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Texas Instruments TXB0108YZPR2
- Part No.:
- TXB0108YZPR2
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXB0108YZPR2.pdf
- Description:
- IC TRANSLATOR BIDIR 20DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:5,848
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Product details
Overview
TXB0108YZPR2 from Texas Instruments is an 8-bit bidirectional voltage-level translator with auto-direction sensing, supporting 1.2V–3.6V on A port and 1.65V–5.5V on B port (VCCA ≤ VCCB), ±15kV HBM ESD protection on B port, 4μA max ICC, and Ioff partial-power-down capability. It enables seamless logic-level translation between mixed-voltage domains in mobile processor-peripheral interfaces.
For engineers reviewing the TXB0108YZPR2 datasheet, TXB0108YZPR2 pinout, TXB0108YZPR2 application, or TXB0108YZPR2 equivalent, key selection criteria include its auto-sensing bidirectional operation without direction control, VCC isolation behavior during power sequencing, thermal performance in DSGBA package (RθJA = 66.2°C/W), and compatibility with push-pull CMOS signals only-not open-drain.
Technical Context
The TXB0108YZPR2 implements a buffered architecture with edge-rate accelerators (one-shots) to enhance data rate across voltage domains. Its auto-direction sensing eliminates external direction-control logic by detecting signal transitions on either port to enable real-time bidirectional flow.
VCC isolation ensures all outputs enter high-impedance state if either VCCA or VCCB is at GND, preventing backfeed during partial power-down. The OE input is referenced to VCCA, and Ioff circuitry actively disables outputs when supply rails are unpowered-critical for system-level power management in portable electronics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| A-port voltage range | 1.2V to 3.6V - supports 1.2V/1.5V/1.8V/2.5V/3.3V logic families; VCCA must not exceed VCCB. |
| B-port voltage range | 1.65V to 5.5V - enables interface to 1.8V/2.5V/3.3V/5V peripherals including USB PHYs and display drivers. |
| Max data rate | 100 Mbps at VCCA = 3.3V/VCCB = 5V - sufficient for high-speed I²C, SPI, and GPIO expansion in smartphones. |
| ESD protection (B port) | ±15kV HBM - meets IEC 61000-4-2 Level 4 for robustness in handheld device front-end interfaces. |
| Quiescent current | 4μA max ICC - enables always-on level translation in battery-powered systems with minimal standby drain. |
| Propagation delay | 0.8 ns (A→B, VCCA=3.3V/VCCB=5V) - ensures timing-critical signal integrity in high-frequency peripheral links. |
| Channel skew | 0.3 ns max tSK(O) - maintains inter-signal alignment across all 8 channels for parallel bus applications. |
Pinout & Package
TXB0108YZPR2 uses the DSGBA (20-ball) package with 1.90mm × 2.40mm body size and 0.4mm pitch. Thermal performance is characterized with RθJA = 66.2°C/W and RθJB = 52.0°C/W, suitable for compact PCB layouts in space-constrained mobile designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A8 | A-port I/O (VCCA-referenced) | 8 bidirectional data lines tied to low-voltage domain (e.g., application processor core I/O). |
| B1–B8 | B-port I/O (VCCB-referenced) | 8 bidirectional data lines interfacing to higher-voltage peripherals (e.g., camera sensor, display interface). |
| VCCA | A-port supply | 1.2V–3.6V rail; powers A-side logic and OE input; must be ≤ VCCB. |
| VCCB | B-port supply | 1.65V–5.5V rail; powers B-side logic and determines B-port output swing. |
| OE | Output enable (VCCA-referenced) | Pull low to place all A/B ports in high-impedance; tie to GND via pulldown resistor for power-up safety. |
| GND | Ground reference | Common return path for both domains; required for proper ESD current routing and noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-direction sensing | Eliminates need for external direction-control signals-reduces PCB routing complexity and firmware overhead in bidirectional buses. |
| VCC isolation | Guarantees high-impedance outputs when either VCCA or VCCB is at GND-prevents back-current damage during asymmetric power sequencing. |
| Ioff partial-power-down | Disables outputs and blocks leakage paths when supplies are off-enables safe hot-plug operation and extends battery life in sleep modes. |
| ±15kV HBM ESD (B port) | Protects high-voltage I/O pins against electrostatic discharge in handheld assembly and end-user handling-reduces field failure risk. |
| Edge-rate acceleration | One-shot circuitry sharpens signal edges to sustain 100 Mbps throughput across full voltage range-avoids timing margin loss in fast-switching interfaces. |
Applications
| Smartphone Application | Tablet Application |
|---|---|
|
Use Scenario: Interfacing an application processor (1.8V I/O) to a 3.3V camera sensor module. IC Role / Device Role / Timing Role: Bidirectional level translator enabling MIPI CSI-2 control signals and I²C configuration without direction control logic. Use Value: Eliminates discrete MOSFET translators and reduces BOM count while maintaining 100 Mbps timing margin for autofocus command latency. |
Use Scenario: Connecting a 1.2V SoC GPIO expander to a 5V display backlight driver. IC Role / Device Role / Timing Role: Voltage-domain bridge for PWM brightness control and fault reporting signals. Use Value: Supports 5V-tolerant outputs with ±15kV HBM protection-ensures reliability against ESD events near display bezels. |
| Handset Baseband Interface | Desktop PC Embedded Controller Link |
|
Use Scenario: Translating 1.5V baseband processor UART lines to 3.3V modem RF transceiver. IC Role / Device Role / Timing Role: Full-duplex level shifter with automatic direction detection for asynchronous serial communication. Use Value: Achieves sub-1ns propagation delay skew across TX/RX pair-preserves UART timing budget at 3 Mbps baud rate. |
