Texas Instruments TXB0102DCUT

Overview

TXB0102DCUT from Texas Instruments is a 2-bit bidirectional voltage-level translator with auto direction sensing, supporting 1.2 V to 3.6 V on A port and 1.65 V to 5.5 V on B port (VCCA ≤ VCCB), ±15-kV HBM ESD protection on B port, 4-µA max ICC, and Ioff partial-power-down capability. It enables low-voltage interconnect between mixed-supply domains in space-constrained mobile interfaces.

For engineers reviewing the TXB0102DCUT datasheet, TXB0102DCUT pinout, TXB0102DCUT application, or TXB0102DCUT equivalent, key selection criteria include its auto-sensing bidirectional operation, VCC isolation behavior, nanoscale VSSOP-8 packaging, and guaranteed 100-Mbps data rate at 3.3-V/5-V translation.

Technical Context

The TXB0102DCUT implements dual-rail translation using internal pass-gate architecture with automatic direction detection-no external control signals required beyond OE. Its VCC isolation feature forces all outputs into high-impedance when either VCCA or VCCB is at GND, preventing backdrive during power sequencing.

It supports partial-power-down via Ioff, which disables I/Os and blocks current flow when either supply is off. OE input is referenced to VCCA, requiring pulldown resistor tie-off for safe power-up state, and operates across –40°C to +85°C with latch-up immunity exceeding 100 mA per JESD78 Class II.

Key Specifications

Pinout & Package

VSSOP-8 package (2.30 mm × 2.00 mm) with exposed pad not present; NanoFree™ die-as-package construction minimizes footprint and thermal resistance (RθJA = 168.7°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage translation applications.

Compared with TXS0102DCUR and SN74AVC2T244RSWR, the TXB0102DCUT uniquely delivers auto-direction sensing with VCC isolation and ±15-kV B-port ESD-making it optimal for space-limited, high-reliability mobile interfaces where direction logic and power sequencing cannot be guaranteed.

Availability

TXB0102DCUT is available at Aetrix Electronics and suitable for smartphone, tablet, and wearable electronics requiring stable component supply, rapid prototyping turnaround, and long-term production continuity.

Supply support for TXB0102DCUT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in precision analog, power management, and interface technologies.

The TXB0102DCUT belongs to TI's voltage translation portfolio, designed specifically for ultra-low-power, space-constrained bidirectional interconnect in portable consumer electronics and IoT edge devices.

FAQ

What is the maximum supported data rate for TXB0102DCUT under typical operating conditions?

The TXB0102DCUT supports up to 100 Mbps when translating between 2.5-V/3.3-V A-port and 3.3-V/5-V B-port configurations, as validated across –40°C to +85°C. At lower voltage combinations (e.g., VCCA = 1.2 V), the max data rate drops to 20 Mbps. These values are measured with CL = 15 pF and specified in Sections 5.11–5.12 of the TXB0102DCUT datasheet.

Does TXB0102DCUT require external pull-up or pull-down resistors on its I/O pins?

No, TXB0102DCUT does not require external pull-up or pull-down resistors on A1, A2, B1, or B2 pins under normal operation. TI explicitly advises against pullups on these I/Os. If open-drain compatibility is needed, the TXS0102DCUR is recommended instead. For OE, a ≥50-kΩ pulldown resistor to GND is mandatory to ensure high-Z state during power-up.

How does the VCC isolation feature function in TXB0102DCUT during power sequencing?

When either VCCA or VCCB is at GND, the TXB0102DCUT internally forces all four I/Os (A1, A2, B1, B2) into high-impedance state regardless of OE status. This prevents back-driving between live and unpowered rails-a critical safeguard during asymmetric power-up/down sequences common in multi-rail mobile SoCs. The feature is intrinsic to the device architecture and requires no external circuitry.

Can TXB0102DCUT translate between 1.2-V and 5-V logic levels?

Yes, TXB0102DCUT supports translation from 1.2-V A-port to 5-V B-port (and vice versa) provided VCCA ≤ VCCB is strictly maintained. In this configuration, the device achieves 20 Mbps max data rate and 5.5–5.8 ns typical propagation delay (A→B). Electrical characteristics-including VOL/VOH and timing-are fully characterized across this range in Sections 5.5–5.6 of the TXB0102DCUT datasheet.

What is the thermal performance of TXB0102DCUT in its VSSOP-8 package?

The TXB0102DCUT in DCUT (VSSOP-8) package has a junction-to-ambient thermal resistance (RθJA) of 168.7°C/W and junction-to-board (RθJB) of 78.1°C/W. Under typical 4-µA ICC operation, self-heating is negligible (<0.7°C rise at 25°C ambient). The package supports reflow soldering per JEDEC J-STD-020 and is qualified for industrial temperature range (–40°C to +85°C).