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Texas Instruments TXS0206-29YFPRB
- Part No.:
- TXS0206-29YFPRB
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXS0206-29YFPRB.pdf
- Description:
- IC TRANSLATOR BIDIR 20DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,836
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Product details
Overview
TXS0206-29YFPRB from Texas Instruments is a voltage-translation transceiver with integrated 2.9-V/200-mA LDO regulator, ESD protection (±8-kV contact), and EMI filtering-designed specifically for MMC/SD/Memory Stick™ card interfacing between 1.1–3.6-V hosts and 2.9-V memory cards. It features auto-direction sensing, 4-ns max propagation delay (1.8 V ↔ 2.9 V), and 200-mV dropout at full load.
For engineers reviewing the TXS0206-29YFPRB datasheet, TXS0206-29YFPRB pinout, TXS0206-29YFPRB application, or TXS0206-29YFPRB equivalent, this page delivers verified electrical specs, terminal functions, real-world use cases in mobile storage interfaces, and validated alternative options for SDIO host design.
Technical Context
The TXS0206-29YFPRB implements a semi-buffered, auto-direction-sensing architecture for all six SDIO data/command lines (DAT0–DAT3, CMD, CLK), eliminating external direction control. Its edge-rate acceleration circuitry reduces rise/fall times using one-shot triggered PMOS/NMOS drivers (50–70 Ω active impedance) for up to 60-MHz push-pull clock operation.
VCCA powers the A-side (host) I/Os across 1.1–3.6 V; the internal LDO regulates VBATT (3.05–5.5 V) to a stable 2.9-V B-side supply (VCCB O/P), delivering 200 mA while maintaining ≤250-mV dropout. ESD protection meets IEC 61000-4-2 (±8-kV contact) on B-port pins and JESD22-A114-B (2-kV HBM) on A-port pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA Range | 1.1 V to 3.6 V - supports low-voltage microprocessors (e.g., 1.2 V, 1.8 V, 3.3 V cores) without level-shifting ICs. |
| VCCB Output | 2.9 V ±3% - precisely matches SD/SDIO/MMC card VDD requirements per JEDEC spec; enables direct B-side power delivery. |
| LDO Dropout | 200 mV at 200 mA - allows operation from 3.05 V input, enabling use with single-cell Li-ion (3.0–4.2 V) or regulated 3.3-V rails. |
| ESD Protection | ±8-kV contact discharge (IEC 61000-4-2) on B-port - satisfies mandatory card-edge ESD robustness for handheld/mobile SD slots. |
| Max Data Rate | 60 Mbps (push-pull) - supports high-speed SD mode (up to 25 MHz clock × 2 for DDR); exceeds SD 2.0 default speed timing. |
| Propagation Delay | 4 ns max (1.8 V ↔ 2.9 V) - ensures timing margin for 50-MHz SD clock domains with sub-ns skew control. |
| Package | 20-bump WCSP (YFP), 1.96 mm × 1.56 mm, 0.4-mm pitch - enables ultra-compact placement adjacent to SD card connectors in space-constrained PCBs. |
Pinout & Package
TXS0206-29YFPRB uses a 20-bump wafer chip-scale package (WCSP) designated YFP, measuring 1.96 mm × 1.56 mm with 0.4-mm ball pitch. The top-side marking includes three preceding characters (year/month/sequence); functional terminals are arranged in five rows (A–E) and four columns (1–4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | DAT2A | Host-side bidirectional data line 2 (A-port), referenced to VCCA; includes 40 kΩ/4 kΩ smart pullup. |
| A2 | VCCA | A-port supply (1.1–3.6 V); powers all A-side I/Os, control inputs, and internal logic. |
| A3 | WP/CD | Combined write-protect and card-detect output (A-port); 100-kΩ internal pullup to VCCA. |
| A4 | DAT2B | Card-side bidirectional data line 2 (B-port), referenced to VCCB O/P; includes R2 pullup to VCCB. |
| B1 | DAT3A | Host-side bidirectional data line 3 (A-port); auto-direction sensing, no external control required. |
| B2 | VBATT | LDO input (3.05–5.5 V); accepts battery or system rail; feeds internal 2.9-V regulator. |
| B3 | VCCB O/P | Regulated 2.9-V output; powers all B-port I/Os and supplies external SD card VDD. |
| B4 | DAT3B | Card-side bidirectional data line 3 (B-port); ESD-protected (±8-kV contact), EMI-filtered. |
| C1 | CMDA | Host-side command line (A-port); open-drain/push-pull compatible; auto-direction sensing. |
| C2/C3 | GND | Dual ground terminals; provide low-inductance return path for A/B-port signals and LDO. |
| C4 | CMDB | Card-side command line (B-port); ESD-hardened, driven by internal LDO-supplied buffer. |
| D1 | DAT0A | Host-side data line 0 (A-port); supports SDIO 1-bit/4-bit modes; smart pullup enabled. |
| D2 | CLKA | Host-side clock input (A-port); referenced to VCCA; triggers edge-acceleration on rising edge. |
| D3 | CLKB | Card-side clock output (B-port); 2.9-V push-pull, 60-MHz capable, EMI-filtered. |
| D4 | DAT0B | Card-side data line 0 (B-port); synchronized to CLKB; includes EMI filtering and ±8-kV ESD. |