Use Scenario: Bridging 3.3V embedded controller (EC) SMBus to 1.2V CPU platform controller hub (PCH) registers. IC Role / Device Role / Timing Role: I²C-compatible bidirectional translator with VCC isolation for safe EC reset sequencing. Use Value: Prevents bus contention during EC power-up before PCH initialization-avoids SMBus lockup in BIOS boot phase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional voltage-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0108EYZTR | Open-drain architecture with internal pullups; supports true open-drain I²C/SMBus; no VCC isolation; lower ESD (±8kV HBM). | Required for I²C bus translation where pullup-dependent signaling is mandatory; unsuitable for push-pull GPIO or UART. | Select TXS0108EYZTR only when translating open-drain protocols; TXB0108YZPR2 remains preferred for push-pull CMOS interfaces requiring VCC isolation. |
| SN74AVC8T245RHLR | Direction-controlled (DIR pin required); no auto-sensing; higher ICC (24μA); 1.65V–3.6V dual-rail only; no ±15kV ESD. | Suitable for fixed-direction parallel buses (e.g., memory expansion); lacks safety features for asymmetric power sequencing. | Choose SN74AVC8T245RHLR for cost-sensitive, direction-stable applications; TXB0108YZPR2 is superior for dynamic bidirectional links with power sequencing constraints. |
Compared with TXS0108EYZTR and SN74AVC8T245RHLR, TXB0108YZPR2 uniquely combines auto-direction sensing, VCC isolation, and ±15kV B-port ESD-making it the only option for robust, direction-agnostic push-pull translation in portable devices with aggressive power management.
Availability
TXB0108YZPR2 is available at Aetrix Electronics and suitable for smartphone, tablet, and handheld baseband applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing for consumer electronics production.
Supply support for TXB0108YZPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in interface IC design and high-volume manufacturing.
The TXB0108 product line targets portable and battery-powered systems requiring ultra-low-power, robust bidirectional level translation between heterogeneous voltage domains-especially in mobile computing and communications equipment.
FAQ
What is the maximum supported data rate for TXB0108YZPR2 under typical operating conditions?
The TXB0108YZPR2 achieves up to 100 Mbps maximum data rate when VCCA = 3.3V and VCCB = 5V, with 0.8 ns typical propagation delay (A→B) and 0.3 ns channel-to-channel skew. This performance is validated across –40°C to 85°C and supports high-speed GPIO, SPI, and I²C clock stretching in smartphone platforms.
Does TXB0108YZPR2 support open-drain interfaces like I²C?
No, TXB0108YZPR2 is designed exclusively for push-pull CMOS logic translation. It lacks internal pullup resistors and cannot emulate open-drain behavior. For I²C or SMBus, TI recommends the TXS0108E series instead. Using TXB0108YZPR2 on open-drain buses may cause signal contention or logic errors.
How does the VCC isolation feature function in TXB0108YZPR2 during power sequencing?
When either VCCA or VCCB is driven to GND, TXB0108YZPR2 forces all A- and B-port outputs into high-impedance state regardless of OE status. This prevents back-current flow through I/O pins during asymmetric power-up/down sequences-critical for protecting processors and peripherals in multi-rail mobile systems.
What is the recommended OE pin termination for reliable power-up behavior in TXB0108YZPR2?
Tie OE to GND through a pulldown resistor (minimum value determined by driver strength; ≥50kΩ recommended). This ensures all ports remain in high-impedance until VCCA stabilizes, avoiding bus contention during power ramp. OE is referenced to VCCA, so it must not float during VCCA rise.
Can TXB0108YZPR2 translate between 1.2V and 5V logic levels safely?
Yes-TXB0108YZPR2 supports 1.2V on A port and 5V on B port (VCCA = 1.2V, VCCB = 5V), provided VCCA ≤ VCCB. Absolute maximum ratings allow VCCA up to 4.6V and VCCB up to 6.5V, but recommended operation limits are 1.2V–3.6V and 1.65V–5.5V respectively. Output VOHB reaches VCCB – 0.4V, ensuring valid 5V logic-high margins.
TXB0108YZPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.2 V ~ 3.6 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- CMOS
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-XFBGA, DSBGA
TXB0108YZPR2 FAQ
1.How can I place an order for TXB0108YZPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TXB0108YZPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXB0108YZPR2 reliable?
The price and inventory of TXB0108YZPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXB0108YZPR2 is usually 5 days.
3.What payment methods are accepted for TXB0108YZPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXB0108YZPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXB0108YZPR2?
TXB0108YZPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXB0108YZPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXB0108YZPR2?
For technical support, including TXB0108YZPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXB0108YZPR2 requirements.
6.How does Aetrix verify that TXB0108YZPR2 is sourced from the original manufacturer or authorized distributors?
All TXB0108YZPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXB0108YZPR2 meets industry standards.
7.What is the process for return or replacement of TXB0108YZPR2?
All TXB0108YZPR2 units undergo pre-shipment inspection (PSI). If there is an issue with TXB0108YZPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXB0108YZPR2 part is unused and in its original packaging.
Return procedure for TXB0108YZPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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