Texas Instruments TXBN0304RSVR

Overview

TXBN0304 from Texas Instruments is a 4-bit bidirectional voltage-level translator with automatic direction sensing and active-high output-enable (OE) control, supporting independent 0.9 V to 3.6 V supplies on A and B ports. It enables push-pull CMOS logic translation between mismatched voltage domains (e.g., 1.2 V ↔ 3.3 V), features I_off partial-power-down protection, and delivers ≤30 ns propagation delay at 1.8 V–3.6 V operation. It is used in low-power portable interface bridging where supply sequencing flexibility and high-impedance isolation during power transitions are required.

For engineers reviewing the TXBN0304 datasheet, TXBN0304 pinout, TXBN0304 application, or TXBN0304 equivalent, this page provides verified package mapping (RSV UQFN-16), confirmed OE polarity (active-high), validated 4-channel bidirectional translation behavior, real-world timing specs (≤30 ns t_pd, ≤140 Mbps data rate), and precise thermal metrics (R_θJA = 131.7°C/W) - all extracted from TI's SCES831G production datasheet.

Technical Context

The TXBN0304 implements an edge-detecting one-shot architecture that automatically senses signal direction without external control lines: rising/falling edges on either port trigger transient PMOS/NMOS drive enhancement for fast transitions. Its dual-rail design isolates VCCA and VCCB domains, enabling asymmetric voltage translation (e.g., VCCA = 1.2 V, VCCB = 3.3 V) while maintaining rail-to-rail logic compatibility.

Each I/O cell includes weak DC drivers (typical output impedance: 5 Ω at 1.8–3.3 V, 10 Ω at 1.1–1.7 V) paired with transient boost circuitry, allowing external devices to override outputs during bidirectional bus arbitration. The OE input is referenced solely to VCCA and places all A/B ports into high-impedance state when asserted high - differing from TXB0304's active-low OE.

Key Specifications

Pinout & Package

TXBN0304 is packaged in a 16-pin RSV UQFN (2.60 mm × 1.80 mm, 0.4 mm pitch) with wettable flanks and exposed thermal pad. The package supports automated optical inspection (AOI) and offers low thermal resistance (R_θJB = 55.3°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level-shifting applications.

Compared with TXB0304RSVR, TXBN0304 simplifies control logic by eliminating OE inversion; compared with TXS0104RGTR, it delivers stronger push-pull drive and lower propagation delay but lacks open-drain support - making it ideal for high-speed, low-power bidirectional CMOS interconnects where direction autonomy is critical.

Availability

TXBN0304 is available at Aetrix Electronics and suitable for mobile device interface bridging, industrial sensor hub interfacing, wearable system power domain separation, and automotive body control module expansion requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TXBN0304 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision level-shifting and interface solutions.

The TXBN0304 belongs to TI's TXB-series bidirectional voltage translators, designed specifically for low-power, high-speed CMOS logic bridging between mismatched voltage domains in portable, industrial, and automotive systems.

FAQ

What is the key functional difference between TXBN0304 and TXB0304?

The sole functional difference is output-enable (OE) polarity: TXBN0304 uses active-high OE (assert high to enter high-impedance state), whereas TXB0304 uses active-low OE. All other electrical specifications, pinout, package, timing, and translation behavior are identical. This distinction affects firmware control logic but does not alter voltage translation capability or performance metrics of the TXBN0304.

Can TXBN0304 translate between 0.9 V and 5 V logic levels?

No. TXBN0304 supports VCCA and VCCB ranges of 0.9 V to 3.6 V only. Applying 5 V to either supply rail exceeds the absolute maximum rating of 4.6 V and risks permanent damage. For 5-V translation, TI recommends the TXS0104 or SN74AVC4T245 families - the TXBN0304 is strictly limited to sub-3.6-V domains.

Does TXBN0304 require external pull-up resistors on its I/O lines?

No - TXBN0304 is designed for push-pull CMOS interfaces and does not require external pull-ups. In fact, external resistors below 20 kΩ may interfere with its weak DC drive strength and degrade VOH/VOL. Pull-ups are unnecessary unless interfacing with open-drain receivers, in which case TXS0104 is the appropriate TI solution instead of TXBN0304.

How does TXBN0304 handle power-supply sequencing during startup?

TXBN0304 incorporates VCC isolation: if either VCCA or VCCB is at GND during power-up, all outputs automatically enter high-impedance state until both supplies reach valid operating voltage. This eliminates bus contention and backdrive risk. OE should be held low (via pull-down) until both rails stabilize - a design requirement explicitly documented for reliable TXBN0304 operation.

Is TXBN0304 suitable for I²C bus translation?

No. TXBN0304 is incompatible with I²C because it lacks open-drain support and relies on push-pull drive. Its weak DC output strength cannot coexist with standard I²C pull-up resistors, and automatic direction sensing does not accommodate wired-AND arbitration. For I²C, TI specifies the TXS0104 series - TXBN0304 is intended exclusively for CMOS GPIO, address/data bus, and memory-mapped peripheral bridging.