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Texas Instruments TXB0106RGYR
- Part No.:
- TXB0106RGYR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXB0106RGYR.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:17,104
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Product details
Overview
TXB0106RGYR from Texas Instruments is a 6-bit bidirectional voltage-level translator with auto-direction sensing, supporting 1.2V–3.6V on A port and 1.65V–5.5V on B port (VCCA ≤ VCCB), ±15kV HBM ESD protection on B port, 4μA max ICC, and Ioff partial-power-down capability. It enables seamless logic-level interfacing between mixed-voltage subsystems in portable USB-C peripherals.
For engineers reviewing the TXB0106RGYR datasheet, TXB0106RGYR pinout, TXB0106RGYR application, or TXB0106RGYR equivalent, key selection criteria include its VQFN-16 (4.0mm × 3.5mm) package, OE-referenced-to-VCCA control, VCC isolation behavior, channel-to-channel skew as low as 0.3ns at 3.3V, and compatibility with push-pull CMOS-not open-drain-interfaces.
Technical Context
The TXB0106RGYR implements a buffered, edge-rate-accelerated architecture with dual one-shot circuits per I/O channel to enhance transition speed without external direction control. Its auto-sensing operation relies on weak-output drivers that allow external signals to override state during bus reversal.
Each channel features independent A- and B-port referencing: A-port I/Os track VCCA (1.2V–3.6V), B-port I/Os track VCCB (1.65V–5.5V), and OE is strictly referenced to VCCA. The device enters high-impedance state when OE = GND or either VCC rail drops to 0V, satisfying Ioff requirements for hot-plug and partial-power-down systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA Range | 1.2V to 3.6V - defines minimum logic threshold and power domain for A-side interface (e.g., 1.8V SoC GPIO) |
| VCCB Range | 1.65V to 5.5V - supports legacy 3.3V/5V peripherals while maintaining VCCA ≤ VCCB constraint |
| Max Data Rate | 100 Mbps at VCCA = 3.3V/VCCB = 3.3V - enables high-speed UART, I²C fast-mode+, and SPI clock domains |
| B-port ESD | ±15kV HBM - provides robust protection for exposed USB-C, audio jack, or display interface connections |
| ICC (max) | 4 μA - ensures negligible quiescent current in always-on system management rails |
| Channel Skew | 0.3 ns (typ) at 3.3V - preserves timing integrity across all 6 data lines in synchronous buses |
| Ioff Support | Yes - prevents backflow current during VCCA/VCCB power sequencing mismatches or shutdown |
Pinout & Package
VQFN-16 package (RGY), 4.00mm × 3.50mm body, 0.5mm pitch, exposed thermal pad (electrically optional, recommended as secondary ground).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A6 | A-port bidirectional I/O | Referenced to VCCA; auto-senses direction; requires ≥±2mA drive strength from external source |
| B1–B6 | B-port bidirectional I/O | Referenced to VCCB; handles higher voltage domains; ±15kV HBM protected |
| OE | Output enable input | Active-high, VCCA-referenced; drives all I/Os into high-Z when low; must be pulled down via resistor during power-up |
| VCCA | A-port supply | Primary power for A-side logic and OE circuitry; must not exceed VCCB |
| VCCB | B-port supply | Primary power for B-side logic; supplies internal level-shifting transistors and B-port ESD clamps |
| GND | Common reference | Single ground plane required; no separate analog/digital GND pins |
Key Features
| Feature | Design Value |
|---|---|
| Auto-direction sensing | Eliminates need for external direction-control signal or GPIO, reducing PCB routing and firmware overhead in bidirectional buses |
| VCC isolation | Guarantees high-impedance outputs if either VCCA or VCCB falls to 0V-critical for safe hot-swap and power-rail sequencing |
| Edge-rate acceleration | One-shot circuitry reduces rise/fall times (e.g., 0.5ns–3ns typical) to sustain 100 Mbps data rates without signal integrity degradation |
| Ioff partial-power-down | Blocks current flow between powered and unpowered rails, meeting JEDEC JESD78 Class II latch-up immunity (>100mA) |
| Low ICC | 4μA max supply current enables integration into battery-backed real-time clocks or always-on sensor hubs without measurable drain |
Applications
| USB-C Audio Adapter | Smartphone Baseband Interface |
|---|---|
Use Scenario: Translating 1.8V baseband processor GPIO to 3.3V audio codec I²S and control lines in compact USB-C dongles. IC Role / Device Role / Timing Role: Bidirectional voltage translator enabling full-duplex I²S data and bidirectional I²C configuration without direction pin or timing margin loss. Use Value: 0.3ns channel skew preserves I²S frame alignment; ±15kV B-port ESD protects exposed USB-C connector pins from user-handling discharge. |
Use Scenario: Interfacing 1.2V application processor GPIO to 2.5V/3.3V camera sensor and display timing controllers. IC Role / Device Role / Timing Role: Level-shifting bridge for MIPI D-PHY control signals and camera reset/standby lines with guaranteed sub-10ns propagation delay. Use Value: 100 Mbps max data rate supports high-frequency camera register writes; VCC isolation prevents latch-up during camera module hot-plug. |
| Tablet System Management Bus | Desktop PC Embedded Controller Link |
Use Scenario: Connecting 1.5V PMIC telemetry outputs and 3.3V embedded controller SMBus lines in ultra-thin tablets. IC Role / Device Role / Timing Role: Voltage translator for SMBus 100 kHz/400 kHz bidirectional clock/data lines with automatic direction detection. Use Value: Ioff support allows PMIC to power down independently while EC remains active; 4μA ICC minimizes system standby leakage. |
