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Texas Instruments TXS0206YFPR

Part No.:
TXS0206YFPR
Manufacturer:
Texas Instruments
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixTXS0206YFPR.pdf
Description:
IC TRANSLATOR BIDIR 20DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,594

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Product details

Overview

TXS0206YFPR from Texas Instruments is a bidirectional voltage-level translation transceiver designed for MMC/SD/Memory Stick™ card interfaces. It supports independent 1.1 V–3.6 V supplies on A- and B-ports, delivers ≤4 ns propagation delay (1.8 V ↔ 3 V), integrates ±8-kV IEC 61000-4-2 ESD protection on the card side, and operates in mobile phone and digital camera memory card slots.

For engineers reviewing the TXS0206YFPR datasheet, TXS0206YFPR pinout, TXS0206YFPR application, or TXS0206YFPR equivalent, key selection criteria include dual-supply level-shifting capability, integrated EMI filtering, WCSP package footprint constraints, and SDIO timing compliance up to 60 MHz.

Technical Context

The TXS0206YFPR implements a passive, resistor-based level-shifting architecture with dynamic pull-up resistors (4 kΩ high-state / 40 kΩ low-state) and integrated ASIP (Active Signal Integrity Protection) circuitry. It features separate enable-controlled Hi-Z states per port and includes dedicated CLK feedback (CLK-f) for host resynchronization.

Its terminal mapping supports full SD/SDIO 4-bit data bus (DAT0–DAT3), CMD, CLK, CD, and WP signals across two voltage domains. The device uses open-drain and push-pull compatible I/O structures, with internal 100-kΩ pull-ups on CD and WP pins referenced to VCCA.

Key Specifications

ParameterValue and Actual Design Meaning
VCCA / VCCB Range1.1 V to 3.6 V each - enables flexible interfacing between 1.2-V/1.8-V processors and 2.9-V/3.3-V memory cards.
Max Data Rate60 Mbps (data), 60 MHz (clock) - supports High-Speed SD mode and Memory Stick PRO-HG timing requirements.
Propagation Delay≤4 ns max (1.8 V ↔ 3 V) - ensures signal integrity in high-frequency SDIO command/data paths.
ESD Protection±8-kV contact discharge (IEC 61000-4-2) on B-port - meets memory card interface ESD robustness mandates.
Package20-bump WCSP (YFP), 1.96 mm × 1.56 mm, 0.4-mm pitch - provides minimal PCB area for space-constrained mobile designs.
Supply Current6 μA ICCA / 5 μA ICCB - enables ultra-low static power in battery-powered portable devices.
I/O Capacitance15–17.5 pF (B-port), 5.5–6.5 pF (A-port) - minimizes signal distortion and maintains timing margins in high-speed traces.

Pinout & Package

TXS0206YFPR is housed in a 20-bump wafer chip scale package (WCSP) with YFP designation, measuring 1.96 mm × 1.56 mm and featuring 0.4-mm ball pitch. The package is Pb-free and optimized for fine-pitch routing in mobile applications.

Pin/TerminalCircuit RoleDesign Meaning
A1DAT2AData bit 2 (host side), referenced to VCCA, with 40-kΩ pull-up to VCCA.
A2VCCAPower supply for A-port I/Os and control inputs (e.g., EN, CLKA).
A3WPWrite-protect output to mechanical connector; 100-kΩ pull-up to VCCA.
A4DAT2BData bit 2 (card side), referenced to VCCB, with 40-kΩ pull-up to VCCB.
B1DAT3AData bit 3 (host side), referenced to VCCA, with 40-kΩ pull-up to VCCA.
B2CDCard-detect output to mechanical connector; 100-kΩ pull-up to VCCA.
B3VCCBPower supply for B-port I/Os (DAT0–DAT3, CMDB, CLKB, CLK-f).
B4DAT3BData bit 3 (card side), referenced to VCCB, with 40-kΩ pull-up to VCCB.
C1CMDACommand line (host side), referenced to VCCA, with 40-kΩ pull-up to VCCA.
C2, C3GNDDual ground connections for noise isolation between A- and B-port signal domains.
C4CMDBCommand line (card side), referenced to VCCB, with 40-kΩ pull-up to VCCB.
D1DAT0AData bit 0 (host side), referenced to VCCA, with 40-kΩ pull-up to VCCA.
D2CLKAClock input from host, referenced to VCCA.
D3CLKBClock output to card, referenced to VCCB.
D4DAT0BData bit 0 (card side), referenced to VCCB, with 40-kΩ pull-up to VCCB.
E1DAT1AData bit 1 (host side), referenced to VCCA, with 40-kΩ pull-up to VCCA.
E2CLK-fClock feedback to host for data resynchronization; leave unconnected if unused.
E3ENEnable input (active-high, referenced to VCCA); pulls all outputs to Hi-Z when low.
E4DAT1BData bit 1 (card side), referenced to VCCB, with 40-kΩ pull-up to VCCB.

