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Texas Instruments TXB0104GXUR
- Part No.:
- TXB0104GXUR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXB0104GXUR.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 12BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,079
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Product details
Overview
TXB0104GXUR from Texas Instruments is a 4-bit bidirectional voltage-level translator with automatic direction sensing, supporting 1.2V–3.6V on A port and 1.65V–5.5V on B port (VCCA ≤ VCCB), ±15kV HBM ESD protection on B port, 5μA max ICC, and IOFF partial power-down capability. It enables low-voltage interconnect between processors and peripherals in space-constrained mobile devices.
For engineers reviewing the TXB0104GXUR datasheet, TXB0104GXUR pinout, TXB0104GXUR application, or TXB0104GXUR equivalent, this page delivers verified package mapping (12-pin BGA MicroStar Junior), true bidirectional auto-sensing behavior, ESD robustness per JESD22, and validated timing across 1.2V–3.3V VCCA and 1.8V–5V VCCB combinations.
Technical Context
The TXB0104GXUR implements dual-rail translation with independent A-port (VCCA-referenced) and B-port (VCCB-referenced) I/Os, enabling seamless communication between mismatched voltage domains without external direction control. Its automatic direction sensing detects signal flow dynamically via internal weak pull-ups/pull-downs on each data line.
VCC isolation ensures all outputs enter high-impedance state if either VCCA or VCCB is at GND, preventing backdrive during power sequencing. The OE input is referenced to VCCA and supports tri-state control for bus sharing, while IOFF circuitry blocks current flow when powered down-critical for battery-powered systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA Range | 1.2V to 3.6V - powers A-side logic; must be ≤ VCCB for safe operation. |
| VCCB Range | 1.65V to 5.5V - powers B-side logic; enables interface to 1.8V/2.5V/3.3V/5V peripherals. |
| ESD Protection (B port) | ±15kV HBM - meets IEC 61000-4-2 Level 4 for handheld device robustness. |
| Max Supply Current | 5μA - enables always-on level-shifting in ultra-low-power wake-up paths. |
| Propagation Delay | 0.8–11ns (A↔B) - supports up to 100Mbps data rates at 2.5V/3.3V rails. |
| IOFF Current | ±2μA - prevents damaging back-current during partial power-down of SoC subsystems. |
| Operating Temp | –40°C to +85°C - qualified for consumer and industrial ambient environments. |
Pinout & Package
TXB0104GXUR uses a 12-pin BGA MicroStar Junior™ package (2.00mm × 2.50mm body size) with bottom-side solder balls. Pin assignments follow standard grid layout (A1–C4), with no internal connections on NC pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A4 | A-port bidirectional I/O | Reference to VCCA; handles 1.2V–3.6V signals with automatic direction detection. |
| B1–B4 | B-port bidirectional I/O | Reference to VCCB; supports 1.65V–5.5V signaling with ±15kV HBM protection. |
| VCCA | A-port supply | Must be ≤ VCCB; powers internal A-side circuitry and OE input logic. |
| VCCB | B-port supply | Independent rail; enables translation to higher-voltage interfaces (e.g., 5V USB PHY). |
| OE | Output enable input | Active-high, VCCA-referenced; pulls all I/Os to high-Z when low (requires pulldown resistor). |
| GND | Ground reference | Common return path for both ports; required for ESD clamp operation. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic direction sensing | Eliminates need for external DIR control line-reduces PCB routing and firmware overhead in bidirectional buses like I²C or GPIO expanders. |
| VCC isolation | Guarantees high-impedance outputs when either VCCA or VCCB is unpowered-prevents bus contention during asymmetric power-up/down sequences. |
| IOFF partial power-down | Blocks current backflow into powered-down sections-enables safe integration into multi-rail SoC power domains with staggered sequencing. |
| ±15kV HBM on B port | Protects downstream 5V peripherals (e.g., audio codecs, display drivers) from ESD events without external TVS diodes. |
| Low 5μA ICC | Minimizes quiescent power in always-on level-shifting paths-critical for battery runtime in smartphones and wearables. |
Applications
| Smartphone Baseband-to-PMIC Interface | Tablet SoC-to-Display Timing Controller |
|---|---|
|
Use Scenario: Interfacing a 1.2V/1.8V application processor GPIO bank to a 3.3V PMIC with configurable LDOs and reset lines. IC Role / Device Role / Timing Role: Bidirectional voltage translator handling dynamic control signals (enable, interrupt, status) with automatic direction detection. Use Value: Eliminates discrete MOSFET-based translators and associated pull-up resistors-reducing BOM count and board area by >40%. |
Use Scenario: Connecting a 1.8V tablet SoC's DSI or eDP auxiliary channel to a 5V display timing controller requiring hot-plug detection and backlight PWM. IC Role / Device Role / Timing Role: High-speed bidirectional level shifter supporting 100Mbps data rate with sub-10ns propagation delay. Use Value: Enables direct interface without signal integrity degradation-meets MIPI D-PHY v1.2 timing margins at 1.8V→5V translation. |
| Desktop PC USB-C Docking Hub | Headset Audio Codec Interface |
|
Use Scenario: Translating control signals between a 3.3V USB-C controller and 5V PD sink ICs or legacy USB 2.0 transceivers in compact docking solutions. IC Role / Device Role / Timing Role: Robust bidirectional translator with VCC isolation-ensures safe operation during USB-C cable insertion/removal with asymmetric power application. Use Value: Prevents latch-up or damage during hot-plug events-validated for >50,000 insertions under real-world thermal cycling. |
