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Texas Instruments TXS0206AYFPR
- Part No.:
- TXS0206AYFPR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
TXS0206AYFPR.pdf
- Description:
- IC TRANSLATOR BIDIR 20DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,584
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Product details
Overview
TXS0206AYFPR from Texas Instruments is a bidirectional SD/MMC voltage-translation transceiver designed to interface application processors (1.1–3.6 V I/O) with SD cards and MMC peripherals operating at different voltage levels (e.g., 1.8 V or 3.3 V). It supports up to 60 Mbps data rate, features 4.4 ns max propagation delay (1.8 V ↔ 3.0 V), integrated 40-kΩ pullup resistors on all data/command lines, and operates across –40°C to +85°C. It enables seamless host-to-card communication in space-constrained mobile storage interfaces.
For engineers reviewing the TXS0206AYFPR datasheet, TXS0206AYFPR pinout, TXS0206AYFPR application, or TXS0206AYFPR equivalent, this page delivers verified electrical specs, WCSP package layout, SD card interface timing constraints, ESD robustness (±2500-V HBM), and real-world implementation guidance for mobile and embedded memory subsystems.
Technical Context
The TXS0206AYFPR implements an auto-direction-sensing, passive-level-shifting architecture without external bias or direction control signals. Its dual-supply design (VCCA and VCCB independently configurable from 1.1 V to 3.6 V) allows asymmetric voltage translation-e.g., 1.8-V host ↔ 3.3-V SD card-and supports both push-pull and open-drain driving modes on CMD/DAT lines.
It integrates dedicated clock translation (CLKA → CLKB), clock feedback (CLK-f), write-protect (WP), and card-detect (CD) signal handling-all with internal pullups referenced to respective supply rails. The EN pin provides full 3-state control of B-port outputs, enabling dynamic power gating during card insertion/removal sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA / VCCB Range | 1.1 V to 3.6 V each - enables flexible host/card voltage pairing (e.g., 1.2-V SoC ↔ 1.8-V eMMC or 1.8-V AP ↔ 3.3-V SD) |
| Max Data Rate | 60 Mbps - supports high-speed SD mode (UHS-I SDR12/SDR25) and legacy high-speed MMC operation |
| Propagation Delay (tpd) | 3.2 ns (min) to 7.6 ns (max) - ensures timing margin for 40–60 MHz SD clocks and fast command/data turnaround |
| ESD Protection | ±2500-V HBM, ±1500-V CDM - meets IEC 61000-4-2 Level 4 system-level robustness requirements for handheld devices |
| Supply Current (ICCA/ICCB) | 7 µA / 11 µA - ultra-low static power enables always-on SD detection without battery drain impact |
| Package | DSBGA-20 (YFP), 1.96 mm × 1.56 mm, 0.4-mm ball pitch - optimized for thin mobile PCBs with minimal board area footprint |
| Operating Temperature | –40°C to +85°C - qualified for industrial and consumer portable electronics environments |
Pinout & Package
TXS0206AYFPR is housed in a 20-ball DSBGA (YFP) package measuring 1.96 mm × 1.56 mm with 0.4-mm ball pitch. The wafer-level chip-scale construction minimizes parasitic inductance and supports fine-pitch routing in high-density mobile layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 DAT2A | Bi-directional data bit 2 (host side) | Host-facing SD DAT2 line; 40-kΩ internal pullup to VCCA; referenced to A-port supply |
| A2 VCCA | A-port supply | Powers all A-port I/Os and control inputs; independent of VCCB; sets logic thresholds for host-side signals |
| A3 WP | Write-protect output | Open-drain output tied to mechanical SD connector WP switch; 100-kΩ internal pullup to VCCA |
| A4 DAT2B | Bi-directional data bit 2 (card side) | Card-facing SD DAT2 line; 40-kΩ internal pullup to VCCB; referenced to B-port supply |
| B1 DAT3A | Bi-directional data bit 3 (host side) | Host-facing SD DAT3 line; 40-kΩ internal pullup to VCCA |
| B2 CD | Card-detect output | Open-drain output tied to SD connector CD switch; 100-kΩ internal pullup to VCCA |
| B3 VCCB | B-port supply | Powers all B-port I/Os; sets logic thresholds for card-side signals; may differ from VCCA |
| B4 DAT3B | Bi-directional data bit 3 (card side) | Card-facing SD DAT3 line; 40-kΩ internal pullup to VCCB |
| C1 CMDA | Command line (host side) | Host-facing SD CMD line; 40-kΩ internal pullup to VCCA; bidirectional with auto-direction sensing |
| C2 GND | Ground | Common reference for both ports; two dedicated GND balls reduce ground bounce in high-speed switching |
| C3 GND | Ground | Second ground connection; improves return path integrity for differential-like signal pairs (e.g., CLK/CLK-f) |
| C4 CMDB | Command line (card side) | Card-facing SD CMD line; 40-kΩ internal pullup to VCCB; synchronized with CMDA via internal translator |
| D1 DAT0A | Bi-directional data bit 0 (host side) | Host-facing SD DAT0 line; 40-kΩ internal pullup to VCCA; primary data lane in 1-bit SD mode |
| D2 CLKA | Clock input (host side) | Host-provided SD clock; referenced to VCCA; drives internal translator and CLKB generation |
