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Texas Instruments UCD74106RGMT
- Part No.:
- UCD74106RGMT
- Manufacturer:
- Texas Instruments
- Package:
- 13-VFQFN Exposed Pad
- Datasheet:
-
UCD74106RGMT.pdf
- Description:
- IC REG BUCK 6A 13VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,235
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Product details
Overview
UCD74106RGMT from Texas Instruments is a monolithic synchronous-buck power stage IC integrating high-side and low-side NMOS drivers, gate drive supply (VGG), current sensing (IMON), thermal monitoring (TMON), fault protection (FLT/FLTRST), and PWM/SRE control logic. It delivers up to 6 A output current, operates from 4.5 V to 18 V input, supports switching frequencies up to 2 MHz, and targets digitally controlled point-of-load regulators in telecom and server applications.
For engineers reviewing the UCD74106RGMT datasheet, UCD74106RGMT pinout, UCD74106RGMT application, or UCD74106RGMT equivalent, key selection criteria include its integrated 6.25-V regulated VGG supply, ±5% current sense accuracy via IMON, 155°C thermal shutdown with 30°C hysteresis, 13-pin QFN package with exposed thermal pad, and compatibility with TI's UCD91xx/UCD92xx digital controllers.
Technical Context
The UCD74106RGMT implements a synchronous buck topology with dedicated high-side and low-side NMOS gate drivers, internally regulated 6.25-V VGG supply (or external bias down to 2.2 V), and programmable fault-handling modes via FLTRST pin configuration. Its drive logic supports two operational modes: synchronous mode (PWM controls both FETs with optimized dead time) and SRE-gated rectification.
Current sensing uses an integrated precision element with 4.32 µA/A gain and 22.1 µA zero-load offset on IMON, enabling bidirectional current reporting. Thermal sensing provides 10 mV/°C linear output from TMON with 750 mV offset at 25°C, triggering latch-off shutdown above 155°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | Up to 6 A continuous - supports compact POL converters for CPU/GPU core rails. |
| Input Voltage Range | 4.5 V to 18 V (internally regulated VGG); extends to 2.2 V with external bias - enables wide-input industrial and telecom systems. |
| Switching Frequency | DC to 2 MHz - allows optimization of inductor size vs. efficiency; validated at 1 MHz in typical applications. |
| Current Sense Accuracy | ±5% full-scale - ensures reliable overcurrent protection and precise load monitoring via IMON pin. |
| Thermal Shutdown Threshold | 155°C with 30°C hysteresis - prevents permanent die damage while enabling safe recovery without controller intervention. |
| VGG Supply | Internally regulated 6.25 V (±0.55 V) - optimizes NMOS RDS(on) conduction loss without external LDO. |
| Package | 13-pin QFN (RGM), 3 mm × 4 mm, 0.5 mm pitch, exposed thermal pad - supports high-power density PCB layouts with low θJA = 70.2°C/W. |
Pinout & Package
UCD74106RGMT is housed in a 13-pin QFN package (RGM) with 3 mm × 4 mm footprint, 0.5 mm pitch, and exposed thermal pad for enhanced thermal dissipation. The package is RoHS-compliant and designed for reflow soldering per JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BST | High-side driver bootstrap capacitor node | Connects 0.22 µF ceramic capacitor to SW; enables floating gate drive for high-side NMOS. |
| PWM | Digital control input | 3.3/5-V compatible Schmitt-trigger input; controls high-side turn-on and low-side timing in synchronous mode. |
| SRE | Synchronous rectifier enable | Configures low-side FET activation during PWM low phase; prevents cross-conduction with built-in dead-time logic. |
| FLT | Fault flag output | Open-drain 3.3-V signal asserted on overcurrent, overtemperature, or UVLO - latches off both FETs until cleared. |
| FLTRST | Fault reset mode select | Three-state pin (GND/BP3/open) defining FLT clear protocol: HiZ PWM, low PWM+SRE, or single PWM pulse. |
| IMON | Current monitor output | 4.32 µA/A proportional current source; 22.1 µA offset enables bidirectional (sourcing/sinking) current reporting. |
| TMON | Digital temperature sensor output | 10 mV/°C linear voltage with 750 mV offset at 25°C; pulls to BP3 during thermal shutdown. |
| VGG | Gate drive supply | 6.25-V internal regulator output (or external bias input); bypassed with 4.7 µF ceramic to PGND. |
| BP3 | 3.3-V internal LDO output | Powers internal logic; requires 1 µF ceramic bypass to AGND. |
| AGND | Analog ground reference | Separate ground return for IMON, TMON, BP3 - isolates analog sensing from power switching noise. |
| PGND | Power ground return | Common return path for high-current SW node, VGG bypass, and MOSFET sources/drains. |