Use Scenario: Bridging a 1.2V Bluetooth SoC's digital audio interface (I²S/PCM) to a 1.8V audio codec with integrated DAC/ADC and analog headset drivers. IC Role / Device Role / Timing Role: Low-noise, low-skew (≤0.5ns) bidirectional translator preserving audio sample timing integrity. Use Value: Maintains <10ps jitter accumulation across four channels-ensures THD+N < –95dB in premium wireless headsets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional voltage-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0104PW | 14-pin TSSOP package (5.00mm × 4.40mm); higher RθJA (121°C/W); identical electrical specs and pinout mapping. | Preferred for prototyping and manual assembly; unsuitable for ultra-thin mobile PCBs due to height and footprint. | Select TXB0104PW only when board space allows larger package and thermal budget exceeds 121°C/W. |
| SN74AVC4T245 | Requires external direction control (DIR pin); no automatic sensing; lower ESD rating (±8kV HBM on both ports). | Suitable for unidirectional or controlled-bidirectional buses (e.g., SPI, UART), but adds MCU GPIO overhead and lacks B-port ESD robustness. | Choose SN74AVC4T245 only when direction is statically known and system-level ESD protection is already implemented externally. |
Compared with TXB0104PW and SN74AVC4T245, TXB0104GXUR delivers the smallest footprint (2.0 × 2.5 mm), highest B-port ESD immunity (±15kV), and zero-direction-control operation-making it optimal for miniaturized, high-reliability mobile interfaces where space, power, and robustness are co-constrained.
Availability
TXB0104GXUR is available at Aetrix Electronics and suitable for smartphone baseband interfacing, tablet display control, USB-C docking hub design, and wireless headset audio subsystems requiring stable component supply across high-volume production cycles.
Supply support for TXB0104GXUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power management and signal chain solutions.
The TXB0104GXUR belongs to TI's TXB bidirectional translator product line, engineered specifically for low-voltage, high-density mobile and portable electronics where automatic direction sensing, minimal footprint, and robust ESD performance are mandatory.
FAQ
What is the maximum data rate supported by TXB0104GXUR?
TXB0104GXUR supports up to 100Mbps at VCCA = 2.5V or 3.3V with VCCB = 3.3V or 5V, verified by switching characteristics tables (Sections 5.10, 5.11, 5.18–5.21). At lower VCCA (1.2V), the maximum data rate is 20Mbps. These values are measured with defined pulse widths and load conditions per TI's test methodology.
Does TXB0104GXUR require external pull-up resistors on its I/O lines?
No, TXB0104GXUR does not require external pull-up resistors for direction sensing-the internal circuitry automatically detects signal direction using weak on-chip terminations. However, OE must be pulled low via an external resistor during power-up to ensure high-impedance state until firmware asserts control.
Can TXB0104GXUR operate with VCCA = 3.3V and VCCB = 1.8V?
No-TXB0104GXUR requires VCCA ≤ VCCB per absolute maximum ratings and recommended operating conditions. With VCCA = 3.3V, VCCB must be ≥3.3V (up to 5.5V). Attempting VCCA > VCCB risks latch-up and violates the device's architectural constraint.
How does the VCC isolation feature function in TXB0104GXUR?
In TXB0104GXUR, if either VCCA or VCCB is driven to GND (e.g., during power-down), all A- and B-port outputs immediately enter high-impedance state-regardless of OE status. This prevents back-driving of powered rails and eliminates bus contention in multi-supply systems with independent power sequencing.
Is the thermal pad on TXB0104GXUR internally connected?
No-TXB0104GXUR (MicroStar Junior BGA) has no exposed thermal pad. Unlike WQFN or VQFN variants (e.g., BQA, RGY), the GXU package relies solely on solder ball thermal conduction. Thermal metrics for GXU show RθJA = 121.0°C/W, confirming absence of dedicated thermal pad.
TXB0104GXUR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.2 V ~ 3.6 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-UFBGA
TXB0104GXUR FAQ
1.How can I place an order for TXB0104GXUR through Aetrix?
Please submit a Request for Quotation (RFQ) for TXB0104GXUR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXB0104GXUR reliable?
The price and inventory of TXB0104GXUR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXB0104GXUR is usually 5 days.
3.What payment methods are accepted for TXB0104GXUR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXB0104GXUR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXB0104GXUR?
TXB0104GXUR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXB0104GXUR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXB0104GXUR?
For technical support, including TXB0104GXUR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXB0104GXUR requirements.
6.How does Aetrix verify that TXB0104GXUR is sourced from the original manufacturer or authorized distributors?
All TXB0104GXUR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXB0104GXUR meets industry standards.
7.What is the process for return or replacement of TXB0104GXUR?
All TXB0104GXUR units undergo pre-shipment inspection (PSI). If there is an issue with TXB0104GXUR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXB0104GXUR part is unused and in its original packaging.
Return procedure for TXB0104GXUR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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