Texas Instruments TUSB8043AIRGCR

Overview

TUSB8043AIRGCR from Texas Instruments is a four-port USB 3.2 x1 Gen1 (5 Gbps) hub IC with integrated USB 2.0 MTT architecture, supporting simultaneous SuperSpeed and high-speed upstream connectivity and per-port power switching, over-current detection, and battery charging modes (CDP/DCP/ACP/Galaxy/YD/T 1591-2009) for docking stations and monitors.

For engineers reviewing the TUSB8043AIRGCR datasheet, TUSB8043AIRGCR pinout, TUSB8043AIRGCR application, or TUSB8043AIRGCR equivalent, key selection considerations include its 64-pin VQFN (RGC) package, 24-MHz single-clock input, internal USB HID-to-I2C interface for EEPROM programming, OTP/EEPROM/SMBus configurability of VID/PID/port settings, and support for both individual and ganged power management.

Technical Context

The TUSB8043AIRGCR implements a Multi-Transaction Translator (MTT) USB 2.0 hub with four independent transaction translators and two asynchronous endpoint buffers per translator, enabling concurrent full-speed/low-speed device handling. Its USB 3.2 x1 Gen1 interface operates at 5 Gbps with separate differential TX/RX pairs per downstream port and full upstream SuperSpeed receiver/transmitter capability.

It integrates an internal USB HID-to-I2C master supporting 100 kHz/400 kHz operation, clock stretching, and vendor-requested I2C/EEPROM access-enabling in-system configuration of custom strings, serial numbers, and port behavior without external microcontroller intervention. Power management is configurable via pin strapping (PWRCTL_POL, GANGED, AUTOENz) or I2C/SMBus, with dedicated BATENx pins for per-port battery charging enable control.

Key Specifications

Pinout & Package

Package: 64-pin VQFN (RGC), 9.0 mm × 9.0 mm, exposed thermal pad (VSS) requiring PCB ground connection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB hub applications.

Compared with USB2514B-AEZG, TUSB8043AIRGCR adds 5-Gbps bandwidth, integrated battery charging, and HID-to-I2C-but increases complexity and cost. Compared with TUSB8041ARGCR, it delivers three additional downstream ports in the same footprint, enabling higher peripheral density without redesigning layout or firmware.

Availability

TUSB8043AIRGCR is available at Aetrix Electronics and suitable for docking stations, monitor-integrated hubs, set-top boxes, and industrial control panels requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TUSB8043AIRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The TUSB8043A belongs to TI's USB hub product line, designed specifically for high-density, low-latency USB 3.x expansion in space-constrained systems where integrated power management and battery charging are critical.

FAQ

What USB standards does the TUSB8043AIRGCR support?

The TUSB8043AIRGCR supports USB 3.2 x1 Gen1 (5 Gbps) and USB 2.0 High-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps). It implements a Multi-Transaction Translator (MTT) architecture for concurrent USB 2.0 device handling and automatically disables SuperSpeed lanes when the upstream port operates in USB 2.0-only mode. The TUSB8043AIRGCR maintains full backward compatibility across all speed tiers without host-side configuration changes.

How is the TUSB8043AIRGCR configured for custom VID/PID and port behavior?

The TUSB8043AIRGCR supports configuration via OTP ROM, external I2C EEPROM, or SMBus slave interface. VID/PID, port customizations, and manufacturer/product strings (except those stored in OTP ROM) are programmable through these interfaces. The TUSB8043AIRGCR also enables in-system EEPROM programming via its USB 2.0 upstream port using the built-in HID-to-I2C master, eliminating the need for external programmers during manufacturing or field updates.

Does the TUSB8043AIRGCR support battery charging for downstream devices?

Yes, the TUSB8043AIRGCR supports multiple battery charging protocols: Battery Charging Downstream Port (CDP) when upstream is connected; Dedicated Charging Port (DCP) and Automatic Charging Port (ACP1–ACP3) when upstream is unconnected; Galaxy Charging; and compliance with Chinese Telecommunications Industry Standard YD/T 1591-2009. These modes are implemented in hardware and initialized via BATENx pin strapping or I2C register writes-no host driver involvement is required for basic charging handshaking. The TUSB8043AIRGCR provides dedicated pins (PWRCTLx/BATENx) to control external power switches per port.

What is the role of the internal USB HID-to-I2C interface in the TUSB8043AIRGCR?

The internal USB HID-to-I2C interface in the TUSB8043AIRGCR allows standard USB HID class commands to read/write I2C peripherals-including external EEPROMs-without requiring a separate microcontroller. It operates at 100 kHz or 400 kHz (default), supports clock stretching, and enables in-system programming of configuration data. This feature lets system designers update VID/PID, port settings, or custom strings post-manufacture using only a USB host, reducing test complexity and enabling field firmware flexibility. The TUSB8043AIRGCR exposes this function through its internal downstream USB 2.0 port.

What package and thermal requirements apply to the TUSB8043AIRGCR?

The TUSB8043AIRGCR uses a 64-pin VQFN (RGC) package measuring 9.0 mm × 9.0 mm with an exposed thermal pad (VSS) that must be soldered to a solid PCB ground plane for thermal and electrical integrity. Its junction-to-board thermal resistance is 5.3°C/W, and recommended operating ambient temperature is 0°C to 70°C. The TUSB8043AIRGCR requires decoupling capacitors on both VDD (1.1 V) and VDD33 (3.3 V) rails, and the thermal pad must be connected to at least six vias to an internal ground plane to maintain junction temperature below 105°C under full load.