NXP Semiconductors UBA2024P/N1,112

Overview

UBA2024P/N1,112 from NXP Semiconductors is a monolithic high-voltage half-bridge power IC designed for compact fluorescent lamp (CFL) electronic ballasts operating from 230 V mains. It integrates dual MOSFETs (R_DS(on) = 9 Ω HS / 8.5 Ω LS), an adjustable internal oscillator (41.32 kHz typ), and a high-voltage level shifter rated to 550 V. The device delivers accurate 50 % duty cycle via internal divide-by-2 logic and supports up to 23 W lamp loads in self-ballasted CFL designs.

For engineers reviewing the UBA2024P/N1,112 datasheet, UBA2024P/N1,112 pinout, UBA2024P/N1,112 application, or UBA2024P/N1,112 equivalent, this page provides verified functional identity, DIP8 package mapping, confirmed sweep-mode preheat timing (0.35 s typ), integrated bootstrap diode, and validated alternative options for CFL driver redesigns requiring mains-compatible half-bridge control.

Technical Context

The UBA2024P/N1,112 implements a self-oscillating 555-timer-based architecture with external R_OSC/C_OSC tuning, where the oscillator output is divided by two to enforce precise 50 % bridge duty cycle. Its high-side driver incorporates a DC reset circuit with floating supply lockout (V_float(UVLO) = 4.2 V typ) and supports bootstrap operation up to 550 V on pin FS.

Start-up initiates when V_HV rises above 373 V, charging internal V_DD (12.5 V typ) and enabling soft-start via pin SW current (280 nA typ). Sweep mode then ramps bridge frequency from 2.5× nominal down to resonance-enabling filament preheat and reliable lamp ignition without external timing components.

Key Specifications

Pinout & Package

UBA2024P/N1,112 uses the SOT97-1 plastic dual in-line package (DIP8), 300 mil width, with 2.54 mm lead pitch and standard through-hole footprint. Pin 1 is index-marked; leads are tin-plated copper alloy per JEDEC MO-001.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge CFL driver applications.

Compared with UBA2024P/N1,112, the UBA2024AP/N1,112 offers higher current capability in the same DIP8 package for power scaling, while the UBA2024T/N1,112 provides identical functionality in a surface-mount SO14 variant-enabling automated manufacturing but requiring PCB layout change.

Availability

UBA2024P/N1,112 is available at Aetrix Electronics and suitable for compact fluorescent lamp ballasts, electronic self-ballasted CFL modules, and 230 V mains-powered residential lighting requiring stable component supply across multi-year production cycles.

Supply support for UBA2024P/N1,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The UBA2024 family was developed specifically for high-efficiency, low-component-count electronic ballasts targeting energy-efficient lighting systems compliant with international energy regulations.

FAQ

What is the maximum lamp power supported by UBA2024P/N1,112?

The UBA2024P/N1,112 is rated for CFL loads up to 23 W, provided the junction temperature remains within −40 °C to +150 °C. This limit is enforced by thermal characteristics (R_th(j-a) = 95 K/W) and internal current limits-exceeding 23 W risks thermal shutdown or reduced lifetime in continuous operation.

Does UBA2024P/N1,112 require an external low-voltage supply?

No. The UBA2024P/N1,112 derives its internal V_DD supply (12.5 V typ) directly from the HV pin using an integrated charge pump. No auxiliary winding, external regulator, or bias supply is needed-simplifying CFL ballast design and reducing component count.

How does the sweep function in UBA2024P/N1,112 improve lamp ignition reliability?

The UBA2024P/N1,112's sweep function ramps bridge frequency from 2.5× nominal down to resonance over 0.35 s (typ), preheating filaments and aligning switching with tank impedance minima. This avoids cold-start stress and ensures consistent ignition-even under low-temperature or aged-lamp conditions.

What is the purpose of the non-overlap time in UBA2024P/N1,112?

The UBA2024P/N1,112 enforces a fixed 1.35 μs non-overlap time between high-side and low-side transistor turn-off/on transitions. This prevents shoot-through current, reduces switching losses, and enhances robustness against layout-induced cross-conduction in CFL half-bridge topologies.

Can UBA2024P/N1,112 be used with 120 V mains supplies?

No. The UBA2024P/N1,112 is optimized for 230 V mains operation with 550 V HV pin rating. For 120 V applications, NXP specifies the UBA2024B variants (e.g., UBA2024BP/N1,112), which feature lower R_DS(on) and 300 V HV rating-ensuring safe operation and optimal efficiency at reduced input voltage.