Use Scenario: Bridging 1.8V host CPU SMBus to 5V legacy Super I/O chip in desktop motherboards. IC Role / Device Role / Timing Role: Robust level shifter for system management bus with ±15kV HBM on 5V side to withstand chassis ESD events. Use Value: VQFN-16 footprint saves space vs TSSOP; VCC isolation prevents EC lockup during CPU VRM brownout conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level-shifting applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0108EPRMR | Open-drain architecture with stronger pull-ups; no VCC isolation; 8-channel; higher ICC (20μA) | Required for I²C/SMBus open-drain buses; unsuitable for push-pull SPI/UART where TXB0106RGYR excels | Select TXS0108EPRMR only when translating true open-drain signals; TXB0106RGYR is preferred for push-pull CMOS interfaces. |
| SN74AVC4T245RTER | Direction-controlled (DIR pin required); 4-channel; lower ESD (±8kV HBM); no auto-sensing | Requires additional GPIO for DIR control; lacks VCC isolation and B-port ±15kV rating | Choose SN74AVC4T245RTER only when board layout permits DIR routing and ESD requirements are less stringent. |
Compared with TXS0108EPRMR and SN74AVC4T245RTER, TXB0106RGYR uniquely delivers auto-direction sensing, VCC isolation, and ±15kV B-port ESD in a 6-channel VQFN package-making it optimal for space-constrained, hot-pluggable, mixed-voltage push-pull interfaces where direction control overhead or ESD robustness cannot be compromised.
Availability
TXB0106RGYR is available at Aetrix Electronics and suitable for USB-C peripheral design, smartphone baseband interfacing, and tablet system management requiring stable component supply, consistent parametric performance across temperature, and long-term lifecycle availability.
Supply support for TXB0106RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with over 90 years of innovation in power management and signal chain technologies.
The TXB0106RGYR belongs to TI's voltage translation portfolio, engineered specifically for bidirectional, directionless logic-level bridging in portable and embedded systems where space, power, and ESD robustness are critical.
FAQ
What is the maximum supported data rate for TXB0106RGYR at 1.8V A-port and 3.3V B-port operation?
The TXB0106RGYR supports up to 60 Mbps under those conditions, as specified in Section 5.9 of the datasheet. This value is validated across temperature (–40°C to 85°C) and accounts for worst-case propagation delay and channel skew. Performance is maintained without external direction control or timing compensation circuitry.
Does TXB0106RGYR require external pull-up or pull-down resistors on its I/O lines?
No, TXB0106RGYR does not require external pull-up or pull-down resistors for normal operation. Its auto-direction architecture uses internal weak drivers and edge accelerators. If used in open-drain contexts (e.g., I²C), an external pull-up is needed-but TXB0106RGYR itself is not rated for open-drain translation.
Can TXB0106RGYR translate between 1.2V and 5V logic levels?
Yes, TXB0106RGYR supports VCCA = 1.2V and VCCB = 5V, provided VCCA ≤ VCCB is satisfied. Electrical characteristics-including VOHB, VOLB, and timing-are fully specified for this combination in Sections 5.5 and 5.12–5.13, with 20 Mbps max data rate and 8.5ns typical tpd.
Is the exposed thermal pad on the RGY package required to be grounded?
The exposed thermal pad on TXB0106RGYR's VQFN-16 package may be left electrically open or connected to GND as a secondary ground. TI documentation states it is not mandatory but improves thermal performance and ESD dissipation when tied to GND with appropriate solder mask clearance.
How does TXB0106RGYR behave during power-up when VCCA ramps before VCCB?
TXB0106RGYR tolerates VCCA ramping before VCCB without damage. Its internal circuitry places all outputs in high-impedance state until both supplies stabilize above valid thresholds. This eliminates bus contention risk during asymmetric power sequencing common in multi-rail portable designs.
TXB0106RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 6
- Voltage - VCCA:
- 1.2 V ~ 3.6 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VFQFN Exposed Pad
TXB0106RGYR FAQ
1.How can I place an order for TXB0106RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for TXB0106RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXB0106RGYR reliable?
The price and inventory of TXB0106RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXB0106RGYR is usually 5 days.
3.What payment methods are accepted for TXB0106RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXB0106RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXB0106RGYR?
TXB0106RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXB0106RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXB0106RGYR?
For technical support, including TXB0106RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXB0106RGYR requirements.
6.How does Aetrix verify that TXB0106RGYR is sourced from the original manufacturer or authorized distributors?
All TXB0106RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXB0106RGYR meets industry standards.
7.What is the process for return or replacement of TXB0106RGYR?
All TXB0106RGYR units undergo pre-shipment inspection (PSI). If there is an issue with TXB0106RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXB0106RGYR part is unused and in its original packaging.
Return procedure for TXB0106RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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