Texas Instruments TXS0104VQRUTRQ1

Overview

TXS0104VQRUTRQ1 from Texas Instruments is a 4-bit bidirectional voltage-level translator optimized for open-drain and push-pull logic interfaces, supporting 1.65–3.6V on A-port and 2.3–5.5V on B-port (VCCA ≤ VCCB), with 24Mbps push-pull and 2Mbps open-drain data rates, and integrated 10kΩ pullups on both ports - used in smartphone I²C bus bridging between 1.8V application processors and 3.3V peripherals.

For engineers reviewing the TXS0104VQRUTRQ1 datasheet, TXS0104VQRUTRQ1 pinout, TXS0104VQRUTRQ1 application, or TXS0104VQRUTRQ1 equivalent, key selection considerations include bidirectional level-shifting without direction control, OE-referenced-to-VCCA enable logic, thermal pad grounding for RUT package, and compatibility with mixed-voltage I/O domains in portable electronics.

Technical Context

The TXS0104VQRUTRQ1 implements a pass-gate architecture with edge-rate accelerator one-shots per channel to enhance low-to-high transition speed, eliminating need for external pullups in open-drain applications. Its dual-rail design allows independent VCCA and VCCB supplies, with no power-sequencing requirement and guaranteed safe operation during VCCA ≥ VCCB ramp-up.

Each I/O pair features internal 10kΩ pullup resistors referenced to its respective supply rail (VCCA for A-port, VCCB for B-port), and the OE input - powered solely by VCCA - controls high-impedance state across all four channels simultaneously, with 200ns enable time and 250ns disable time over –40°C to 85°C.

Key Specifications

Pinout & Package

TXS0104VQRUTRQ1 uses the RUT (12-pin UQFN) package: 2mm × 1.7mm body with exposed thermal pad requiring PCB connection to GND for thermal management and noise immunity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar voltage-level translation applications.

Compared with TXB0104RUTR and SN74AVC4T245RUTR, TXS0104VQRUTRQ1 uniquely combines directionless operation, integrated 10kΩ pullups, 5.5V B-port support, and ±5000V HBM - making it the only qualified option for space-constrained, open-drain I²C bridges in automotive-qualified handheld devices.

Availability

TXS0104VQRUTRQ1 is available at Aetrix Electronics and suitable for smartphone, tablet, and handheld device production requiring stable component supply, automotive-grade reliability (Q1 suffix), and long-term lifecycle continuity.

Supply support for TXS0104VQRUTRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and power efficiency.

The TXS0104VQRUTRQ1 belongs to TI's voltage translator portfolio designed specifically for low-power, mixed-voltage system interfacing in portable and automotive electronics - emphasizing ease of use, minimal external components, and robust ESD performance.

FAQ

What is the maximum allowable VCCA–VCCB voltage difference for reliable operation of TXS0104VQRUTRQ1?

TXS0104VQRUTRQ1 requires VCCA ≤ VCCB at all times during functional operation. While VCCA may temporarily exceed VCCB during power-up without damage, sustained operation with VCCA > VCCB violates the absolute maximum rating and risks incorrect logic translation or increased leakage. The recommended operating condition strictly enforces VCCA ≤ VCCB across the full temperature range.

Can TXS0104VQRUTRQ1 translate signals between a 1.65V microcontroller and a 5V EEPROM using I²C open-drain mode?

Yes - TXS0104VQRUTRQ1 supports 1.65V–3.6V on A-port and 2.3V–5.5V on B-port, with integrated 10kΩ pullups to VCCA and VCCB. For 1.65V MCU ↔ 5V EEPROM I²C, configure VCCA = 1.65V and VCCB = 5V; the device delivers 2Mbps open-drain performance and ±5000V HBM protection on the B-port, meeting I²C specification timing and robustness requirements.

Is the thermal pad on the RUT package of TXS0104VQRUTRQ1 electrically connected internally?

Yes - the exposed thermal pad on TXS0104VQRUTRQ1 (RUT package) is internally connected to GND. TI's datasheet mandates soldering this pad to a PCB ground plane for thermal dissipation, ESD current path, and signal integrity. Leaving it unconnected degrades thermal resistance by >70°C/W and compromises ESD performance.

Does TXS0104VQRUTRQ1 require external pullup resistors when used with push-pull drivers?

No - TXS0104VQRUTRQ1 functions correctly with push-pull drivers without external pullups. Its internal 10kΩ pullups remain inactive during push-pull operation and do not interfere with signal integrity. These resistors only engage during open-drain transitions to ensure valid high states; push-pull mode relies entirely on driver strength and load capacitance.

How does the OE pin behavior change if VCCA is not powered when OE is asserted?

If VCCA is unpowered while OE is driven high, TXS0104VQRUTRQ1 cannot activate its internal circuitry - all I/Os remain in high-impedance state regardless of OE logic level. OE is referenced exclusively to VCCA; therefore, OE must be driven after VCCA reaches ≥1.65V. TI recommends tying OE to GND via a pulldown resistor during power-up to guarantee defined startup behavior.