Texas Instruments TXS0102YZTR

Overview

TXS0102YZTR from Texas Instruments is a 2-bit bidirectional voltage-level translator with auto-direction sensing, designed for mixed-voltage I/O interfacing between 1.65V–3.6V (A port) and 2.3V–5.5V (B port) domains. It supports up to 24Mbps push-pull and 2Mbps open-drain data rates, integrates 10kΩ internal pull-ups on both ports, and features VCC isolation and I_off partial-power-down capability. It is used in I²C/SMBus level-shifting applications where direction-control signals are unavailable or undesirable.

For engineers reviewing the TXS0102YZTR datasheet, TXS0102YZTR pinout, TXS0102YZTR application, or TXS0102YZTR equivalent, key selection considerations include its no-direction-signal architecture, dual-rail supply independence, OE-controlled high-impedance state, and compatibility with open-drain and push-pull drivers across industrial, embedded, and portable systems.

Technical Context

The TXS0102YZTR employs a pass-gate transistor topology with edge-rate accelerator (one-shot) circuitry to detect and speed rising edges-reducing output impedance to ~50–70Ω for ~30ns during low-to-high transitions. Its gate bias is set ~1V_T above the lower V_CC, enabling automatic bidirectional conduction without external control logic.

Each channel operates independently: A1/A2 reference V_CCA (1.65V–3.6V), B1/B2 reference V_CCB (2.3V–5.5V), with V_CCA ≤ V_CCB required. The OE input (referenced to V_CCA) disables all I/Os into high-impedance mode, and V_CC isolation ensures both ports enter Hi-Z if either V_CCA or V_CCB is at GND.

Key Specifications

Pinout & Package

TXS0102YZTR uses an 8-pin DSBGA (YZP) package measuring 1.9mm × 0.9mm, optimized for space-constrained portable and wearable designs. The bottom-view pinout is validated per TI SCES640L Rev. January 2026.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage-level translation applications.

Compared with TXB0102RGTR and PCA9306DCUR, the TXS0102YZTR uniquely combines integrated pull-ups, OE control, V_CC isolation, and edge-rate acceleration-making it optimal for compact, robust I²C/SMBus translation where layout area, component count, and system-level safety are design constraints.

Availability

TXS0102YZTR is available at Aetrix Electronics and suitable for I²C bus translation, UART bridging, GPIO expansion, and hot-swappable peripheral adapter applications requiring stable component supply, long-term manufacturability, and automotive-grade reliability assurance.

Supply support for TXS0102YZTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in interface ICs and power management.

The TXS0102YZTR belongs to TI's Switch-type voltage translator family, engineered specifically for seamless, directionless level shifting in mixed-voltage digital systems-targeting space-constrained, low-power, and high-reliability applications.

FAQ

What is the maximum supported data rate for TXS0102YZTR in open-drain mode?

The TXS0102YZTR supports up to 2Mbps in open-drain mode across all valid V_CCA/V_CCB combinations (e.g., 1.8V/3.3V or 1.8V/5V). This meets Fast-mode Plus I²C specifications and accommodates typical SMBus timing budgets with margin. The 2Mbps limit arises from internal one-shot duration and capacitive loading sensitivity-not from static voltage thresholds.

Does TXS0102YZTR require external pull-up resistors for I²C operation?

No-TXS0102YZTR integrates 10kΩ pull-up resistors on both A and B ports, eliminating the need for external resistors in standard I²C implementations. These internal pull-ups are automatically disabled when OE is low. If faster rise times or stronger drive are needed, external resistors may be added in parallel-but this affects VOL and increases power consumption.

Can TXS0102YZTR operate with V_CCA = 3.3V and V_CCB = 2.5V?

No-TXS0102YZTR requires V_CCA ≤ V_CCB. With V_CCA = 3.3V, V_CCB must be ≥ 3.3V (and ≤ 5.5V). A 2.5V V_CCB violates the absolute maximum condition and risks improper gate biasing, leading to unreliable translation or increased leakage. Valid pairs include 1.8V/2.5V, 1.8V/3.3V, or 3.3V/5.0V.

How does the OE pin function on TXS0102YZTR, and what is the recommended power-up sequence?

The OE pin is active-high and referenced to V_CCA. When OE is low, all I/Os enter high-impedance state regardless of V_CCB status. To ensure Hi-Z during power-up, TI recommends tying OE to GND via a pulldown resistor (e.g., 10kΩ). No power-supply sequencing is required-V_CCA or V_CCB may ramp first without risk of contention or damage.

What thermal performance can be expected from the YZP package of TXS0102YZTR?

The TXS0102YZTR in YZP (DSBGA, 8-pin) package has R_θJA = 105.8°C/W and R_θJB = 10.8°C/W, indicating excellent board-level heat dissipation. Under typical 1.8V/3.3V operation with 2Mbps traffic, junction temperature rise remains below 5°C above ambient-enabling use in sealed enclosures or stacked PCB assemblies without forced airflow.