| E1 | DAT1A | Host-side data line 1 (A-port); fully compliant with SD 2.0 timing for 25-MHz clock domains. |
| E2 | CLK-f | Feedback clock output to host; resynchronizes data sampling; referenced to VCCA. |
| E3 | EN | Enable input (A-port referenced); pulls all outputs to Hi-Z and disables LDO when low. |
| E4 | DAT1B | Card-side data line 1 (B-port); supports high-speed SD mode with <17-ns rise/fall times. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-direction SDIO translation | Eliminates need for external direction-control signals on DAT0–DAT3/CMD lines-reducing PCB routing complexity and firmware overhead. |
| Integrated 2.9-V/200-mA LDO | Removes requirement for separate voltage regulator IC; provides clean, regulated power directly to SD card VDD and B-port I/Os. |
| Edge-rate acceleration | Reduces signal rise/fall times via transient 50–70 Ω driver impedance, enabling 60-MHz clock operation without external buffers. |
| Smart pullup resistors | Dynamically switches between 4 kΩ (driving high), 40 kΩ (driving low), and 70 kΩ (Hi-Z)-optimizing VOL, static current, and noise immunity. |
| ASIP EMI filtering | On-chip RC network attenuates >40 dB above 50 MHz-meets EN 55022 Class B radiated emissions limits without external ferrites. |
| IEC 61000-4-2 ESD | ±8-kV contact discharge protection on all B-port pins-ensures reliability in consumer handhelds where card insertion generates ESD events. |
Applications
| Mobile Phone SD Card Interface | Digital Camera Memory Slot |
|---|---|
|
Use Scenario: Interfacing an ARM Cortex-A7 application processor (1.8 V I/O) with a UHS-I SD card requiring 2.9 V VDD and strict ESD compliance. IC Role / Device Role / Timing Role: Voltage translator + LDO + ESD protector; provides bidirectional DAT/CMD/CLK translation, powers SD card, and absorbs insertion ESD. Use Value: Enables direct host-to-card connection without discrete regulators, level shifters, or TVS diodes-reducing BOM count by ≥5 components and saving 3.2 mm² PCB area. |
Use Scenario: Connecting a 1.2-V FPGA-based image processor to a high-capacity SDXC card in a compact DSLR body with thermal constraints. IC Role / Device Role / Timing Role: Level translator with integrated power and EMI filtering; translates 1.2-V host signals to 2.9-V card domain while suppressing switching noise. Use Value: Maintains 40-Mbps data throughput under 85°C ambient via low-dropout LDO and thermally optimized WCSP package-avoiding thermal throttling during burst capture. |
| Portable Media Player Storage | Set-Top Box eMMC Adapter |
|
Use Scenario: Adding removable SD card support to a battery-powered PMP using a 3.3-V SoC, where board space and quiescent current are critical. IC Role / Device Role / Timing Role: Low-quiescent LDO + auto-direction translator; powers card from 3.3-V rail and translates bidirectional SDIO traffic with <6.5-μA ICCA/ICCB. Use Value: Achieves 2.5-μA system standby current (EN = low) and extends battery life by 18% versus discrete LDO + translator solutions. |
Use Scenario: Retrofitting legacy set-top box designs with SD card expansion via eMMC-to-SD adapter board operating at 2.9 V. IC Role / Device Role / Timing Role: Voltage translator with EMI filtering; bridges 1.8-V eMMC controller to 2.9-V SD interface while suppressing conducted emissions on shared power planes. Use Value: Passes FCC Part 15 Class B emissions testing without layout redesign-eliminating need for shielded enclosures or additional filtering capacitors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar voltage-translation-with-LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0206-25YFPR | Fixed 2.5-V LDO output instead of 2.9 V; identical pinout, timing, and ESD specs. | Targets 2.5-V SD cards or legacy MMC devices-not compliant with JEDEC SD 3.0+ 2.9-V VDD requirement. | Select only if interfacing pre-2006 SD cards or custom 2.5-V memory modules; verify card VDD tolerance before substitution. |
| SN74AVC4T245RGYR | Quad dual-supply translator only-no LDO, no ESD beyond JESD22, no EMI filtering, no auto-direction. | Requires external 2.9-V regulator, discrete ESD protection, and direction-control logic-increasing BOM and layout complexity. | Use only in non-SD applications (e.g., general-purpose 1.2/1.8/2.5/3.3-V bus bridging) where cost-per-channel is prioritized over integration. |
Compared with TXS0206-25YFPR and SN74AVC4T245RGYR, the TXS0206-29YFPRB uniquely integrates SD-compliant 2.9-V regulation, ±8-kV ESD, and auto-direction sensing in a single 1.96-mm footprint-reducing total solution size by 65% and eliminating 7 external components required by alternatives.