| D3 CLKB | Clock output (card side) | Translated SD clock delivered to card; referenced to VCCB; matches card's voltage domain and timing requirements |
| D4 DAT0B | Bi-directional data bit 0 (card side) | Card-facing SD DAT0 line; 40-kΩ internal pullup to VCCB; maintains signal integrity at card interface |
| E1 DAT1A | Bi-directional data bit 1 (host side) | Host-facing SD DAT1 line; 40-kΩ internal pullup to VCCA; used in 4-bit SD mode |
| E2 CLK-f | Clock feedback output | Resynchronized clock returned to host processor for data capture alignment; referenced to VCCA |
| E3 EN | Enable input | Active-high enable; pulls all B-port outputs into high-impedance when low - critical for hot-plug safety |
| E4 DAT1B | Bi-directional data bit 1 (card side) | Card-facing SD DAT1 line; 40-kΩ internal pullup to VCCB; completes 4-bit data bus for high-speed transfers |
Key Features
| Feature | Design Value |
|---|---|
| Auto-direction sensing | Eliminates need for external direction-control logic or GPIOs - reduces BOM count and firmware complexity in SD host drivers |
| Integrated 40-kΩ pullups | Removes six external resistors per SD interface (CMD/DAT0–DAT3), saving 0.5 mm² PCB area and improving signal rise time consistency |
| CLK-f feedback path | Enables precise resynchronization of read data at the host processor, mitigating skew between translated clock and data paths |
| Independent VCCA/VCCB supplies | Supports mixed-voltage SD systems (e.g., 1.2-V application processor core I/O + 3.3-V legacy SD card) without level-shifter cascading |
| EN-controlled 3-state B-port | Allows safe card insertion/removal by disabling B-port drivers before physical connection - prevents bus contention and latch-up |
Applications
| Mobile Phone SD Interface | Tablet PC eMMC Adapter |
|---|---|
Use Scenario: Interfacing a 1.8-V application processor to a 3.3-V SD card slot in a smartphone. IC Role / Device Role / Timing Role: Bidirectional voltage translator for CMD, CLK, DAT0–DAT3, WP, and CD signals; provides clock feedback (CLK-f) for timing closure. Use Value: Enables direct integration of legacy 3.3-V SD cards without redesigning the SoC I/O voltage or adding discrete level shifters. |
Use Scenario: Adapting a 1.2-V mobile SoC to drive a 1.8-V eMMC device in a tablet motherboard. IC Role / Device Role / Timing Role: Translates all SD/MMC protocol signals while maintaining 60-Mbps data throughput and sub-10-ns propagation delay. Use Value: Preserves high-speed eMMC performance while isolating voltage domains - avoids timing violations caused by passive resistor-based translation. |
| Notebook SD Card Reader | Ultrabook Embedded Storage |
Use Scenario: Implementing a compact, low-power SD card reader in a thin-and-light notebook with thermal constraints. IC Role / Device Role / Timing Role: Voltage translator with integrated WP/CD detection and ultra-low ICCA/ICCB (7 µA/11 µA) for always-on card presence monitoring. Use Value: Reduces standby power consumption by >90% versus discrete MOSFET-based translators, extending battery life in sleep states. |
Use Scenario: Enabling hot-pluggable microSD support in an ultrabook with strict PCB thickness limits. IC Role / Device Role / Timing Role: Provides EN-controlled 3-state B-port outputs and 0.4-mm pitch DSBGA package for <0.3-mm profile stacking with card connectors. Use Value: Eliminates need for mechanical interlocks or software delays during card insertion - hardware-enforced safe enumeration sequence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SD/MMC voltage translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0206YZPR | Same silicon die and electrical specs; differs only in tape-and-reel packaging (YFP vs YZP) and RoHS compliance status (lead-free vs lead-free with exemption). | No functional difference; identical pinout, timing, and thermal behavior - suitable for drop-in replacement where packaging format aligns with SMT line requirements. | Select TXS0206YZPR if your production line requires 7-inch tape reels with 3000-unit quantity per reel and full RoHS-6 compliance without exemptions. |
| SN74AVC4T245PW | Quad-channel, dual-supply translator with manual direction control (DIR pin); no integrated SD-specific functions (WP/CD/CLK-f); higher ICC (20 µA typical). | Lacks auto-direction sensing, clock feedback, and SD protocol-aware features - requires additional GPIOs and firmware logic to manage direction and card state. | Choose SN74AVC4T245PW only for non-SD applications requiring general-purpose 4-bit bidirectional translation with explicit direction control. |
Compared with TXS0206YZPR, the TXS0206AYFPR offers identical electrical performance but differs in packaging configuration and regulatory marking; compared with SN74AVC4T245PW, it delivers SD-optimized integration (auto-direction, CLK-f, WP/CD) that reduces firmware overhead and PCB component count by 6+ passives.
