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Texas Instruments TXS0202YZPR
- Part No.:
- TXS0202YZPR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXS0202YZPR.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,563
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Product details
Overview
TXS0202YZPR from Texas Instruments is a 2-bit auto-direction-sensing USB voltage level translator for Inter-Chip USB (IC-USB) applications, supporting independent 1.65 V to 3.6 V supplies on A-side (host) and B-side (peripheral), with <1 ns channel-to-channel skew, integrated pull-up/pull-down resistors, and Ioff-enabled partial-power-down operation in mobile SIM card interface designs.
For engineers reviewing the TXS0202YZPR datasheet, TXS0202YZPR pinout, TXS0202YZPR application, or TXS0202YZPR equivalent, this page delivers verified electrical parameters, WCSP-8 (YZP) package mapping, functional mode behavior, ESD ratings (2000-V HBM), and real-world IC-USB signal translation use cases - all confirmed against TI's SCES711A datasheet and official packaging documentation.
Technical Context
The TXS0202YZPR implements buffered auto-direction sensing without external control signals: internal logic detects data flow direction by monitoring voltage transitions on D+ and D– lines, enabling bidirectional communication between host and peripheral across mismatched supply domains. It integrates termination resistors and maintains strict cross-over timing alignment.
Its Ioff circuitry actively disables outputs during power-down to prevent back-current, while OE input provides explicit high-impedance isolation. The device operates across –40°C to 85°C and meets full IC-USB electrical compliance including rise/fall time (≤2 ns), propagation delay (5 ns typ), and max data rate (15 Mbps).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range (VCCA/VCCB) | 1.65 V to 3.6 V - enables direct interfacing between 1.8 V application processors and 3.3 V peripherals without external level-shifting components |
| Max Data Rate | 15 Mbps - supports full-speed IC-USB protocol timing without signal degradation or handshake failure |
| Channel Skew (tsk(o)) | 0.5 ns max - ensures D+/D– signal alignment critical for USB differential receiver integrity |
| Ioff Current | ±2 μA max - guarantees safe isolation during partial power-down, preventing bus contention or latch-up |
| ESD Rating (HBM) | 2000 V - exceeds JEDEC JS-001 requirements for handheld/mobile board-level robustness |
| Propagation Delay (tpd) | 5 ns typ - maintains tight timing budget in high-density portable PCB layouts with minimal added latency |
| Package | DSBGA-8 (YZP), 1.5 mm × 1.5 mm, 0.5 mm max height - optimized for space-constrained SIM card adapters and wearable form factors |
Pinout & Package
TXS0202YZPR uses an 8-ball die-size ball grid array (DSBGA) package designated YZP, with 0.5 mm pitch, non-solder-mask-defined (NSMD) land pattern, and bottom-side thermal pad omitted per TI layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | D+(B) | USB D+ signal routed to peripheral-side (B-port); referenced to VCCB |
| A2 | D–(B) | USB D– signal routed to peripheral-side (B-port); referenced to VCCB |
| B1 | GND | Common ground reference for both supply domains and ESD discharge path |
| B2 | VCCB | Peripheral-side supply (1.65–3.6 V); powers B-port I/Os and internal bias circuitry |
| C1 | VCCA | Host-side supply (1.65–3.6 V); powers A-port I/Os and direction-sensing logic |
| C2 | OE | Active-high output enable; drives all ports to Hi-Z when low - requires external pull-down for power-up safety |
| D1 | D+(A) | USB D+ signal routed to host-side (A-port); referenced to VCCA |
| D2 | D–(A) | USB D– signal routed to host-side (A-port); referenced to VCCA |
Key Features
| Feature | Design Value |
|---|---|
| No direction control signal required | Auto-direction sensing eliminates need for GPIO routing or timing-critical control logic in host-peripheral bridges |
| Integrated pull-up/pull-down resistors | Reduces external component count by 4 resistors per channel in IC-USB attach/acknowledge state machines |
| Partial-power-down support (Ioff) | Enables safe power gating of either side without risk of back-current damage to powered-down subsystems |
| Cross-over skew <1 ns | Preserves USB differential signaling integrity under worst-case process/voltage/temperature corners |
| WCSP-8 (YZP) footprint | Minimizes PCB area (<2.25 mm²) and parasitic capacitance for high-frequency USB signal routing |
Applications
| Mobile SIM Card Interface | Wearable Host-Peripheral Bridge |
|---|---|
|
Use Scenario: Connecting a 1.8 V application processor to a 3.3 V SIM card module in ultra-thin smartphones. IC Role / Device Role / Timing Role: Bidirectional USB signal translator maintaining IC-USB protocol timing and voltage domain isolation. Use Value: Eliminates discrete resistor networks and level-shifters, reducing BOM cost by $0.12 and saving 1.8 mm² PCB area. |
Use Scenario: Enabling USB communication between a 2.5 V microcontroller and 3.3 V sensor hub in hearable devices. IC Role / Device Role / Timing Role: Auto-directional voltage translator ensuring sub-5 ns propagation delay and matched D+/D– edge alignment. Use Value: Guarantees reliable attach/ready mode transitions at 15 Mbps without firmware intervention or external direction control. |
| Tablet Camera Module Link | Industrial Handheld Diagnostic Port |
|
Use Scenario: Interfacing a 3.3 V image sensor with a 1.8 V SoC in compact tablet camera subsystems. IC Role / Device Role / Timing Role: IC-USB compliant level shifter with integrated termination, supporting hot-plug detection and low-power suspend/resume. Use Value: Meets USB electrical specification for rise/fall time (≤2 ns) and skew (≤0.5 ns), avoiding signal integrity failures during video streaming. |
Use Scenario: Isolating a 3.3 V diagnostic port from a 1.65 V battery management MCU in ruggedized field tools. IC Role / Device Role / Timing Role: Robust voltage translator with 2000-V HBM ESD protection and Ioff shutdown for maintenance-safe hot-swap capability. Use Value: Prevents bus contention during battery replacement or firmware update cycles, eliminating field-reported lockup events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB voltage translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVC4T245RTER | 4-bit, dual-supply, direction-controlled (DIR pin required); no integrated USB pull resistors; higher ICC (24 μA vs 12 μA) | Requires external 150 kΩ pull-ups; suited for general-purpose multi-channel level shifting beyond IC-USB | Select when translating >2 signals or needing configurable unidirectional/bidirectional modes outside IC-USB spec |
| MAX3353EETE+ | Full-speed USB transceiver (not translator); includes integrated 3.3 V LDO; no VCCA/VCCB flexibility; 16-pin TQFN | Replaces entire USB PHY layer; adds power regulation but lacks independent supply scaling | Select when replacing legacy USB PHYs and requiring integrated power, not just level translation between existing USB PHYs |
Compared with SN74AVC4T245RTER and MAX3353EETE+, the TXS0202YZPR uniquely combines auto-direction sensing, IC-USB–specific termination, and dual 1.65–3.6 V supply support in a 1.5 mm × 1.5 mm WCSP - making it the only solution that satisfies SIM card interface space, power, and protocol constraints without design compromises.
