Texas Instruments TXS0104EGXUR

Overview

TXS0104EGXUR from Texas Instruments is a 4-bit bidirectional voltage-level translator for open-drain and push-pull logic interfaces, supporting 1.65–3.6 V on A port and 2.3–5.5 V on B port with no direction-control signal required. It delivers up to 24 Mbps data rate in push-pull mode and integrates 10-kΩ pull-up resistors on both ports. It enables level translation between 1.8-V microcontrollers and 3.3-V/5-V peripherals in portable electronics.

For engineers reviewing the TXS0104EGXUR datasheet, TXS0104EGXUR pinout, TXS0104EGXUR application, or TXS0104EGXUR equivalent, key selection criteria include dual-supply rail independence (VCCA ≤ VCCB), OE-controlled 3-state operation, integrated pull-ups eliminating external resistors, and verified performance across smartphone, tablet, and embedded I²C/SMBus interface scenarios.

Technical Context

The TXS0104EGXUR uses a pass-gate architecture with edge-rate accelerator one-shot circuits to enhance rise times without requiring direction control. Each I/O channel includes internal 10-kΩ pull-up resistors referenced to its respective supply (VCCA for A-port, VCCB for B-port), enabling direct compatibility with open-drain buses like I²C.

Its functional modes are strictly controlled by the OE input-high enables bidirectional translation, low forces all I/Os into high-impedance state. Power sequencing is flexible: either VCCA or VCCB may ramp first, and VCCA ≤ VCCB must be maintained during steady-state operation.

Key Specifications

Pinout & Package

TXS0104EGXUR is packaged in a 14-pin VQFN (RGY) with 3.50 mm × 3.50 mm body size and exposed thermal pad connected to GND. Pin numbering follows TI standard top-view orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar voltage-level translation applications.

Compared with TXS0104EGXUR, TXB0104RGER offers higher push-pull bandwidth but adds system complexity via direction control and external components, while PCA9306DCUR reduces feature set to minimize cost at the expense of speed flexibility and integration - making TXS0104EGXUR the optimal balance for mixed-mode (I²C + SPI) portable applications.

Availability

TXS0104EGXUR is available at Aetrix Electronics and suitable for smartphone, tablet, and embedded PC designs requiring stable component supply, I²C/SMBus interoperability, and mixed-voltage peripheral interfacing.

Supply support for TXS0104EGXUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in interface solutions and power-efficient signal conditioning.

The TXS0104E product line targets portable and space-constrained systems requiring zero-footprint, no-direction-control level translation - specifically engineered for seamless integration into battery-powered consumer electronics with multi-rail voltage domains.

FAQ

What is the maximum allowable voltage difference between VCCA and VCCB for reliable operation of the TXS0104EGXUR?

The TXS0104EGXUR requires VCCA ≤ VCCB at all times. While VCCA may be as low as 1.65 V and VCCB as high as 5.5 V, the absolute difference is constrained by the 3.6 V upper limit on VCCA. Therefore, the maximum safe VCCB – VCCA differential is 5.5 V – 1.65 V = 3.85 V, provided VCCA remains within 1.65–3.6 V and VCCB within 2.3–5.5 V. Exceeding VCCA ≤ VCCB risks latch-up or parametric failure.

Can the TXS0104EGXUR be used to translate I²C signals between a 1.8-V master and a 5-V slave device?

Yes, the TXS0104EGXUR supports this configuration: configure VCCA = 1.8 V and VCCB = 5 V. Its integrated 10-kΩ pull-ups on both sides meet I²C bus requirements, and its 2 Mbps open-drain data rate exceeds standard (100 kHz) and fast-mode (400 kHz) I²C specifications. VOLB remains ≤400 mV at 3 mA sink, satisfying I²C low-level voltage thresholds even at VCCB = 5 V.

Does the TXS0104EGXUR require external pull-up resistors when used in an I²C application?

No. The TXS0104EGXUR integrates 10-kΩ pull-up resistors on all A1–A4 and B1–B4 I/Os - referenced to VCCA and VCCB respectively. These satisfy standard I²C bus pull-up requirements for capacitances ≤400 pF and speeds up to 400 kHz. External resistors are unnecessary unless faster rise times or stronger drive (e.g., <10-kΩ) are required for high-capacitance buses.

How does the OE pin function, and what is the recommended biasing method during power-up?

The OE pin is an active-high enable referenced to VCCA. When OE = low, all I/Os enter high-impedance state. To ensure defined behavior during power-up, OE should be tied to GND via a pulldown resistor (minimum value determined by driver strength). TI recommends ≥10-kΩ for typical MCU GPIOs. This prevents floating OE states that could cause bus contention before firmware initializes the pin.

What thermal considerations apply to the TXS0104EGXUR in the RGY (VQFN) package?

The TXS0104EGXUR in RGY package has RθJA = 56.1°C/W and requires the exposed thermal pad to be soldered to a PCB ground plane for effective heat dissipation. At 24 Mbps operation with full 4-bit traffic, typical power dissipation is <1.5 mW - well within safe limits. However, omitting thermal pad connection increases junction temperature by >30°C under continuous load, risking long-term reliability degradation.