| SW | Switching node | Connection point between high-side drain and low-side source; drives buck inductor and BST capacitor. |
| VIN | Main power input | Supplies driver circuitry and internal regulators; accepts 4.5–18 V (2.2 V with external VGG). |
Key Features
| Feature | Design Value |
|---|---|
| Fully integrated power stage | Combines high-side/low-side NMOS, drivers, VGG regulator, current sense, thermal sensor, and protection logic in one die - eliminates discrete gate driver + MOSFET layout complexity. |
| Dual-mode PWM/SRE control | Supports synchronous rectification (SRE = high) or diode emulation (SRE = low) - enables flexible efficiency optimization across load conditions. |
| Programmable fault response | Three FLTRST-configurable handshake protocols (HiZ PWM, low PWM+SRE, or single-pulse auto-clear) - simplifies integration with TI UCD9xxx controllers. |
| Bidirectional current monitoring | IMON pin provides 22.1 µA pedestal + 4.32 µA/A scaling - enables accurate reporting of both sourcing and sinking currents in multiphase or regenerative applications. |
| Thermal-aware shutdown | 155°C trip with 30°C hysteresis and TMON analog output - allows predictive thermal management and system-level temperature telemetry. |
Applications
| Telecom Point-of-Load Regulator | Server CPU Core Supply |
|---|---|
Use Scenario: Provides tightly regulated 1.2 V/6 A output from 12 V intermediate bus in 48 V telecom systems with strict transient response requirements. IC Role / Device Role / Timing Role: Synchronous-buck power stage delivering high-efficiency DC/DC conversion with digital controller interface (UCD9222) and real-time current/temperature telemetry. Use Value: Integrated current sense (±5% accuracy) and thermal monitoring (10 mV/°C) enable closed-loop load-line adjustment and dynamic thermal throttling without external sensors. | Use Scenario: Powers multi-core x86 processors in rack-mounted servers requiring fast transient response and high reliability under variable workloads. IC Role / Device Role / Timing Role: Digitally controlled buck stage synchronized to UCD9244 controller; handles 2-MHz switching with <15 ns dead-time control to minimize conduction losses. Use Value: 6.25-V VGG supply ensures optimal NMOS gate enhancement across 4.5–18 V input range, reducing RDS(on) and improving full-load efficiency by >2% vs. 5-V gate drive. |
| Notebook GPU Voltage Regulator | Industrial FPGA I/O Supply |
Use Scenario: Generates 0.8–1.1 V adaptive output for discrete GPUs in thin-and-light notebooks, constrained by board area and thermal envelope. IC Role / Device Role / Timing Role: Compact 3 mm × 4 mm QFN power stage with integrated thermal sensing (TMON) and fault flag (FLT) for direct connection to embedded microcontroller. Use Value: Exposed thermal pad and θJA = 70.2°C/W enable operation at 6 A without heatsink - reduces BOM count and improves system-level thermal margin. | Use Scenario: Supplies configurable 1.8/2.5/3.3 V I/O banks for Xilinx/Intel FPGAs in factory automation controllers with extended temperature requirements. IC Role / Device Role / Timing Role: Robust buck stage operating from 8–18 V industrial input; leverages UVLO (4.0 V ON / 3.8 V OFF) and 125°C junction rating for harsh environments. Use Value: IMON-based current limiting (7.5 A typical trip) provides precise overcurrent protection independent of external resistor tolerances - enhances long-term field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous-buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM5116PWPR | Controller-only (external MOSFETs), no integrated current sense or thermal monitor; requires external VGS bias and gate resistors. | Targeted at higher-power (>10 A), discrete-FET designs where layout flexibility and thermal separation are prioritized over integration. | Select LM5116PWPR when designing >10 A supplies with custom MOSFET selection, or when needing adjustable frequency beyond 2 MHz. |
| TPS53679RSBT | Single-chip 6-A buck converter with integrated inductor (SiP), fixed 500 kHz–1.5 MHz frequency, no IMON/TMON pins - lacks analog telemetry outputs. | Optimized for ultra-compact, low-risk designs where board space is critical and digital telemetry is unnecessary. | Choose TPS53679RSBT for rapid prototyping of space-constrained applications where analog monitoring is not required. |
Compared with LM5116PWPR and TPS53679RSBT, the UCD74106RGMT uniquely combines monolithic power stage integration, analog current/temperature telemetry (IMON/TMON), and programmable fault handling - making it optimal for digitally controlled, medium-power POL systems requiring real-time health monitoring and tight layout control.