Availability
TXS0202YZPR is available at Aetrix Electronics and suitable for mobile SIM card interfaces, wearable host-peripheral bridges, tablet camera modules, and industrial handheld diagnostic ports requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TXS0202YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions used in industrial, automotive, personal electronics, and communications systems.
The TXS0202YZPR belongs to TI's Inter-Chip USB translator product line, engineered specifically to simplify USB signal bridging between mismatched voltage domains in space- and power-constrained portable electronics.
FAQ
What is the primary function of the TXS0202YZPR in USB system design?
The TXS0202YZPR serves as a bidirectional voltage level translator for Inter-Chip USB (IC-USB) applications, enabling seamless communication between host and peripheral devices operating at different supply voltages (1.65 V to 3.6 V on each side). Its auto-direction sensing eliminates the need for external control signals, and it integrates pull-up/pull-down resistors required by the IC-USB standard - making the TXS0202YZPR ideal for compact mobile interfaces like SIM card adapters where board space and component count are critical.
Does the TXS0202YZPR require external pull-up resistors for IC-USB compliance?
No, the TXS0202YZPR includes internal pull-up and pull-down resistors specifically designed to meet IC-USB electrical requirements for attach, acknowledge, and ready modes. These integrated resistors eliminate the need for four external 150 kΩ resistors typically used in discrete implementations - directly reducing BOM count, PCB area, and signal path parasitics. This feature is explicitly documented in TI's SCES711A datasheet and confirmed in the device's functional block diagram and application schematics.
How does the OE pin function in the TXS0202YZPR, and what is the recommended tie-off strategy?
The OE (output enable) pin on the TXS0202YZPR is an active-high control input: when low, all I/Os enter high-impedance state for isolation; when high, bidirectional translation is enabled. To ensure safe power-up behavior, TI specifies that OE must be tied to GND via a pull-down resistor - minimum value determined by the driver's current-sourcing capability. This prevents undefined states during power sequencing and avoids bus contention in systems where VCCA or VCCB may ramp asynchronously. The TXS0202YZPR datasheet provides exact resistor sizing guidance based on source strength.
Can the TXS0202YZPR operate with VCCA = 1.65 V and VCCB = 3.3 V simultaneously?
Yes, the TXS0202YZPR is fully specified to operate with independent supply voltages across its full rated range: VCCA and VCCB may each be set anywhere from 1.65 V to 3.6 V, including asymmetric configurations such as VCCA = 1.65 V (host side) and VCCB = 3.3 V (peripheral side). Electrical characteristics - including VOH, VOL, tpd, and skew - are guaranteed over this entire range per TI's SCES711A recommended operating conditions table, confirming robust performance in mixed-voltage mobile architectures.
What is the thermal performance and reflow compatibility of the TXS0202YZPR package?
The TXS0202YZPR uses a DSBGA-8 (YZP) package with a junction-to-ambient thermal resistance (θJA) of 102°C/W and a moisture sensitivity level (MSL) rating of Level-1 at 260°C peak reflow. Its 1.5 mm × 1.5 mm footprint, 0.5 mm ball pitch, and NSMD land pattern are qualified for standard lead-free reflow profiles. TI's packaging addendum confirms the TXS0202YZPR is compatible with automated SMT assembly processes and supports reliable thermal dissipation in thermally dense mobile PCBs without requiring additional heatsinking.
TXS0202YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 2
- Voltage - VCCA:
- 1.65 V ~ 3.6 V
- Voltage - VCCB:
- 1.65 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain
- Data Rate:
- 15Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XFBGA, DSBGA
TXS0202YZPR FAQ
1.How can I place an order for TXS0202YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for TXS0202YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXS0202YZPR reliable?
The price and inventory of TXS0202YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS0202YZPR is usually 5 days.
3.What payment methods are accepted for TXS0202YZPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXS0202YZPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXS0202YZPR?
TXS0202YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXS0202YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXS0202YZPR?
For technical support, including TXS0202YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS0202YZPR requirements.
6.How does Aetrix verify that TXS0202YZPR is sourced from the original manufacturer or authorized distributors?
All TXS0202YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS0202YZPR meets industry standards.
7.What is the process for return or replacement of TXS0202YZPR?
All TXS0202YZPR units undergo pre-shipment inspection (PSI). If there is an issue with TXS0202YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXS0202YZPR part is unused and in its original packaging.
Return procedure for TXS0202YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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