Key Features

FeatureDesign Value
Dual-supply bidirectional translationIndependent VCCA/VCCB (1.1–3.6 V) allows mixed-voltage SDIO host-to-card communication without external logic.
Integrated ESD + EMI protection±8-kV IEC 61000-4-2 contact discharge on B-port plus on-chip filtering eliminates need for discrete TVS diodes.
Dynamic pull-up resistors4-kΩ (high) / 40-kΩ (low) values optimize VIH margin for Memory Stick™ while preventing excessive current draw.
Dedicated CLK feedback pathCLK-f output enables precise timing alignment of returned data to host clock domain, critical for DDR SDIO modes.
Hi-Z enable controlSingle EN pin disables both ports simultaneously, supporting hot-plug detection and power sequencing in portable systems.

Applications

Smartphone SD Card InterfaceDigital Camera Memory Slot

Use Scenario: Interfacing an application processor (1.8 V I/O) with a 3.3 V SDHC card in a compact smartphone PCB layout.

IC Role / Device Role / Timing Role: Bidirectional level translator for DAT0–DAT3, CMD, CLK, CD, and WP signals; provides timing-aligned CLK-f feedback.

Use Value: Eliminates six discrete level shifters and external ESD protection, reducing BOM count and board area by >40%.

Use Scenario: Connecting a 1.2-V image sensor SoC to a Memory Stick PRO-HG card in a DSLR-style digital camera.

IC Role / Device Role / Timing Role: Voltage translator with dynamic pull-ups ensuring valid VIH at 1.2-V host side while meeting MSA/MSH spec requirements.

Use Value: Enables reliable high-speed (>40 Mbps) data transfer without violating Memory Stick™ VIH thresholds or exceeding 10-kΩ pulldown limits.

Portable Media Player SDIO PeripheralsSet-Top Box eMMC Boot Interface

Use Scenario: Adding Wi-Fi or Bluetooth SDIO modules to a 1.5-V ARM-based media player using shared SDIO bus lines.

IC Role / Device Role / Timing Role: Level shifter enabling coexistence of 1.5-V host and 3.3-V SDIO peripheral on same bus; EN pin supports runtime disable.

Use Value: Prevents signal contention during module insertion/removal and maintains timing compliance up to 50 MHz clock rate.

Use Scenario: Booting from eMMC using a 2.9-V card while host controller operates at 1.8 V in an industrial set-top box.

IC Role / Device Role / Timing Role: Translates boot-time CMD/DAT/CLK signals with <4 ns delay to preserve setup/hold margins during initialization.

Use Value: Ensures deterministic boot sequence under worst-case voltage and temperature conditions without timing closure risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar voltage-translation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TXB0106PWRAuto-direction sensing, higher ICC (20 μA), no integrated ESD/EMI filtering, 6-channel only.Lacks ±8-kV IEC-rated ESD protection and dedicated CLK-f; requires external TVS diodes for card-side compliance.Choose TXB0106PWR only if direction control is needed and ESD protection is handled externally.
SN74AVC4T245PWDirection-controlled (DIR pin), 3.6-V max VCC, no integrated ESD, 4-channel with configurable VREF.Requires external direction logic and discrete ESD protection; not qualified for direct SD card interface per JEDEC/SDA specs.Select SN74AVC4T245PW when bidirectional auto-sensing is unnecessary and board space allows added protection components.

