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Texas Instruments TXS0104ERGYRG4
- Part No.:
- TXS0104ERGYRG4
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXS0104ERGYRG4.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 14VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TXS0104ERGYRG4 from Texas Instruments is a 4-bit bidirectional voltage-level translator IC designed for open-drain and push-pull logic interfaces between mismatched voltage domains. It supports 1.65–3.6 V on the A port and 2.3–5.5 V on the B port (VCCA ≤ VCCB), delivers up to 24 Mbps in push-pull mode, requires no direction-control signal, and operates across –40°C to +85°C - enabling use in mobile I²C, GPIO, and UART signal translation.
For engineers reviewing the TXS0104ERGYRG4 datasheet, TXS0104ERGYRG4 pinout, TXS0104ERGYRG4 application, or TXS0104ERGYRG4 equivalent, key selection considerations include its auto-direction-sensing architecture, dual-rail supply independence, ±15-kV HBM ESD rating on the B port, and VQFN-14 (RGY) package compatibility with high-density portable PCB layouts.
Technical Context
The TXS0104ERGYRG4 implements an active-passive hybrid translation cell per channel, using internal FETs to enable automatic bidirectional signal flow without external control. Its OE input is referenced solely to VCCA, and all I/O pins are rail-to-rail compatible with their respective supplies.
It supports both open-drain (2 Mbps max) and push-pull (24 Mbps max) topologies, with propagation delays as low as 1.3 ns (A-to-B, high-to-low, VCCA = 3.3 V, VCCB = 5 V) and channel-to-channel skew under 1 ns - critical for timing-sensitive multi-bit buses like I²C and SMBus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| A-port voltage range | 1.65 V to 3.6 V - enables direct interface with 1.8-V/2.5-V/3.3-V logic families (e.g., ARM GPIO, MCU peripherals) |
| B-port voltage range | 2.3 V to 5.5 V - supports legacy 3.3-V/5-V systems including USB PHY control lines and display interface signals |
| Max data rate (push-pull) | 24 Mbps - sufficient for high-speed I²C Fast Mode Plus (1 Mbps) and SPI clocked at ≤12 MHz with margin |
| Max data rate (open-drain) | 2 Mbps - compliant with I²C standard/fast-mode and SMBus 3.0 timing requirements |
| B-port HBM ESD rating | ±15 kV - exceeds IEC 61000-4-2 contact discharge (±8 kV), enabling robustness in handheld device I/O paths |
| Supply sequencing | No requirement - VCCA or VCCB may power up first, simplifying power management in multi-rail systems |
| Operating temperature | –40°C to +85°C - qualified for industrial and consumer portable electronics environments |
Pinout & Package
VQFN-14 (RGY) package: 3.5 mm × 3.5 mm body, 0.5-mm pitch, exposed thermal pad (must be connected to GND for thermal and EMI performance).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A4 | I/O (A-side) | Bidirectional data channels referenced to VCCA; tolerate voltages up to VCCA + 0.5 V in driven state |
| B1–B4 | I/O (B-side) | Bidirectional data channels referenced to VCCB; tolerate voltages up to VCCB + 0.5 V in driven state |
| VCCA | Power supply | A-port reference rail; must be ≤ VCCB and within 1.65–3.6 V range |
| VCCB | Power supply | B-port reference rail; must be ≥ VCCA and within 2.3–5.5 V range |
| OE | Digital input | Active-high enable referenced to VCCA; pull low to place all I/Os in high-impedance state during power-up/down |
| GND | Ground | Common return path for both ports; thermal pad must be soldered to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| No direction-control signal | Eliminates need for dedicated GPIO or timing-critical control lines - reduces MCU pin count and firmware complexity |
| Auto-bidirectional operation | Each channel senses signal direction dynamically via internal pass-gate biasing - preserves signal integrity without added latency |
| Independent dual-supply rails | VCCA and VCCB can be powered from separate regulators or LDOs, enabling mixed-voltage SoC interfacing (e.g., 1.8-V FPGA ↔ 3.3-V sensor) |
