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Texas Instruments TXB0304RUTR
- Part No.:
- TXB0304RUTR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXB0304RUTR.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 12UQFN
- Quantity:
- Payment:
- Shipping:
Inventory:683
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Product details
Overview
TXB0304RUTR from Texas Instruments is a 4-bit bidirectional voltage-level translator with automatic direction sensing, designed for push-pull CMOS logic interfacing between mismatched voltage domains (e.g., 1.2 V ↔ 3.3 V). It supports independent A- and B-port supplies (VCCA/VCCB = 0.9–3.6 V), delivers ≤30 ns propagation delay at 1.8 V, consumes ≤5 μA per supply, and features VCC isolation and Ioff partial-power-down protection.
For engineers reviewing the TXB0304RUTR datasheet, TXB0304RUTR pinout, TXB0304RUTR application, or TXB0304RUTR equivalent, this page provides verified electrical specifications, UQFN-12 package details, real-world timing behavior across supply combinations, OE-controlled high-impedance state management, and validated alternatives for level-shifting in portable, industrial, and telecom systems.
Technical Context
The TXB0304RUTR implements an edge-detecting one-shot architecture that automatically enables weak pull-up/pull-down drivers during signal transitions-no direction-control pin required. Its dual-rail design allows VCCA and VCCB to operate independently within 0.9–3.6 V, enabling translation between 1.0 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V nodes without external biasing.
OE is referenced to VCCA and active-low; asserting OE = low places all A/B I/Os in high-impedance state with tdis ≤172 ns (CL = 15 pF). The device incorporates Ioff circuitry to block reverse current when either VCC rail is powered down, and meets JESD 78 Class II latch-up (>100 mA) and JESD 22 ESD ratings (±8 kV HBM, ±1 kV CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA / VCCB Range | 0.9 V to 3.6 V each - enables flexible bidirectional translation between common logic families (1.2 V ↔ 1.8 V, 1.8 V ↔ 3.3 V, etc.) without level-shifter configuration. |
| Max Data Rate | 140 Mbps (CL = 15 pF, VCCA/VCCB ≥1.8 V) - supports high-speed digital interfaces including SPI, UART, and GPIO expansion in portable electronics. |
| Propagation Delay (tpd) | 3.7 ns typical (A↔B, CL = 15 pF, VCCA/VCCB = 1.8–3.6 V) - ensures minimal timing skew across all 4 channels (tSK(O) ≤0.15 ns). |
| ICCA / ICCB Max | 5 μA per supply - enables ultra-low-power operation in battery-powered applications such as wearables and IoT sensors. |
| Output Drive Strength | ~5 Ω effective impedance (VCCO = 1.8–3.3 V) - provides fast edge rates while maintaining compatibility with 100 pF capacitive loads. |
| ESD Protection | ±8000 V HBM, ±1000 V CDM - exceeds JEDEC standards for robust handling in automated assembly and field environments. |
Pinout & Package
TXB0304RUTR is housed in a 12-pin UQFN (RUT) package measuring 2.00 mm × 1.70 mm with 0.4 mm pitch and wettable flanks. The package is RoHS-compliant, moisture-sensitive level 1 (260°C peak reflow), and optimized for space-constrained PCB layouts.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A1–A4 | A-port I/O (VCCA-referenced) | Bidirectional data lines tracking VCCA; tolerate VI up to VCCA + 0.5 V; require ≥±3 mA drive strength from connected source. |
| B1–B4 | B-port I/O (VCCB-referenced) | Bidirectional data lines tracking VCCB; tolerate VI up to VCCB + 0.5 V; support automatic direction sensing without control signals. |
| /OE | Active-low output enable | Referenced to VCCA; must be pulled low via resistor (value set by driver strength) to enter high-Z state during power-up/power-down. |
| GND | Ground (pins 6, 7) | Dual GND pins provide low-inductance return path; mandatory for stable noise performance and thermal dissipation. |
| VCCA | A-port supply | Supplies A-side logic and /OE input circuitry; powers internal weak drivers and edge-detection one-shots. |
| VCCB | B-port supply | Supplies B-side logic and output drivers; independent of VCCA, enabling asymmetric voltage translation. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic direction sensing | Eliminates need for external direction-control logic or microcontroller GPIO, reducing BOM count and routing complexity in bidirectional buses. |
| VCC isolation | When either VCCA or VCCB = 0 V, all outputs enter high-impedance state - prevents back-driving and bus contention during power sequencing or fault conditions. |
| Ioff partial-power-down | Blocks damaging current flow into powered-down rails, supporting hot-swap and dynamic power gating in multi-rail systems. |
| Low quiescent current | ≤5 μA per supply (ICCA/ICCB) - extends battery life in always-on sensor nodes and portable devices without sacrificing translation speed. |
| High-speed edge acceleration | One-shot PMOS/NMOS boost circuitry reduces rise/fall times to <3 ns (CL = 15 pF), preserving signal integrity at >100 Mbps. |
Applications
| Mobile Device Interface | Industrial Sensor Hub |
|---|---|
|
Use Scenario: Interfacing a 1.8-V application processor GPIO bank to a 3.3-V display interface IC in a smartphone or tablet. IC Role / Device Role / Timing Role: Bidirectional voltage translator enabling real-time command/response exchange without direction-control overhead or timing penalty. Use Value: Eliminates need for discrete MOSFET translators or dual-supply buffers, saving 2.5 mm² PCB area and reducing layout risk from signal reflections. |
Use Scenario: Connecting a 3.3-V microcontroller I²C master to multiple 1.2-V MEMS sensor slaves on a factory-floor vibration monitor. IC Role / Device Role / Timing Role: Level-shifting bridge for push-pull I²C signals (not open-drain), ensuring clean logic thresholds and sub-10 ns channel skew. Use Value: Enables direct integration of ultra-low-voltage sensors without redesigning MCU firmware or adding external pull-up resistors. |
