Texas Instruments TXS0102VDCUR

Overview

TXS0102VDCUR from Texas Instruments is a 2-bit bidirectional voltage-level translator designed for open-drain and push-pull logic interfaces between mixed-voltage domains. It supports 1.65V–3.6V on the A port and 2.3V–5.5V on the B port (VCCA ≤ VCCB), delivers up to 24 Mbps in push-pull mode, features integrated 10 kΩ pull-ups per I/O, and includes VCC isolation and I_off partial-power-down capability - enabling robust I²C/SMBus level shifting in space-constrained embedded systems.

For engineers reviewing the TXS0102VDCUR datasheet, TXS0102VDCUR pinout, TXS0102VDCUR application, or TXS0102VDCUR equivalent, this device is selected for low-pin-count, directionless translation where no control signal is available, high ESD tolerance (±5000 V HBM on B port), fast enable/disable timing (200 ns/250 ns), and compatibility with 1.8V/2.5V/3.3V/5V node interconnects in industrial and portable electronics.

Technical Context

The TXS0102VDCUR employs auto-direction-sensing pass-gate architecture with edge-rate accelerator (one-shot) circuitry per channel, eliminating need for external direction control. Its dual-rail design enables independent A-port (VCCA-referenced) and B-port (VCCB-referenced) operation, with gate bias set ~1 V_T above the lower supply to support bidirectional conduction without contention.

Each I/O integrates 10 kΩ internal pull-up resistors (A to VCCA, B to VCCB), and the OE input - referenced to VCCA - places all ports in high-impedance state when low. The device supports non-sequenced power-up (either VCCA or VCCB first) and meets JESD 78 Class II latch-up (>100 mA) and JESD 22 ESD standards (±2000 V HBM on A, ±5000 V HBM on B).

Key Specifications

Pinout & Package

TXS0102VDCUR is packaged in an 8-pin VSSOP (DCU) package measuring 2.0 mm × 3.1 mm, optimized for high-density PCB layouts and compatible with automated optical inspection (AOI) and reflow processes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level-shifting applications.

Compared with TXS0102VDCUR, TXB0102RUTR offers higher speed and lower latency but requires external pull-ups and lacks VCC isolation; PCA9306DCUR provides lower static power and smaller footprint but forfeits OE control and failsafe behavior during supply loss - making TXS0102VDCUR optimal for mixed-signal systems demanding robustness, simplicity, and open-drain readiness.

Availability

TXS0102VDCUR is available at Aetrix Electronics and suitable for I²C bus bridging, UART voltage translation, GPIO expansion interfaces, and legacy peripheral integration requiring stable component supply across automotive infotainment, industrial HMIs, and portable medical devices.

Supply support for TXS0102VDCUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power management, signal chain, and interface solutions.

The TXS0102VDCUR belongs to TI's Switch family of voltage translators, engineered specifically for directionless, low-pin-count level shifting in space-constrained mixed-voltage systems - targeting I²C, SMBus, and GPIO interconnects in portable and industrial electronics.

FAQ

What is the maximum supported data rate for TXS0102VDCUR in open-drain mode?

The TXS0102VDCUR supports up to 2 Mbps in open-drain mode, as specified in its datasheet under recommended operating conditions. This limit arises from the RC time constant formed by the internal 10 kΩ pull-up resistors and typical bus capacitance. For standard-mode I²C (100 kHz) and fast-mode I²C (400 kHz), the TXS0102VDCUR fully complies with timing budgets, delivering consistent rise/fall times and propagation delays below 10 ns across temperature and voltage ranges.

Does TXS0102VDCUR require external pull-up resistors for I²C operation?

No, TXS0102VDCUR does not require external pull-up resistors for I²C operation because it integrates 10 kΩ pull-up resistors on both A-port (to VCCA) and B-port (to VCCB). These internal resistors satisfy standard-mode and fast-mode I²C bus requirements when total bus capacitance remains ≤400 pF. External pull-ups may be added in parallel only if faster rise times or stronger drive strength are needed - though doing so lowers VOH and must be accounted for in voltage threshold margins.

Can TXS0102VDCUR operate with VCCA > VCCB?

No, TXS0102VDCUR requires VCCA ≤ VCCB at all times per its absolute maximum ratings and functional design. Violating this condition risks forward-biasing internal protection diodes, causing excessive current flow, potential latch-up, or permanent damage. The device's pass-gate architecture relies on VCCB being equal to or higher than VCCA to maintain proper gate bias and bidirectional conduction integrity - confirmed in Section 5.3 Recommended Operating Conditions and Figure 7-1 architecture diagram.

How does the OE pin function on TXS0102VDCUR, and what is its voltage reference?

The OE (output enable) pin on TXS0102VDCUR is an active-high input referenced to VCCA. When OE is driven low, all A- and B-port I/Os enter a high-impedance state, reducing supply current and isolating both sides. When OE is high, translation is enabled. To ensure Hi-Z state during power-up, TI recommends tying OE to GND via a pulldown resistor - the minimum value depends on the driver's sourcing capability, typically 10 kΩ to 100 kΩ - as detailed in Section 3 Description and Figure 8-1 typical application circuit.

What thermal metrics apply to TXS0102VDCUR in the DCU package?

For the TXS0102VDCUR in the 8-pin VSSOP (DCU) package, the key thermal metrics are R_θJA = 239.8°C/W (junction-to-ambient), R_θJC(top) = 88.5°C/W (junction-to-case top), and R_θJB = 151.6°C/W (junction-to-board). These values assume JEDEC-standard PCB mounting with two-layer copper and 1-in² copper pour. Under continuous 24 Mbps operation at 85°C ambient, junction temperature remains within safe limits (<125°C) when using recommended 0.1 µF bypass capacitors at VCCA/VCCB and minimizing trace inductance per Layout Guidelines in Section 8.4.