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Texas Instruments TXS02324RUKR
- Part No.:
- TXS02324RUKR
- Manufacturer:
- Texas Instruments
- Category:
- Specialized
- Package:
- 20-WFQFN Exposed Pad
- Datasheet:
-
TXS02324RUKR.pdf
- Description:
- IC INTERFACE SPECIALIZED 20QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,616
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Product details
Overview
TXS02324RUKR from Texas Instruments is a dual-supply 2:1 SIM card multiplexer/translator with slot-dedicated dual LDOs, designed for mobile handset baseband processors interfacing two ISO/IEC-compliant SIM/UICC cards. It provides 1.7–3.3 V VDDIO operation, selectable 1.8 V or 2.95 V VSIM outputs (50 mA per LDO), and I²C-configurable control of SIM1/SIM2 reset, clock, and I/O translation with 4 ns propagation delay on push-pull signals.
For engineers reviewing the TXS02324RUKR datasheet, TXS02324RUKR pinout, TXS02324RUKR application, or TXS02324RUKR equivalent, this device addresses dual-SIM mobile architecture challenges including voltage-level translation between 1.8 V baseband and Class-B/C SIM cards, independent LDO regulation, fast-mode I²C configuration (400 kbps), and integrated active pull-down management during interface isolation.
Technical Context
The TXS02324RUKR integrates two independent LDO regulators-each programmable to 1.8 V or 2.95 V output with ≤100 mV dropout at 50 mA-and a bidirectional level translator supporting open-drain (SIMxIO, SIMIO) and push-pull (SIMxRST, SIMxCLK) signaling across VDDIO (1.7–3.3 V) and VSIM domains. Its I²C slave interface (7-bit address configurable via IRQ pin) enables real-time control of regulator enable/state and interface power modes (powered down, isolated, active).
Internal logic enforces strict state sequencing: SIM interface activation requires coordinated LDO enable followed by state register write (bits 3:2 / 7:6), while switching between SIM1 and SIM2 mandates clock-stop latching before re-enabling the target interface. The device includes thermal shutdown (~160°C), current limiting (~400 mA), and ESD protection exceeding 2 kV HBM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDDIO Range | 1.7 V to 3.3 V - sets baseband-side I/O reference voltage and powers internal logic/I²C interface |
| VSIM Output Voltage | Selectable 1.8 V or 2.95 V - matches ISO/IEC Class-C or Class-B SIM card requirements per slot |
| LDO Output Current | 50 mA per channel - sufficient to power full SIM card circuitry including I/O, CLK, RST under Class-B load |
| I²C Interface Speed | 400 kbps Fast-Mode - enables rapid register read/write for SIM switching and status monitoring |
| Propagation Delay (trB) | 6 ns (SIMxIO → SIMIO) - ensures timing compliance with 5 MHz SIMCLK maximum frequency |
| ESD Rating | 2000 V HBM, 1000 V CDM - meets mobile handset robustness requirements for SIM card slot exposure |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade mobile platform deployment |
Pinout & Package
TXS02324RUKR uses a 20-pin WQFN package (RUK), 3 mm × 3 mm, with exposed thermal pad requiring connection to GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (SIM2RST) | Output | Active-high SIM2 reset signal referenced to VSIM2; driven by internal translator |
| 2 (VSIM2) | Power Output | Regulated 1.8 V or 2.95 V supply for SIM2 slot; sourced from dedicated LDO |
| 3 (VBAT) | Power Input | Main battery input (2.3–5.5 V) feeding both LDOs; requires 1 µF ceramic capacitor |
| 4 (GND) | Ground | Primary ground reference for LDOs, translator, and digital logic; connects to exposed thermal pad |
| 5 (VSIM1) | Power Output | Regulated 1.8 V or 2.95 V supply for SIM1 slot; independent of VSIM2 |
| 6 (SIM1RST) | Output | Active-high SIM1 reset signal referenced to VSIM1 |
| 7 (SIM1IO) | I/O | Open-drain bidirectional data line for SIM1; level-translated between VDDIO and VSIM1 |
| 8 (SIM1CLK) | Output | Push-pull SIM1 clock output referenced to VSIM1; supports up to 5 MHz |
| 9 (SIMRST) | Input | Baseband-originated UICC/SIM reset signal referenced to VDDIO |
| 10 (SIMCLK) | Input | Baseband-originated UICC/SIM clock input referenced to VDDIO |
| 11 (SIMIO) | I/O | Baseband-side open-drain UICC/SIM data line referenced to VDDIO |
| 12 (VDDIO) | Power Input | 1.7–3.3 V supply for device core logic and baseband-side I/O buffers |
| 13 (SCL) | Input | I²C clock input referenced to VDDIO; part of 7-bit slave interface |
| 14 (SDA) | I/O | I²C data line referenced to VDDIO; supports read/write to control/status registers |
| 15 (IRQ) | I/O | Interrupt output to baseband; also used to select one of four I²C slave addresses |