| Telecom Baseband Module | Enterprise SSD Controller |
|
Use Scenario: Translating control signals between a 2.5-V FPGA configuration interface and a 1.2-V RF transceiver ASIC in a 5G small cell radio. IC Role / Device Role / Timing Role: Low-latency, rail-to-rail translator supporting 100+ Mbps configuration bursts with guaranteed tpd ≤11.5 ns at 2.5 V. Use Value: Meets strict setup/hold timing margins for FPGA bitstream loading while tolerating asynchronous power-up sequences. |
Use Scenario: Bridging a 1.8-V NVMe controller's GPIO debug port to a 3.3-V system management unit in an enterprise SSD module. IC Role / Device Role / Timing Role: Isolated, low-leakage translator allowing safe hot-plug diagnostics without disrupting main PCIe data path. Use Value: Provides VCC isolation and Ioff protection to prevent backfeed into powered-down controller during field maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level-shifting applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0304RSVR | Same core functionality and electrical specs; differs only in 16-pin RSV UQFN package (2.60 mm × 1.80 mm) vs. RUT's 12-pin (2.00 mm × 1.70 mm). | Requires PCB redesign due to larger footprint and different pinout; suitable where thermal margin or board-level test access is prioritized over size. | Select TXB0304RSVR only if layout space permits larger package or if RSV variant is already qualified in production. |
| TXS0104RUTR | Open-drain compatible; lacks automatic direction sensing; requires external pull-ups; lower drive strength (~20 mA vs. ~50 mA); higher VOL at low VCC. | Required for I²C, SMBus, or 1-Wire where true open-drain behavior is mandatory; not suitable for push-pull GPIO or SPI. | Choose TXS0104RUTR only when translating open-drain protocols; TXB0304RUTR remains superior for push-pull CMOS interfaces. |
Compared with TXB0304RSVR, TXB0304RUTR saves 35% board area and offers identical timing/performance; compared with TXS0104RUTR, it eliminates external pull-up resistors and delivers faster edges but cannot replace open-drain translators in I²C designs.
Availability
TXB0304RUTR is available at Aetrix Electronics and suitable for mobile device interface, industrial sensor hub, telecom baseband module, and enterprise SSD controller applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TXB0304RUTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and interface solutions.
The TXB0304RUTR belongs to TI's TXB-series bidirectional level translators, engineered specifically for low-power, high-speed push-pull logic translation in space-constrained portable and industrial systems.
FAQ
What is the maximum supported data rate for TXB0304RUTR?
The TXB0304RUTR supports up to 140 Mbps under optimal conditions: CL = 15 pF, VCCA and VCCB both ≥1.8 V. At 1.2 V supplies, max rate drops to 100 Mbps; at 0.9 V, it is 50 Mbps. These values are measured with defined load and transition rates per TI SCES831G Section 6.6.
Does TXB0304RUTR require external pull-up resistors?
No - TXB0304RUTR does not require external pull-up resistors because it uses active push-pull drivers on both sides. In fact, external pull-ups or pull-downs should be avoided unless absolutely necessary; if used, they must exceed 20 kΩ to prevent contention with the internal drivers and maintain valid VOH/VOL levels.
Can TXB0304RUTR translate I²C signals?
No - TXB0304RUTR is not suitable for I²C, SMBus, or other open-drain protocols. Its push-pull architecture cannot emulate open-drain behavior or handle bus arbitration. For I²C level shifting, TI recommends the TXS0104RUTR or similar open-drain-compatible translators.
How does the /OE pin function on TXB0304RUTR?
The /OE pin on TXB0304RUTR is active-low and referenced to VCCA. When /OE is driven low, all A- and B-port I/Os enter high-impedance state within tdis ≤172 ns (CL = 15 pF). During power-up, /OE must be held low via a pull-down resistor until both VCCA and VCCB are stable to prevent undefined states.
What thermal performance can be expected from TXB0304RUTR in a 12-pin UQFN package?
In its RUT (12-pin UQFN) package, TXB0304RUTR has a junction-to-ambient thermal resistance (RθJA) of 116.4°C/W. With proper PCB copper pour and two GND pins, it sustains continuous operation from –40°C to +85°C ambient, and peak junction temperature remains within spec under typical 5 μA supply current loads.
TXB0304RUTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 0.9 V ~ 3.6 V
- Voltage - VCCB:
- 0.9 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-UFQFN
TXB0304RUTR FAQ
1.How can I place an order for TXB0304RUTR through Aetrix?
Please submit a Request for Quotation (RFQ) for TXB0304RUTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXB0304RUTR reliable?
The price and inventory of TXB0304RUTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXB0304RUTR is usually 5 days.
3.What payment methods are accepted for TXB0304RUTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXB0304RUTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXB0304RUTR?
TXB0304RUTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXB0304RUTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXB0304RUTR?
For technical support, including TXB0304RUTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXB0304RUTR requirements.
6.How does Aetrix verify that TXB0304RUTR is sourced from the original manufacturer or authorized distributors?
All TXB0304RUTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXB0304RUTR meets industry standards.
7.What is the process for return or replacement of TXB0304RUTR?
All TXB0304RUTR units undergo pre-shipment inspection (PSI). If there is an issue with TXB0304RUTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXB0304RUTR part is unused and in its original packaging.
Return procedure for TXB0304RUTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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