Texas Instruments TXS0104ED

Overview

TXS0104ED from Texas Instruments is a 4-bit bidirectional voltage-level translator IC designed for open-drain and push-pull applications, supporting 1.65–3.6 V on A port and 2.3–5.5 V on B port (VCCA ≤ VCCB), with 24 Mbps push-pull and 2 Mbps open-drain data rates, and integrated ESD protection up to ±15 kV (HBM) on B port - used in smartphone I/O bridging between 1.8-V application processors and 3.3-V peripherals.

For engineers reviewing the TXS0104ED datasheet, TXS0104ED pinout, TXS0104ED application, or TXS0104ED equivalent, this page delivers verified electrical specs, package-specific pin functions, real-world timing behavior across VCCA/VCCB combinations, thermal metrics per package variant, and validated alternative parts for voltage translation in space-constrained mobile and embedded designs.

Technical Context

The TXS0104ED implements auto-direction-sensing MOSFET-based translation without external control signals, using dual independent supply rails (VCCA and VCCB) where A-port I/Os track VCCA and B-port I/Os track VCCB. Its internal circuitry enables true bidirectional signal flow by dynamically enabling pull-up paths based on relative voltage levels at each port.

It supports both push-pull and open-drain topologies: push-pull operation achieves 24 Mbps with propagation delays as low as 2.4 ns (A-to-B, VCCA = 3.3 V, VCCB = 3.3 V), while open-drain mode provides 2 Mbps with controlled rise times up to 260 ns depending on bus capacitance and pull-up strength.

Key Specifications

Pinout & Package

The TXS0104ED is available in multiple packages including D (SOIC-14), PW (TSSOP-14), RGY (VQFN-14), BQA (WQFN-12), RUT (UQFN-12), ZXU (BGA-12), YZT (DSBGA-12), and NMN (nFBGA-12). This description applies to the SOIC-14 (D) package unless otherwise specified.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar voltage translation applications.

Compared with TXS0104ED, TXS0108E scales channel count without altering electrical behavior, while SN74AVC4T245 trades auto-direction sensing for tighter voltage flexibility and lower cost - making TXS0104ED optimal for compact, I²C-centric, or open-drain–dominant designs demanding highest ESD resilience.

Availability

TXS0104ED is available at Aetrix Electronics and suitable for smartphone baseband interfacing, tablet sensor hub bridging, desktop PC SMBus expansion, industrial HMI display interfaces, and portable medical device I/O consolidation requiring stable component supply across automotive-grade temperature ranges (–40°C to +85°C).

Supply support for TXS0104ED includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.

The TXS0104ED belongs to TI's TXS auto-direction voltage translator family, engineered specifically for low-power, space-constrained mobile platforms requiring seamless interoperability between heterogeneous voltage domains without external control logic.

FAQ

What is the maximum allowable voltage difference between VCCA and VCCB for reliable operation of the TXS0104ED?

The TXS0104ED requires VCCA ≤ VCCB at all times, with no minimum difference specified. VCCA may equal VCCB (e.g., both at 3.3 V), but VCCA must never exceed VCCB. Absolute maximum ratings allow VCCA up to 4.6 V and VCCB up to 6.5 V independently, yet functional operation is guaranteed only within the recommended ranges: VCCA = 1.65–3.6 V and VCCB = 2.3–5.5 V. Exceeding VCCA > VCCB risks undefined translation behavior or damage.

Does the TXS0104ED support I²C bus arbitration and clock stretching?

Yes, the TXS0104ED fully supports I²C bus arbitration and clock stretching in open-drain mode. Its internal structure preserves the wired-AND behavior essential for multi-master I²C, and its 2 Mbps open-drain data rate accommodates standard-mode (100 kHz) and fast-mode (400 kHz) timing with margin. The device does not interfere with SCL/SDA pull-up networks and maintains bus capacitance compatibility per I²C specification.

How should the OE pin be handled during power-up to ensure safe high-impedance state on the TXS0104ED?

To guarantee all outputs enter high-impedance state during power-up or brownout, OE must be held low until both VCCA and VCCB are stable. TI recommends connecting OE to GND through a pull-down resistor; minimum value depends on driver strength but typical values range from 10 kΩ to 100 kΩ. OE is referenced solely to VCCA, so it must be pulled low relative to VCCA - not VCCB or system ground alone.

Can the TXS0104ED translate between 1.2-V and 3.3-V logic domains?

No, the TXS0104ED cannot translate from 1.2 V because its A-port minimum supply voltage is 1.65 V. Attempting to operate VCCA below 1.65 V violates recommended conditions and results in unreliable output thresholds, increased leakage, and potential failure to drive downstream loads. For 1.2-V interfaces, consider TI's TXS0206 or SN74AXC4T245, which support 0.65–3.6 V on both sides.

Which TXS0104ED package offers the smallest footprint and is suitable for automated optical inspection (AOI) in high-volume manufacturing?

The RUT (UQFN-12) package measures 2.00 mm × 1.70 mm and features exposed pad and clearly defined solder mask-defined pads compatible with standard AOI systems. Its 0.4-mm pitch and thermal pad design support reliable reflow profiling and post-reflow inspection. While YZT (DSBGA-12) is slightly smaller (2.25 mm × 1.75 mm), RUT offers superior manufacturability due to larger pad geometry and absence of bottom-solder ball visibility issues.