Texas Instruments TXBN0304RUTR

Overview

TXBN0304 from Texas Instruments is a 4-bit bidirectional voltage translator IC with automatic direction sensing, designed for level-shifting between asymmetric supply domains (VCCA and VCCB, each 0.9 V to 3.6 V). It features active-high OE control, I_off partial-power-down support, V_CC isolation, and low quiescent current (5 μA max per rail). It enables reliable interface between 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic systems in space-constrained portable electronics.

For engineers reviewing the TXBN0304 datasheet, TXBN0304 pinout, TXBN0304 application, or TXBN0304 equivalent, key selection criteria include its active-high enable behavior (vs. TXB0304's active-low OE), UQFN-12 (RUT) package footprint, 100 Mbps data rate at 1.8–3.6 V supplies, ±50 mA output drive, and compatibility with push-pull CMOS-not open-drain-interfaces.

Technical Context

The TXBN0304 implements an auto-sensing bidirectional translation architecture without external direction control: internal one-shot circuits detect signal edges on either port and transiently strengthen PMOS/NMOS pull-up/pull-down paths to accelerate transitions. Its I/O cells operate with dynamic output impedance-5 Ω at 1.8–3.3 V V_CCO, 10 Ω at 1.1–1.7 V, and 30 Ω at 0.9–1.0 V-enabling fast edge rates while maintaining low power.

It supports independent, fully configurable VCCA and VCCB rails (0.9 V–3.6 V each), with OE referenced solely to VCCA. The V_CC isolation feature forces all outputs into high-impedance when either supply drops to GND, and I_off protection prevents back-current flow during partial power-down, meeting JESD 78 Class II latch-up requirements (>100 mA).

Key Specifications

Pinout & Package

TXBN0304 is packaged in a 12-pin UQFN (RUT) with 2.00 mm × 1.70 mm body size and 0.4 mm pitch. The package is lead-free, RoHS-compliant, and rated MSL-1 (260°C peak reflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level-shifting applications.

Compared with TXB0304RUTR, TXBN0304 simplifies enable logic integration by eliminating external inverters; compared with SN74AVC4T245RTER, it removes direction-control routing and enhances system resilience during supply faults-making it optimal for compact, fault-tolerant mixed-voltage designs.

Availability

TXBN0304 is available at Aetrix Electronics and suitable for mobile processor interface, industrial sensor hub, automotive body control module, and enterprise SSD controller bridge applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for TXBN0304 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision voltage translation and low-power interface solutions.

The TXBN0304 belongs to TI's TXB-series bidirectional translators-designed specifically for space-constrained, mixed-voltage digital systems where automatic direction sensing, ultra-low power, and robust fault tolerance are mandatory.

FAQ

What is the key functional difference between TXBN0304 and TXB0304?

The sole functional difference is OE polarity: TXBN0304 uses active-high OE (logic high enables translation), whereas TXB0304 uses active-low OE (logic low enables). All other electrical specifications, pinout, package, and performance parameters-including VCCA/VCCB ranges, data rate, and I_off behavior-are identical between TXBN0304 and TXB0304.

Does TXBN0304 support open-drain interfaces like I²C?

No, TXBN0304 does not support open-drain interfaces such as I²C or 1-Wire. Its architecture relies on push-pull CMOS drivers and lacks weak pull-up capability. For I²C translation, TI recommends the TXS0104 or similar TXS-series devices. Using TXBN0304 on open-drain buses risks signal contention and invalid logic levels.

What is the minimum recommended pull-down resistor value for OE on TXBN0304?

The minimum recommended pull-down resistor for OE on TXBN0304 is determined by the driving source's current-sinking capability. TI specifies that OE must be pulled to GND through a resistor during power-up to ensure high-impedance state; typical values range from 10 kΩ to 100 kΩ. Lower values increase current draw but improve noise immunity-designers should verify against their driver's sink strength per the datasheet's OE input current spec (±2 μA max).

Can TXBN0304 translate between 0.9 V and 3.6 V simultaneously?

Yes, TXBN0304 supports simultaneous translation between 0.9 V and 3.6 V: VCCA may be set to 0.9 V while VCCB is set to 3.6 V, or vice versa. Its fully symmetric design allows any combination within the 0.9 V–3.6 V range per rail, enabling ultra-low-voltage microcontroller interfacing with legacy 3.3 V peripherals without intermediate regulators or discrete solutions.

Is TXBN0304 pin-compatible with TXB0304 in the RUT (12-pin UQFN) package?

Yes, TXBN0304RUTR and TXB0304RUTR share identical pinout, package dimensions (2.00 mm × 1.70 mm), and thermal characteristics in the RUT UQFN-12 package. The only board-level change required is updating the OE control signal polarity-no PCB redesign or footprint modification is needed when migrating between these two variants.