Texas Instruments TXS02326AMRGER
- Part No.:
- TXS02326AMRGER
- Manufacturer:
- Texas Instruments
- Category:
- Specialized
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
TXS02326AMRGER.pdf
- Description:
- IC INTERFACE SPECIALIZED 24VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,234
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Product details
Overview
TXS02326AMRGER from Texas Instruments is a dual-supply 2:1 SIM card multiplexer/translator with integrated dual LDOs, supporting Class-B (2.95 V) and Class-C (1.8 V) smart card interfaces. It provides automatic SIM slot detection, I²C-based configuration (400 kb/s), 32-kHz clock input, and battery-removal–triggered shutdown. Used in dual-SIM mobile handsets to extend single baseband UICC interface.
For engineers reviewing the TXS02326AMRGER datasheet, TXS02326AMRGER pinout, TXS02326AMRGER application, or TXS02326AMRGER equivalent, key selection concerns include dual-LDO voltage selectability (1.8 V / 2.95 V), independent SIM1/SIM2 interface control via I²C registers, BSI/SDN debounce programmability, IRQ interrupt mapping, and QFN-24 thermal-pad grounding compliance.
Technical Context
The TXS02326AMRGER implements two independent voltage-level translation paths (SIM1 and SIM2), each referenced to its own LDO output (VSIM1/VSIM2), while interfacing to the baseband via VDDIO (1.7–3.3 V). Its internal logic decodes I²C commands to configure regulator enable/state, voltage selection, interface activation, and pull-down behavior per slot.
It integrates two 8-bit programmable debounce counters (BSI and SDN inputs), configurable detection thresholds (1.2 V / 1.65 V for BSI), and dual shutdown sequences-staged for active SIMs and instant for isolated/clock-stopped slots-triggered by debounced signals synchronized to the 32-kHz clock domain.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDDIO Range | 1.7 V to 3.3 V - sets reference for baseband-side I/O buffers and control logic |
| VSIM1/VSIM2 Output | Selectable 1.8 V or 2.95 V - supports ISO/IEC 7816 Class-C or Class-B SIM cards |
| LDO Current Capability | 50 mA per channel - sufficient to power both SIM cards simultaneously under peak load |
| I²C Interface Speed | 400 kb/s Fast-mode - enables rapid register read/write for dynamic SIM switching |
| Debounce Clock Source | Internal or external 32 kHz - allows precise timing control of BSI/SDN signal validation |
| ESD Protection | 6 kV HBM on SIM-side pins - meets GSM/3G handset robustness requirements for hot-swap SIM events |
| Package | 24-pin QFN (4 mm × 4 mm) with exposed thermal pad - requires PCB thermal pad connection to GND for thermal stability |
Pinout & Package
24-pin QFN (RGE) package with 0.4-mm pitch and exposed thermal pad that must be soldered to ground plane for thermal management and EMI reduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IRQ) | Interrupt output | Active-low open-drain signal to baseband indicating status change or interrupt event |
| 2 (RSTX) | Reset input | Active-low asynchronous reset from baseband; forces device into default state |
| 3 (SDN) | Shutdown input | Dedicated control for SIM2 power-down; debounced and configurable for active-high/low |
| 4 (BSI) | Battery sense input | Analog input (up to 3 V) monitoring battery presence; debounced before triggering dual-SIM shutdown |
| 5–7, 11–14, 16–18, 24 (SIMxCLK, SIMxI/O, SIMxRST, SIMCLK, SIMI/O, SIMRST, SDA) | Bi-directional data/control | Level-translated signals between baseband and SIM slots; direction controlled by OE or auto-detect logic |
| 8, 9, 19, 21–23 (VSIM1, VBAT, OE, VDDIO, CLK, SCK) | Power/control supply | VSIM1/VSIM2: regulated outputs; VBAT: 2.3–5.5 V battery input; VDDIO: 1.7–3.3 V logic supply; CLK: 32-kHz timing reference |
| 10, 20 (GND) | Ground | Dual GND pins plus exposed thermal pad - mandatory connection to PCB ground plane for thermal and noise integrity |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent LDOs | Each supplies 1.8 V or 2.95 V at up to 50 mA - enables concurrent operation of mixed-voltage SIM cards without external regulators |
| Programmable BSI/SDN debounce | 8-bit counter values stored in registers 0Ah/0Bh - prevents false shutdown during transient battery disconnect or mechanical switch bounce |