| 16 (RSTX) | Input | Active-low hardware reset input referenced to VDDIO; forces register defaults |
| 17 (DNU) | Input | Do-not-use pin; must remain unconnected to avoid undefined behavior |
| 18 (GND) | Ground | Secondary ground connection; ties to same net as Pin 4 and thermal pad |
| 19 (SIM2CLK) | Output | Push-pull SIM2 clock output referenced to VSIM2 |
| 20 (SIM2IO) | I/O | Open-drain bidirectional data line for SIM2; level-translated between VDDIO and VSIM2 |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent LDOs | Each delivers 50 mA at 1.8 V or 2.95 V with ≤100 mV dropout - eliminates need for external regulators in dual-SIM handsets |
| I²C-configurable SIM state control | Four-state interface management (powered down, isolated, powered, active) per SIM slot - enables deterministic hot-swap and low-power standby |
| Integrated active pull-down network | Pull-downs tied to VSIMx outputs activate automatically when regulator disabled - prevents floating SIM lines during slot deselection |
| Thermal and current protection | Thermal shutdown (~160°C) and current limit (~400 mA) per LDO - safeguards against overtemperature and short-circuit faults |
| Low-noise LDO design | PSRR > 40 dB at 10 kHz with 1 µF output capacitor - maintains stable SIM supply despite noisy battery rail |
Applications
| Smartphone Dual-SIM Architecture | Tablet Dual-Subscriber Connectivity |
|---|---|
Use Scenario: Mobile platform supporting two independent cellular subscriptions (e.g., personal + business) with seamless switching and concurrent standby. IC Role / Device Role / Timing Role: SIM multiplexer/translator managing physical layer interface between baseband SoC and two SIM slots, including voltage translation, clock/data routing, and LDO regulation. Use Value: Enables single-baseband design to drive two ISO/IEC 7816-compliant SIM cards without external level shifters or discrete regulators, reducing BOM count and PCB area. |
Use Scenario: LTE-enabled tablet requiring dual IMSI support for regional carrier flexibility and failover connectivity. IC Role / Device Role / Timing Role: Dual-LDO SIM interface controller providing independent 1.8 V/2.95 V supplies and I²C-managed slot arbitration. Use Value: Eliminates need for dual-SIM baseband pinout expansion or external power management ICs, simplifying layout and ensuring Class-B/C compliance per slot. |
| Industrial M2M Dual-Network Modem | Global Roaming Handheld Terminal |
Use Scenario: Ruggedized field terminal maintaining simultaneous connections to primary and backup cellular networks (e.g., LTE-M + NB-IoT) across geographies. IC Role / Device Role / Timing Role: SIM interface translator enabling baseband to dynamically switch between SIM1 (home network) and SIM2 (roaming partner) with sub-100 ms latency. Use Value: Guarantees uninterrupted service via hardware-level SIM arbitration and regulated power delivery, meeting -40°C to +85°C industrial operating range. |
Use Scenario: Travel-oriented handheld device supporting local SIM insertion in each visited country while retaining home subscription for emergency services. IC Role / Device Role / Timing Role: Dual-slot SIM controller with I²C-configurable voltage selection (1.8 V/2.95 V) and automatic pull-down activation during slot transitions. Use Value: Ensures plug-and-play compatibility with global SIM cards regardless of Class-B or Class-C specification, reducing firmware complexity for multi-region deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM card multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX14749ETL+ | Single-LDO architecture (one 2.95 V output); no VSIM1/VSIM2 independence; lower max IOUT (25 mA) | Suitable only for single-SIM extension or low-current dual-SIM where shared regulation suffices | Select when cost sensitivity outweighs dual-LDO flexibility and 50 mA per slot is unnecessary |
| TS3USB30E | No integrated LDOs; requires external 1.8 V/2.95 V supplies; lacks I²C control and SIM-specific state management | Applicable only as pure analog switch in systems with pre-regulated SIM rails and software-managed sequencing | Choose only if existing power architecture already provides dual independent SIM voltages and full state control resides in baseband firmware |
Compared with MAX14749ETL+ and TS3USB30E, TXS02324RUKR uniquely delivers independent dual-LDO regulation, I²C-configurable SIM state control, and integrated pull-down management-making it the only solution that fully replaces discrete power + translation + sequencing logic in space-constrained dual-SIM mobile designs.