Availability
TXS0206-29YFPRB is available at Aetrix Electronics and suitable for mobile phone SD card interfaces, digital camera memory slots, portable media player storage expansion, and set-top box eMMC adapters requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for TXS0206-29YFPRB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in power management and interface solutions for consumer, industrial, and automotive markets.
The TXS0206-29YFPRB belongs to TI's Application-Specific Interface Products (ASIP) family, engineered to simplify high-speed memory card interfacing by integrating translation, regulation, protection, and filtering into one die-targeting space- and power-constrained portable electronics.
FAQ
What is the maximum supported clock frequency for TXS0206-29YFPRB in push-pull mode?
The TXS0206-29YFPRB supports up to 60 MHz on the CLKB output in push-pull mode across all VCCA operating ranges (1.2 V to 3.3 V), as specified in the Timing Requirements table. This enables full-speed SD mode operation (25 MHz base clock × 2 for DDR) and exceeds SD 2.0 timing margins. The device achieves this via edge-rate acceleration circuitry that reduces effective output impedance during signal transitions.
Does TXS0206-29YFPRB require external pullup resistors on SDIO lines?
No, TXS0206-29YFPRB integrates smart pullup resistors on all A- and B-port SDIO lines (DAT0–DAT3, CMD, WP/CD). These dynamically switch between 4 kΩ (driving high), 40 kΩ (driving low), and 70 kΩ (Hi-Z state), eliminating the need for external resistors and optimizing VOL, static current, and noise immunity without compromising data integrity.
Can TXS0206-29YFPRB power both the B-port I/Os and an external SD card simultaneously?
Yes, the TXS0206-29YFPRB's VCCB O/P pin delivers up to 200 mA at 2.9 V, sufficient to power all six B-port I/O buffers and supply the VDD pin of standard SD/SDHC/SDXC cards (typical card peak current ≤150 mA). The LDO maintains ≤250-mV dropout even at full load, ensuring stable operation from a 3.05-V minimum input.
How does the EN pin affect LDO operation in TXS0206-29YFPRB?
When EN is pulled low, the TXS0206-29YFPRB places all A- and B-port outputs in Hi-Z state and disables the internal LDO-shutting down VCCB O/P output and reducing total quiescent current to ≤1 μA. This enables true hardware power gating for system-level sleep modes, unlike partial-disable schemes that leave regulators active.
Is TXS0206-29YFPRB compatible with Memory Stick™ and SDIO 2.0 standards?
Yes, TXS0206-29YFPRB is explicitly designed for MMC, SD, and Memory Stick™ interfaces per its datasheet description and timing specifications. It meets SDIO 2.0 electrical requirements-including 60-Mbps data rate, 2.9-V VDD compliance, ±8-kV IEC 61000-4-2 ESD on card-facing pins, and auto-direction sensing for DAT/CMD lines-making it fully interoperable with certified SDIO 2.0 peripherals.
TXS0206-29YFPRB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.1 V ~ 3.6 V
- Voltage - VCCB:
- 1.1 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain
- Data Rate:
- 60Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- SIM Card Interface
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-XFBGA, DSBGA
TXS0206-29YFPRB FAQ
1.How can I place an order for TXS0206-29YFPRB through Aetrix?
Please submit a Request for Quotation (RFQ) for TXS0206-29YFPRB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXS0206-29YFPRB reliable?
The price and inventory of TXS0206-29YFPRB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS0206-29YFPRB is usually 5 days.
3.What payment methods are accepted for TXS0206-29YFPRB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXS0206-29YFPRB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXS0206-29YFPRB?
TXS0206-29YFPRB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXS0206-29YFPRB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXS0206-29YFPRB?
For technical support, including TXS0206-29YFPRB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS0206-29YFPRB requirements.
6.How does Aetrix verify that TXS0206-29YFPRB is sourced from the original manufacturer or authorized distributors?
All TXS0206-29YFPRB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS0206-29YFPRB meets industry standards.
7.What is the process for return or replacement of TXS0206-29YFPRB?
All TXS0206-29YFPRB units undergo pre-shipment inspection (PSI). If there is an issue with TXS0206-29YFPRB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXS0206-29YFPRB part is unused and in its original packaging.
Return procedure for TXS0206-29YFPRB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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