Availability
UCD74106RGMT is available at Aetrix Electronics and suitable for telecom point-of-load regulators, server CPU core supplies, and notebook GPU voltage regulators requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for UCD74106RGMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-reliability industrial and communications ICs.
The UCD74106RGMT belongs to TI's Fusion Digital Power product line, engineered specifically for seamless interoperability with UCD91xx/UCD92xx controllers in high-efficiency, digitally managed DC/DC power stages.
FAQ
What is the maximum continuous output current supported by the UCD74106RGMT?
The UCD74106RGMT supports up to 6 A of continuous output current under recommended operating conditions (VIN = 4.5 V to 18 V, TJ ≤ 125°C, proper PCB thermal design). This rating assumes use of the internal 6.25-V VGG supply and adequate heatsinking via the exposed thermal pad. Derating applies at elevated ambient temperatures or reduced airflow.
How does the UCD74106RGMT handle overcurrent faults?
The UCD74106RGMT detects overcurrent via its integrated current sense element and asserts the FLT pin when load current exceeds 7.5 A (typical trip threshold). Upon fault detection, both high-side and low-side MOSFETs are immediately latched off. Fault clearance depends on FLTRST pin configuration - options include HiZ PWM, low PWM+SRE, or a single PWM pulse - enabling flexible coordination with TI UCD9xxx controllers.
Can the UCD74106RGMT operate with input voltages below 4.5 V?
Yes, the UCD74106RGMT can operate with input voltages as low as 2.2 V when an external gate drive voltage is supplied to the VGG pin. Below 4.5 V, the internal VGG regulator is disabled, and the user must provide a stable 4.5–6.2 V bias to ensure proper NMOS gate enhancement. Absolute maximum VGG remains 7 V regardless of source.
What is the function of the IMON pin on the UCD74106RGMT?
The IMON pin on the UCD74106RGMT provides a current-source output proportional to low-side MOSFET current, with a gain of 4.32 µA/A and a 22.1 µA zero-load offset. When terminated with a 22.6-kΩ resistor to AGND, it generates a voltage representing total load current - including bidirectional flow - enabling precise current monitoring and overcurrent protection in the UCD74106RGMT-based power stage.
Does the UCD74106RGMT include thermal protection, and how does it behave?
Yes, the UCD74106RGMT includes thermal protection that triggers at 155°C junction temperature, asserting FLT and halting switching. Recovery occurs when the die cools below 125°C (30°C hysteresis). The TMON pin provides real-time analog temperature telemetry (10 mV/°C, 750 mV offset at 25°C), allowing external controllers to implement predictive thermal management before shutdown occurs.
UCD74106RGMT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 13-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- -
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 4.5V
- Voltage - Input (Max):
- 18V
- Voltage - Output (Min/Fixed):
- -
- Voltage - Output (Max):
- -
- Current - Output:
- 6A
- Frequency - Switching:
- Up to 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 13-VQFN (3x3)
UCD74106RGMT FAQ
1.How can I place an order for UCD74106RGMT through Aetrix?
Please submit a Request for Quotation (RFQ) for UCD74106RGMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UCD74106RGMT reliable?
The price and inventory of UCD74106RGMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCD74106RGMT is usually 5 days.
3.What payment methods are accepted for UCD74106RGMT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCD74106RGMT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UCD74106RGMT?
UCD74106RGMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UCD74106RGMT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UCD74106RGMT?
For technical support, including UCD74106RGMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCD74106RGMT requirements.
6.How does Aetrix verify that UCD74106RGMT is sourced from the original manufacturer or authorized distributors?
All UCD74106RGMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCD74106RGMT meets industry standards.
7.What is the process for return or replacement of UCD74106RGMT?
All UCD74106RGMT units undergo pre-shipment inspection (PSI). If there is an issue with UCD74106RGMT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UCD74106RGMT part is unused and in its original packaging.
Return procedure for UCD74106RGMT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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