Availability
TXS02324RUKR is available at Aetrix Electronics and suitable for smartphone dual-SIM architectures, industrial M2M modems, and global roaming handheld terminals requiring stable component supply, long-term lifecycle support, and automotive-qualified thermal performance.
Supply support for TXS02324RUKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in mobile power management and interface ICs.
TXS02324RUKR belongs to TI's SIM card interface product line, engineered specifically to simplify dual-SIM integration in space- and power-constrained mobile platforms while maintaining full ISO/IEC 7816 and GSM/3G compliance.
FAQ
What is the function of the DNU pin on TXS02324RUKR?
The DNU (Do Not Use) pin (Pin 17) on TXS02324RUKR must remain electrically unconnected in all designs. It has no internal functionality and connecting it may cause undefined behavior or compromise device reliability. This requirement is explicitly stated in the TI SCES823 datasheet Terminal Functions table and reinforced in the Application Information section.
How does TXS02324RUKR handle SIM card voltage class selection?
TXS02324RUKR supports both ISO/IEC Class-B (2.95 V) and Class-C (1.8 V) SIM cards via independent LDO voltage selection per slot. Configuration is performed through bits B1 and B5 in the SIM Interface Control Register (08h): writing '0' selects 1.8 V, '1' selects 2.95 V for VSIM1 and VSIM2 respectively. The LDOs maintain regulation within ±0.15 V tolerance across temperature and load.
Can TXS02324RUKR operate with only one SIM slot enabled?
Yes, TXS02324RUKR fully supports single-SIM operation. Either SIM1 or SIM2 can be independently powered and activated via I²C control register writes (bits 0/4 for LDO enable; bits 2:3 / 6:7 for interface state), while the other slot remains in powered-down mode with active pull-downs. This capability is confirmed in the BASIC DEVICE OPERATION and SETTING UP THE SIM INTERFACE sections of the datasheet.
What is the purpose of the IRQ pin on TXS02324RUKR beyond interrupt signaling?
Beyond generating interrupts to the baseband processor, the IRQ pin on TXS02324RUKR serves as an address-select input for the I²C interface. Combined with the R/W bit, IRQ determines one of four possible slave addresses (0x78–0x7B), allowing multiple TXS02324RUKR devices to coexist on the same I²C bus without address conflict - a feature documented in the DEVICE ADDRESS section of SCES823.
Does TXS02324RUKR require external capacitors, and if so, what values?
Yes, TXS02324RUKR requires external capacitors per the Application Information section: a 1.0 µF ceramic capacitor (X5R/X7R, ESR < 1 Ω) on VBAT, and a 0.1 µF ceramic capacitor on VDDIO. These are mandatory for LDO stability, noise suppression, and transient response - omitting them risks regulator oscillation, poor PSRR, or failure to meet Class-B/C voltage tolerances.
TXS02324RUKR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 20-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Mobile Handsets
- Interface:
- I2C
- Voltage - Supply:
- 1.7V ~ 3.3V
- Supplier Device Package:
- 20-WQFN (3x3)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
TXS02324RUKR FAQ
1.How can I place an order for TXS02324RUKR through Aetrix?
Please submit a Request for Quotation (RFQ) for TXS02324RUKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXS02324RUKR reliable?
The price and inventory of TXS02324RUKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS02324RUKR is usually 5 days.
3.What payment methods are accepted for TXS02324RUKR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TXS02324RUKR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TXS02324RUKR?
TXS02324RUKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXS02324RUKR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXS02324RUKR?
For technical support, including TXS02324RUKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS02324RUKR requirements.
6.How does Aetrix verify that TXS02324RUKR is sourced from the original manufacturer or authorized distributors?
All TXS02324RUKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS02324RUKR meets industry standards.
7.What is the process for return or replacement of TXS02324RUKR?
All TXS02324RUKR units undergo pre-shipment inspection (PSI). If there is an issue with TXS02324RUKR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXS02324RUKR part is unused and in its original packaging.
Return procedure for TXS02324RUKR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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