Texas Instruments TVB1440RGZR

Overview

TVB1440RGZR from Texas Instruments is a 4-channel high-speed video re-driver IC designed for signal integrity restoration between digital TV chipsets and TCON boards. It supports data rates from 600 Mbps to 5 Gbps, provides 0–15 dB programmable CTLE equalization per channel, delivers 350–1000 mVpp output swing, and operates from dual supplies (3.3 V IO / 1.1 V core). It is deployed in 4K2K TV panel interfaces with FPD-Link II compatibility.

For engineers reviewing the TVB1440RGZR datasheet, TVB1440RGZR pinout, TVB1440RGZR application, or TVB1440RGZR equivalent, this page delivers verified electrical specifications, I2C-configurable equalization and pre-emphasis settings, thermal metrics for QFN-48 layout, squelch behavior timing, and real-world 4-lane 5-Gbps eye recovery performance - all confirmed from TI's SLASE51A datasheet and functional register maps.

Technical Context

The TVB1440RGZR implements four independent continuous-time linear equalizer (CTLE) receivers followed by configurable pre-emphasis drivers, each supporting selectable gain (0–15 dB EQ), 4-level output voltage swing (350/500/700/1000 mVpp), and 4-level pre-emphasis (0/3/6/9 dB). Its I2C-controlled architecture enables per-lane optimization for trace/cable loss compensation.

It integrates activity-detection-based squelch (default 80 mVpp threshold), shutdown mode (<2 mW), and power-up sequencing requirements (tramp1 = 10 µs, tramp2 = 100 µs). All lanes are AC-coupled; input/output common-mode bias is internally generated, and external 75–200 nF coupling capacitors are recommended.

Key Specifications

Pinout & Package

TVB1440RGZR is housed in a 48-pin VQFN package (RGZ suffix) with 7.00 mm × 7.00 mm body size and 0.5 mm pitch. The exposed thermal pad (4.1 mm × 4.1 mm) must be soldered to PCB ground for thermal compliance (RθJB = 11.7 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar video re-driver applications.

Compared with SN65DP159RGZR and MAX9271GTJ+T, TVB1440RGZR uniquely supports FPD-Link II-compliant 4-channel re-driving with per-lane I2C-programmable CTLE, making it the only drop-in solution for existing digital TV chipset-to-TCON interconnects requiring minimal layout change and no protocol conversion.

Availability

TVB1440RGZR is available at Aetrix Electronics and suitable for 4K2K television manufacturing, FPD-Link II video aggregation systems, and industrial video monitoring applications requiring stable component supply across multi-year production cycles.

Supply support for TVB1440RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer electronics markets.

The TVB1440RGZR belongs to TI's high-speed interface signal conditioning product line, engineered specifically to solve signal integrity challenges in digital TV video interconnects between SoCs and TCONs operating at 3.75–5 Gbps.

FAQ

What is the primary function of the TVB1440RGZR in a digital TV system?

The TVB1440RGZR functions as a 4-channel high-speed video re-driver that restores signal integrity between digital TV chipsets and TCON boards. It compensates for channel loss using programmable CTLE equalization and enhances output drive strength via configurable pre-emphasis and voltage swing. In a typical 4K2K TV, TVB1440RGZR is placed at either end of the flex cable to maintain eye opening and reduce jitter, ensuring reliable transmission of 3840×2160@120Hz video with 10-bit color depth.

How does the I2C interface configure the TVB1440RGZR's equalization and output settings?

The TVB1440RGZR uses a standard-mode (100 kHz) I2C interface (SCL_CTL/SDA_CTL pins) to access its local register space. Configuration requires writing to specific addresses - for example, setting bit 7 of register 05h enables I2C-controlled EQ, then bits 2:0 of registers 05h, 07h, 09h, and 0Bh set per-lane equalization levels (0–15 dB). Output voltage swing and pre-emphasis are programmed via LINK address space registers (e.g., 00103h–00106h), accessed indirectly through address pointers 1Ch–1Eh and data register 1Fh. The ADDR pin selects one of three 7-bit slave addresses (0x58/0x5A/0x5C).

What are the power supply requirements and sequencing constraints for the TVB1440RGZR?

The TVB1440RGZR requires two dedicated supplies: VCC = 3.3 V ±10 % for I/O and output drivers, and VDD = 1.1 V ±14 % for the analog core and CTLE. Power-up sequencing mandates that VDD stabilize for ≥10 µs before applying VCC, and RSTN must remain asserted for ≥100 µs after both supplies reach minimum operating voltage. Failure to follow this sequence risks undefined register states or initialization failure. Decoupling capacitors (e.g., 100 nF ceramic + 4.7 µF tantalum per supply) are mandatory adjacent to each VDD/VCC pin.

Does the TVB1440RGZR support automatic power management, and how is it controlled?

Yes, the TVB1440RGZR supports three power states: Active (175 mW), Squelch (output disable, ~50 mA), and Shutdown (<2 mW). Squelch activates automatically when input signal amplitude falls below the programmable threshold (default 80 mVpp); exit occurs within 1 µs of valid signal return. Shutdown is triggered by asserting RSTN low or disabling EN. Both RSTN and EN incorporate internal pull-ups (150 kΩ and 200 kΩ respectively), allowing simple GPIO control. The squelch feature can be disabled via I2C register 03h bit 3 if continuous monitoring is required.

What package and thermal considerations apply to the TVB1440RGZR layout?

The TVB1440RGZR uses a 48-pin VQFN (RGZ) package measuring 7.00 mm × 7.00 mm with 0.5 mm pitch and an exposed 4.1 mm × 4.1 mm thermal pad. This pad must be soldered to a solid copper ground plane with ≥6 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) to achieve RθJB = 11.7 °C/W. Layout requires strict differential pair routing (100 Ω ±10 %), AC coupling capacitors (75–200 nF) on all IN/OUT lanes, and separation of VDD (1.1 V) and VCC (3.3 V) power domains with dedicated ferrite beads and LC filtering to prevent noise coupling into the CTLE path.