Texas Instruments UCC2920DP

Overview

UCC2920DP from Texas Instruments is a –3V to –15V hot-swap power manager with integrated 0.1Ω power MOSFET, programmable electronic circuit breaker, and digital current limiting (0A–3A trip, 0A–4A max output). It delivers fault-protected power sequencing in telecom line cards and redundant power supplies.

For engineers reviewing the UCC2920DP datasheet, UCC2920DP pinout, UCC2920DP application, or UCC2920DP equivalent, key selection criteria include its –15V absolute VSS rating, 2% fixed fault duty cycle, CT-programmable on-time, IMAX logic-controlled current scaling, and SOIC-16 (DP) thermal package compatibility.

Technical Context

The UCC2920DP implements a digitally programmable overcurrent protection architecture using a 3-bit DAC for trip level selection (0–3A in discrete steps) and an IMAX pin to scale maximum sourcing current between 1A above trip level and full 4A. Fault timing is set by external capacitor CT, governing both fault-on duration (TFAULT = 28×10³·CT) and off-time (TSD = 1.67×10⁶·CT), yielding a fixed 2% average duty cycle under sustained fault.

It operates across –40°C to +85°C ambient, supports –3V to –15V input (VSS), integrates undervoltage lockout and thermal shutdown, and features open-drain FAULT output referenced to logic GND-enabling direct interface with 3.3V/5V control logic without level shifters.

Key Specifications

Pinout & Package

UCC2920DP uses a 16-pin SOIC Power (DP) package with internal thermal pad connected to VSS. Pins 4, 12, and 13 are no-connect. Level-shifting is fully internal-DAC, IMAX, and SHTDWN inputs accept standard 3.3V/5V logic levels referenced to GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hot-swap power management applications.

Compared with TPS23881RGER and LM5069MMX-2/NOPB, the UCC2920DP uniquely combines negative-rail operation (–15V), integrated MOSFET, digital trip programming, and hardware-enforced 2% fault duty cycle-making it optimal for cost-sensitive, single-channel –48V hot-swap applications without microcontroller coordination.

Availability

UCC2920DP is available at Aetrix Electronics and suitable for telecom line card protection, redundant DC power supply OR-ing, and industrial PLC backplane isolation requiring stable component supply despite its obsolete status through verified legacy channel inventory.

Supply support for UCC2920DP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The UCC2920DP belongs to TI's legacy Hot Swap™ power management product line, designed specifically for robust, self-contained circuit protection in negative-voltage DC distribution systems such as telecom central offices and industrial control backplanes.

FAQ

What is the operating temperature range for the UCC2920DP?

The UCC2920DP is specified for operation from –40°C to +85°C ambient temperature. This extended industrial range ensures reliable performance in telecom equipment cabinets and industrial control enclosures where ambient temperatures fluctuate significantly. The thermal shutdown circuit activates at junction temperatures exceeding +150°C, providing additional safety margin beyond the rated ambient range. All electrical parameters in the datasheet are guaranteed within this –40°C to +85°C window.

How does the UCC2920DP implement its 2% fault duty cycle?

The UCC2920DP achieves its fixed 2% fault duty cycle through internal timing circuitry tied to the external CT capacitor. When a fault occurs, CT charges at –36µA until reaching 1.5V (TFAULT), then discharges at +0.6µA to 0.5V (TSD). With TFAULT = 28×10³·CT and TSD = 1.67×10⁶·CT, the ratio TFAULT/(TFAULT + TSD) ≈ 0.02. This hardware-enforced behavior requires no external control or configuration-ensuring consistent thermal safety across all units and operating conditions.

Can the UCC2920DP be used with positive supply voltages?

No, the UCC2920DP is designed exclusively for negative-rail applications with VSS ranging from –3V to –15V. Its internal architecture-including level-shifted DAC, fault comparator, and MOSFET driver-is optimized for sinking current from a negative supply into a load referenced to GND. Applying positive voltage to VSS violates absolute maximum ratings and will damage the device. For positive-rail hot-swap applications, TI recommends alternatives such as the UCC2912 or TPS2388x family.

What is the purpose of the IMAX pin on the UCC2920DP?

The IMAX pin on the UCC2920DP selects between two maximum output current modes: when pulled low (<0.4V), IOUT(max) = ITRIP + 1A; when pulled high (>2.4V), IOUT(max) = 4A. This allows dynamic adaptation-e.g., using low-IMAX for precision current margining during diagnostics and high-IMAX for rapid charging of large output capacitors during system startup. The pin accepts standard TTL/CMOS logic levels referenced to GND, eliminating need for negative-voltage logic interfaces.

Is the UCC2920DP pin-compatible with the UCC3920DP?

Yes, the UCC2920DP and UCC3920DP share identical SOIC-16 (DP) pinouts, electrical connections, and functional block diagrams. The primary difference is operating temperature range: UCC2920DP is rated for –40°C to +85°C, while UCC3920DP is rated for 0°C to +70°C. Both devices use the same CT timing equations, DAC codes, and IMAX logic thresholds-enabling direct substitution in industrial designs where extended temperature capability is required.