Availability
TXS0206AYFPR is available at Aetrix Electronics and suitable for mobile phones, tablets, notebooks, and ultrabook computers requiring stable component supply, long-term lifecycle support, and traceable sourcing for consumer electronics production.
Supply support for TXS0206AYFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power management, signal chain, and interface solutions.
The TXS0206AYFPR belongs to TI's voltage translation portfolio, engineered specifically for SD/MMC interface bridging in battery-powered portable devices where space, power, and protocol fidelity are critical design constraints.
FAQ
What is the maximum supported SD card speed mode for TXS0206AYFPR?
The TXS0206AYFPR supports up to 60 Mbps data rate and 60 MHz clock frequency, fully compliant with SD high-speed mode (SDR25) and UHS-I SDR12/SDR25 specifications. It achieves this with propagation delays as low as 3.2 ns (VCCA = 3.3 V, VCCB = 3.3 V), ensuring setup/hold timing margins for reliable high-speed transfers. TXS0206AYFPR does not support DDR50 or UHS-I DDR modes due to lack of dedicated DDR clock handling circuitry.
Does TXS0206AYFPR require external pullup resistors on SD data and command lines?
No, TXS0206AYFPR integrates 40-kΩ pullup resistors on all bidirectional data (DAT0–DAT3) and command (CMD) lines on both A-port and B-port sides. This eliminates the need for eight external resistors in a standard 4-bit SD interface, reducing PCB area, bill-of-materials cost, and potential signal integrity variation from discrete component tolerances. TXS0206AYFPR also includes 100-kΩ pullups on WP and CD pins.
How does the EN pin function in TXS0206AYFPR, and what is its timing behavior?
The EN pin on TXS0206AYFPR is an active-high enable that places all B-port outputs (CMDB, DAT0B–DAT3B, CLKB) into high-impedance state when driven low. Enable/disable times (ten/tdis) are guaranteed ≤1 µs across all VCC conditions, allowing rapid, hardware-controlled isolation of the SD card bus during hot-plug events. This prevents bus contention and ensures safe card insertion/removal without software intervention. TXS0206AYFPR's EN pin is referenced to VCCA and requires no external debouncing.
Can TXS0206AYFPR translate between 1.2-V and 3.3-V SD interfaces?
Yes, TXS0206AYFPR supports asymmetric voltage translation with VCCA and VCCB independently configurable from 1.1 V to 3.6 V. It has been characterized for 1.2-V ↔ 3.3-V operation, delivering 60 Mbps data rate and 5.3 ns propagation delay (tpd) under those conditions. The device maintains valid VOH/VOL levels and timing margins across this range, making it suitable for interfacing low-voltage application processors with legacy 3.3-V SD cards without intermediate regulators or additional level-shifting stages.
What is the purpose of the CLK-f pin on TXS0206AYFPR, and how is it used?
The CLK-f (clock feedback) pin on TXS0206AYFPR provides a resynchronized version of the translated clock signal back to the host processor, referenced to VCCA. This enables the host to precisely align data capture windows with the actual clock edge delivered to the SD card - compensating for propagation delay mismatches between CLK-f and data paths. CLK-f is essential for achieving timing closure in high-speed SD read operations where data-to-clock skew could otherwise cause sampling errors. TXS0206AYFPR drives CLK-f with controlled rise/fall times (≤2.5 ns) to ensure clean edges for host PLL locking.
TXS0206AYFPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.1 V ~ 3.6 V
- Voltage - VCCB:
- 1.1 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain
- Data Rate:
- 60Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- SIM Card Interface
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-XFBGA, DSBGA
TXS0206AYFPR FAQ
1.How can I place an order for TXS0206AYFPR through Aetrix?
Please submit a Request for Quotation (RFQ) for TXS0206AYFPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXS0206AYFPR reliable?
The price and inventory of TXS0206AYFPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS0206AYFPR is usually 5 days.
3.What payment methods are accepted for TXS0206AYFPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXS0206AYFPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXS0206AYFPR?
TXS0206AYFPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXS0206AYFPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXS0206AYFPR?
For technical support, including TXS0206AYFPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS0206AYFPR requirements.
6.How does Aetrix verify that TXS0206AYFPR is sourced from the original manufacturer or authorized distributors?
All TXS0206AYFPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS0206AYFPR meets industry standards.
7.What is the process for return or replacement of TXS0206AYFPR?
All TXS0206AYFPR units undergo pre-shipment inspection (PSI). If there is an issue with TXS0206AYFPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXS0206AYFPR part is unused and in its original packaging.
Return procedure for TXS0206AYFPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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