| High B-port ESD immunity | ±15-kV HBM protects against user-handling events in smartphone/tablet front-panel interfaces and docking connectors |
| NanoFree™ packaging | VQFN-14 footprint minimizes board area vs. SOIC/TSSOP - ideal for space-constrained mobile and wearable PCBs |
Applications
| Smartphone Baseband-to-PMIC Interface | Tablet I²C Sensor Hub |
|---|---|
Use Scenario: Translating GPIO and interrupt signals between a 1.8-V application processor and a 3.3-V power management IC. IC Role / Device Role / Timing Role: Bidirectional level shifter handling asynchronous control signals with sub-5-ns propagation delay and zero direction-control overhead. Use Value: Enables direct connection without glue logic or software-managed direction toggling - reducing BOM cost and firmware latency. |
Use Scenario: Interfacing multiple 3.3-V environmental sensors (accelerometer, gyroscope, ambient light) to a 1.8-V sensor hub MCU over shared I²C bus. IC Role / Device Role / Timing Role: Voltage translator supporting open-drain I²C protocol with 2-Mbps capability and built-in bus arbitration tolerance. Use Value: Maintains I²C electrical compliance while eliminating external pull-up resistor reconfiguration per voltage domain. |
| Desktop PC SMBus Battery Management | Industrial Handheld Terminal Display Interface |
Use Scenario: Connecting a 3.3-V system management controller to a 5-V smart battery pack via SMBus. IC Role / Device Role / Timing Role: Robust bidirectional translator with ±15-kV B-port ESD protection and 5-V tolerant outputs for hot-plug battery insertion. Use Value: Prevents latch-up and damage during field battery swaps - meeting JEDEC JESD78 Class II (>100 mA) reliability requirements. |
Use Scenario: Level-shifting parallel RGB or SPI display control signals between a 2.5-V microcontroller and a 5-V TFT LCD module. IC Role / Device Role / Timing Role: Push-pull capable translator delivering 24-Mbps throughput for pixel clock and data strobes with <1-ns channel skew. Use Value: Ensures clean edge alignment across 4-bit data lanes - avoiding display artifacts in high-resolution embedded GUIs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional voltage translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0108E | 8-channel version in same RGY package; identical voltage ranges and speed specs | Required when translating >4 signals (e.g., full 8-bit data bus or dual I²C peripherals) | Select TXS0108E only if additional channel count justifies higher unit cost and layout area - TXS0104ERGYRG4 remains optimal for 4-signal interfaces. |
| SN74AVC4T245 | Direction-controlled (DIR pin required); lower B-port ESD (±8-kV HBM); supports 1.2–3.6 V on both sides | Suitable where direction is static or software-controllable, and 5-V B-port support is not needed | Choose SN74AVC4T245 only if system already uses DIR-based control architecture and 5-V translation is unnecessary - TXS0104ERGYRG4 offers superior ease-of-use and ruggedness for portable designs. |
Compared with TXS0108E and SN74AVC4T245, TXS0104ERGYRG4 uniquely combines auto-direction sensing, 5-V B-port tolerance, and ±15-kV HBM protection in a minimal 4-channel VQFN package - making it the preferred choice for compact, high-reliability mobile I/O bridging.
Availability
TXS0104ERGYRG4 is available at Aetrix Electronics and suitable for smartphone baseband interfacing, tablet sensor hubs, desktop SMBus battery management, and industrial handheld display interfaces requiring stable component supply and long-term production continuity.
Supply support for TXS0104ERGYRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in interface IC design and automotive-grade reliability validation.
The TXS0104E family was engineered specifically for low-power, high-density bidirectional voltage translation in portable electronics - prioritizing auto-direction operation, ultra-small packaging, and robust ESD performance for handheld and wearables applications.
FAQ
What is the maximum supported voltage difference between VCCA and VCCB for TXS0104ERGYRG4?