| I²C-configurable SIM interface states | Four states per slot (powered down, isolated, powered, active) - allows safe clock-stop sequencing and hot-swap handling per ISO/IEC 7816 |
| Automatic dual-SIM shutdown | Triggered by BSI high threshold (1.2 V or 1.65 V); SDN triggers SIM2-only shutdown - eliminates need for baseband firmware intervention during battery removal |
| 32-kHz clock flexibility | Internal oscillator or external CLK pin (pin 22) selectable via register 0Dh - supports low-power always-on timing or precision external source synchronization |
Applications
| Mobile Dual-SIM Handset | UICC Interface Extension Module |
|---|---|
Use Scenario: Smartphone design requiring support for two physical SIM cards sharing one baseband processor UICC interface. IC Role / Device Role / Timing Role: Dual-supply SIM multiplexer translating baseband logic levels to either 1.8-V or 2.95-V SIM standards while managing power sequencing and slot arbitration. Use Value: Eliminates need for discrete level shifters, dual LDOs, and custom shutdown logic - reduces BOM count and PCB area in space-constrained handset designs. | Use Scenario: Carrier-certified module integrating dual-SIM capability into legacy single-SIM platforms via standardized UICC connector. IC Role / Device Role / Timing Role: Standalone SIM interface bridge with I²C host control, enabling firmware-driven SIM switching without modifying baseband SoC drivers. Use Value: Enables field-upgradable dual-SIM functionality using existing baseband I²C infrastructure and minimal hardware changes. |
| Automotive Telematics Unit | Industrial M2M Router |
Use Scenario: In-vehicle telematics system requiring redundant cellular connectivity via primary and backup SIM cards. IC Role / Device Role / Timing Role: SIM failover controller with battery-removal detection (BSI) and programmable SDN shutdown - ensures graceful SIM deactivation during vehicle power cycling. Use Value: Prevents SIM card corruption during ignition-off events by executing controlled power-down sequence synchronized to 32-kHz clock. | Use Scenario: Ruggedized industrial router deployed in remote locations where SIM hot-swap must be supported without system reboot. IC Role / Device Role / Timing Role: Hot-plug–capable SIM translator with isolated interface states and ESD-hardened I/O (6 kV HBM on SIM pins). Use Value: Maintains communication continuity during SIM replacement by isolating inactive slot while keeping active slot operational - no packet loss or session reset required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM card multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX14749ETA+ | Single-channel SIM translator with integrated LDO; no dual-slot arbitration or BSI/SDN debounce logic | Suitable only for single-SIM extension; lacks automatic shutdown and I²C register control for dual-SIM state management | Choose when only one SIM slot is needed and cost-sensitive design excludes multi-slot complexity |
| TPS65132ARSLR | Dual-output charge pump + LDO for display bias; no SIM interface logic, I²C control, or level translation architecture | Designed for LCD panel power, not smart card protocols; incompatible pinout and functional scope | Not functionally comparable - excluded from SIM multiplexer use cases due to absence of ISO/IEC 7816 interface support |
Compared with MAX14749ETA+ and TPS65132ARSLR, the TXS02326AMRGER uniquely delivers integrated dual-SIM arbitration, programmable debounce, and I²C-configurable interface states - making it the only option among the three qualified for production dual-SIM handset designs requiring carrier-grade reliability and hot-swap compliance.
Availability
TXS02326AMRGER is available at Aetrix Electronics and suitable for mobile handset design, automotive telematics integration, and industrial M2M router development requiring stable component supply and long-term lifecycle support.
Supply support for TXS02326AMRGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The TXS02326AMRGER belongs to TI's Smart Card Interface product line, designed specifically to simplify dual-SIM integration in space-constrained wireless devices while meeting ISO/IEC 7816, GSM, and 3G timing and electrical compliance requirements.
