKMT operate with a single-ended 48 MHz clock instead of a crystal?

Yes, the TUSB7340RKMT supports both crystal and single-ended oscillator inputs. When using a 48 MHz oscillator, it connects to the XI pin (A23), with XO (A22) left unconnected. The FREQSEL pin (B14) must be held low to configure the internal PLL for 48 MHz input. A 2 MΩ feedback resistor between XI and XO is required only when using a crystal; it is omitted with oscillator input. GRST# must remain asserted until the 48 MHz clock is stable before release.

TUSB7340RKMT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
100-WQFN Dual Rows, Exposed Pad
Programmable:
Not Verified
Protocol:
USB
Function:
Host Controller
Interface:
USB, PCIe
Standards:
USB 3.0
Voltage - Supply:
1.1V, 3.3V
Current - Supply:
-
Operating Temperature:
0°C ~ 70°C
Supplier Device Package:
100-WQFN-MR (9x9)
Grade:
-
Qualification:
-

TUSB7340RKMT FAQ

1.How can I place an order for TUSB7340RKMT through Aetrix?

Please submit a Request for Quotation (RFQ) for TUSB7340RKMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TUSB7340RKMT reliable?

The price and inventory of TUSB7340RKMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TUSB7340RKMT is usually 5 days.

3.What payment methods are accepted for TUSB7340RKMT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TUSB7340RKMT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TUSB7340RKMT?

TUSB7340RKMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TUSB7340RKMT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TUSB7340RKMT?

For technical support, including TUSB7340RKMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TUSB7340RKMT requirements.

6.How does Aetrix verify that TUSB7340RKMT is sourced from the original manufacturer or authorized distributors?

All TUSB7340RKMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TUSB7340RKMT meets industry standards.

7.What is the process for return or replacement of TUSB7340RKMT?

All TUSB7340RKMT units undergo pre-shipment inspection (PSI). If there is an issue with TUSB7340RKMT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TUSB7340RKMT part is unused and in its original packaging.

Return procedure for TUSB7340RKMT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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