Compared with TXB0106PWR and SN74AVC4T245PW, the TXS0206YFPR uniquely combines auto-sensing bidirectional translation, integrated ±8-kV IEC ESD, and CLK-f feedback-making it the only single-chip solution qualified for direct SD/SDIO/Memory Stick™ card slot integration without supplemental protection circuitry.

Availability

TXS0206YFPR is available at Aetrix Electronics and suitable for smartphone memory interfaces, digital camera SD slots, and portable media player SDIO peripherals requiring stable component supply and long-term lifecycle support.

Supply support for TXS0206YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation history.

The TXS0206YFPR belongs to TI's voltage translation and interface solutions product line, engineered specifically for high-reliability, space-constrained memory card interfacing in portable consumer electronics.

FAQ

What is the maximum supported clock frequency for TXS0206YFPR in SD High-Speed mode?

The TXS0206YFPR supports up to 60 MHz clock frequency in push-pull driving mode across all VCCA/VCCB combinations, satisfying SD High-Speed mode (up to 50 MHz) and Memory Stick PRO-HG timing requirements. Measured tpd remains ≤12.5 ns at 3.3-V VCCA and 3.3-V VCCB, preserving setup/hold margins.

Does TXS0206YFPR require external pull-up resistors on DAT/CMD lines?

No, TXS0206YFPR includes internal 40-kΩ pull-up resistors on all DATx and CMD I/Os (both A- and B-ports), eliminating the need for external pull-ups. Its dynamic pull-up design switches to 4-kΩ during high-state transmission to ensure adequate VIH margin for Memory Stick™ cards.

How does the EN pin affect TXS0206YFPR operation during SD card hot-plug events?

When EN is pulled low, TXS0206YFPR places all A- and B-port I/Os in high-impedance state within ≤68 ns (B-port) or ≤62 ns (A-port), preventing signal contention during card insertion/removal. This enables clean hot-plug detection and avoids bus lock-up in portable systems.

Can TXS0206YFPR be used with eMMC instead of SD cards?

Yes, TXS0206YFPR is compatible with eMMC v4.4+ and later, supporting its 1.8-V/2.9-V dual-voltage operation and 4-bit data bus. Its 60-Mbps data rate and <4-ns propagation delay meet eMMC HS200 timing requirements when VCCA = 1.8 V and VCCB = 2.9 V.

What is the significance of the CLK-f pin on TXS0206YFPR?

The CLK-f pin provides a buffered, phase-aligned copy of CLKB back to the host processor, enabling precise resynchronization of returned data in DDR SDIO modes. Unlike standard clock outputs, CLK-f compensates for internal propagation delay, reducing timing skew between data and clock sampling edges in high-speed transfers.

TXS0206YFPR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
Packaging:
Tape & Reel (TR)
Product Status:
Active
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
4
Voltage - VCCA:
1.1 V ~ 3.6 V
Voltage - VCCB:
1.1 V ~ 3.6 V
Input Signal:
-
Output Signal:
-
Output Type:
Open Drain
Data Rate:
60Mbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
SIM Card Interface
Mounting Type:
Surface Mount
Supplier Device Package:
20-XFBGA, DSBGA

TXS0206YFPR FAQ

1.How can I place an order for TXS0206YFPR through Aetrix?

Please submit a Request for Quotation (RFQ) for TXS0206YFPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TXS0206YFPR reliable?

The price and inventory of TXS0206YFPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS0206YFPR is usually 5 days.

3.What payment methods are accepted for TXS0206YFPR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXS0206YFPR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TXS0206YFPR?

TXS0206YFPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TXS0206YFPR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TXS0206YFPR?

For technical support, including TXS0206YFPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS0206YFPR requirements.

6.How does Aetrix verify that TXS0206YFPR is sourced from the original manufacturer or authorized distributors?

All TXS0206YFPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS0206YFPR meets industry standards.

7.What is the process for return or replacement of TXS0206YFPR?

All TXS0206YFPR units undergo pre-shipment inspection (PSI). If there is an issue with TXS0206YFPR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TXS0206YFPR part is unused and in its original packaging.

Return procedure for TXS0206YFPR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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