FAQ
What is the primary function of the TXS02326AMRGER in a dual-SIM mobile handset?
The TXS02326AMRGER serves as a dual-supply SIM card multiplexer and level translator, enabling a single baseband processor UICC interface to drive two independent SIM cards operating at either 1.8 V (Class-C) or 2.95 V (Class-B). It manages power sequencing, interface arbitration, and automatic shutdown via BSI/SDN inputs - all critical for reliable dual-SIM operation in handheld devices. The TXS02326AMRGER integrates dual LDOs, I²C configuration, and 32-kHz timing to eliminate external components.
How does the TXS02326AMRGER handle SIM card voltage selection?
The TXS02326AMRGER provides independent 1.8-V or 2.95-V output selection for VSIM1 and VSIM2 via bits B1 and B5 in the SIM Interface Control Register (08h). Each LDO delivers up to 50 mA and accepts 2.3–5.5-V input from VBAT. This allows simultaneous support of mixed-voltage SIM cards - for example, a 1.8-V primary SIM and a 2.95-V backup SIM - without external regulators. The TXS02326AMRGER's voltage selection is fully software-configurable over I²C.
What role does the exposed thermal pad play in the TXS02326AMRGER QFN package?
The exposed thermal pad on the TXS02326AMRGER (RGE package) must be soldered to a PCB ground plane to ensure thermal stability, reduce junction temperature under load, and minimize EMI coupling into sensitive SIM signaling paths. TI documentation explicitly states this connection is mandatory - failure to do so risks thermal shutdown, signal integrity degradation, and non-compliance with ESD performance specifications. The TXS02326AMRGER's thermal pad is electrically connected to GND internally.
Can the TXS02326AMRGER support hot-swapping of SIM cards without system reset?
Yes, the TXS02326AMRGER supports hot-swapping through its programmable interface states (powered down, isolated, active) and auto-direction translation logic. When a SIM is removed, the BSI input detects battery disconnection and - if enabled - triggers a controlled shutdown sequence synchronized to the 32-kHz clock. The TXS02326AMRGER maintains baseband communication via IRQ and I²C during the event, allowing firmware to reinitialize the slot without resetting the entire system. This behavior is documented in the BSI debounce timing diagrams and status register definitions.
What is the purpose of the OE (Output Enable) pin on the TXS02326AMRGER?
The OE pin (Pin 19) on the TXS02326AMRGER controls data direction on the baseband-to-SIM I/O path. When OE is disabled (default), the device operates in auto-direction mode - detecting signal flow and enabling appropriate pull-ups/pull-downs dynamically. When enabled via bit B0 in the Device Control Register (0Eh), OE directly gates direction: logic level on OE determines whether data flows baseband→SIM or SIM→baseband. This gives firmware explicit control over bidirectional SIM I/O timing - critical for certain UICC protocol phases. The TXS02326AMRGER's OE function is configurable but not required for basic operation.
TXS02326AMRGER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Mobile Handsets
- Interface:
- I2C
- Voltage - Supply:
- 1.7V ~ 3.3V
- Supplier Device Package:
- 24-VQFN (4x4)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
TXS02326AMRGER FAQ
1.How can I place an order for TXS02326AMRGER through Aetrix?
Please submit a Request for Quotation (RFQ) for TXS02326AMRGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TXS02326AMRGER reliable?
The price and inventory of TXS02326AMRGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TXS02326AMRGER is usually 5 days.
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4.How is shipping managed for TXS02326AMRGER?
TXS02326AMRGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TXS02326AMRGER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TXS02326AMRGER?
For technical support, including TXS02326AMRGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TXS02326AMRGER requirements.
6.How does Aetrix verify that TXS02326AMRGER is sourced from the original manufacturer or authorized distributors?
All TXS02326AMRGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TXS02326AMRGER meets industry standards.
7.What is the process for return or replacement of TXS02326AMRGER?
All TXS02326AMRGER units undergo pre-shipment inspection (PSI). If there is an issue with TXS02326AMRGER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TXS02326AMRGER part is unused and in its original packaging.
Return procedure for TXS02326AMRGER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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