The TXS0104ERGYRG4 requires VCCA ≤ VCCB, with VCCA ranging from 1.65 V to 3.6 V and VCCB from 2.3 V to 5.5 V. The maximum allowable difference is therefore 5.5 V – 1.65 V = 3.85 V, but practical operation must respect the absolute maximum ratings: VCCA ≤ 4.6 V and VCCB ≤ 6.5 V. TXS0104ERGYRG4 is not rated for reverse voltage (VCCA > VCCB) or negative differential bias.
Can TXS0104ERGYRG4 translate I²C signals reliably without external pull-up resistors?
TXS0104ERGYRG4 does not replace external I²C pull-up resistors. It supports open-drain operation but relies on external pull-ups on both A and B sides to establish logic-high levels. For I²C, pull-ups must be placed on each side per standard practice - TXS0104ERGYRG4 passes the open-drain waveform bi-directionally while maintaining voltage domain isolation. TXS0104ERGYRG4 itself draws only 2.4 µA (ICCA) and 12 µA (ICCB) quiescent current.
Is the thermal pad on the RGY package of TXS0104ERGYRG4 required to be connected to ground?
Yes - the exposed thermal pad on the TXS0104ERGYRG4's VQFN-14 (RGY) package must be soldered to a PCB ground plane. This connection provides essential thermal dissipation (RθJB = 32.1°C/W) and improves EMI performance. TI's datasheet explicitly states "the exposed center thermal pad must be connected to ground" - leaving it floating violates thermal and reliability specifications for TXS0104ERGYRG4.
Does TXS0104ERGYRG4 support hot-swapping or live insertion between powered systems?
TXS0104ERGYRG4 supports unpowered I/O pins during system power-up/down due to its high-impedance fail-safe behavior when OE is low, but it is not rated for true hot-swap operation. Its absolute maximum ratings allow VI and VO to reach –0.5 V to VCCX + 0.5 V, and its ±15-kV HBM B-port rating helps withstand user-induced ESD during insertion - however, TI does not specify bus-keeper or live-insertion qualification for TXS0104ERGYRG4. System-level hot-swap protection requires external circuitry.
How does the OE pin function on TXS0104ERGYRG4, and what is the recommended pull-down resistor value?
The OE pin on TXS0104ERGYRG4 is an active-high enable referenced to VCCA. When OE is low, all A- and B-port I/Os enter high-impedance state. To ensure safe power-up, TI recommends tying OE to GND through a pull-down resistor; the minimum value depends on the driver's sourcing capability - typically 10 kΩ suffices for most MCU GPIOs. TXS0104ERGYRG4's OE input leakage is ≤2 µA across temperature, ensuring reliable low-state assertion.
TXS0104ERGYRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.65 V ~ 3.6 V
- Voltage - VCCB:
- 2.3 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- 24Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-VFQFN Exposed Pad
TXS0104ERGYRG4 FAQ
1.How can I place an order for TXS0104ERGYRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for TXS0104ERGYRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXS0104ERGYRG4 reliable?
The price and inventory of TXS0104ERGYRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS0104ERGYRG4 is usually 5 days.
3.What payment methods are accepted for TXS0104ERGYRG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXS0104ERGYRG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXS0104ERGYRG4?
TXS0104ERGYRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXS0104ERGYRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXS0104ERGYRG4?
For technical support, including TXS0104ERGYRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS0104ERGYRG4 requirements.
6.How does Aetrix verify that TXS0104ERGYRG4 is sourced from the original manufacturer or authorized distributors?
All TXS0104ERGYRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS0104ERGYRG4 meets industry standards.
7.What is the process for return or replacement of TXS0104ERGYRG4?
All TXS0104ERGYRG4 units undergo pre-shipment inspection (PSI). If there is an issue with TXS0104ERGYRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXS0104ERGYRG4 part is unused and in its original packaging.
Return procedure for TXS0104ERGYRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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